Abstract: An embodiment of the present disclosure is a method for forming a substrate. The method includes applying an aqueous solution of nanoparticle precursors to an assembly of fibers, wherein the nanoparticle precursors include a metal salt and a reducing agent. The method also includes drying the assembly of fibers with thermal energy in a continuous operation to form the substrate, thereby drying gives rise to metal nanoparticles in the substrate. The metal nanoparticles have a size that ranges from 1 to about 200 nanometers in at least one dimension.

Abstract: In accordance with the present invention, there are provided novel conductive adhesives and methods for the preparation thereof. In another aspect, the present invention provides novel conductive inks and methods for the preparation thereof. In yet another aspect, the present invention provides novel die attach films and methods for the preparation thereof. In still another aspect, the present invention provides novel die attach pastes and methods for the preparation thereof.

Abstract: A steam cooker with a first pot and a second pot is provided. The second pot may fit within the first pot and may be suspended above the bottom of the first pot. The bottom of the first pot may be filled with water. Food may be placed within the second pot. A lid may cover the first pot, sealing the water and the second pot within. The first pot may be heated by a fire or stove. The steam from the heated water may sufficiently cook the food. Further, condensation may be collected and water may drip into the second pot. The water is purified due to the boiling process.

Abstract: A steam cooker with a first pot and a second pot is provided. The second pot may fit within the first pot and may be suspended above the bottom of the first pot. The bottom of the first pot may be filled with water. Food may be placed within the second pot. A lid may cover the first pot, sealing the water and the second pot within. The first pot may be heated by a fire or stove. The steam from the heated water may sufficiently cook the food. Further, condensation may be collected and water may drip into the second pot. The water is purified due to the boiling process.

Abstract: A method for filling through hole interconnects in a substrate used in the manufacture of electronic devices uses a film filler material. The film comprises a resin matrix filled with conductive and/or dielectric particles, and can be a single or multi-layer film. The method comprises providing a substrate for an electronic device having one or more through hole interconnects; providing a film comprising at least one film filler material for the through hole interconnects; deposing the film filler material over the substrate; and pressing the film filler material into the through hole interconnects.

Abstract: Compacting apparatus (10) for waste material defines a feed space (14), in which material (16) for compacting is received in use, and a pressing chamber (16). The apparatus includes a moving assembly (40) for moving material from the feed space into the pressing chamber, a pressing member (20) movable within the pressing chamber to move material in use out of the pressing chamber, and a shearing arrangement (70, 72) for shearing the material as it moves out of the pressing chamber.

Abstract: Compacting apparatus (10) for waste material defines a feed space (14), in which material (16) for compacting is received in use, and a pressing chamber (16). The apparatus includes moving means (40) for moving material from the feed space into the pressing chamber, a pressing member (20) movable within the pressing chamber to move material in use out of the pressing chamber, and shear means (70, 72) for shearing the material as it moves out of the pressing chamber.

Abstract: A rain gutter cleaning system of the invention comprises a generally planar panel, or two generally planar panels, movably secured to the bottom of the gutter. The rain gutter cleaning system includes a hinge securing one end of the generally planar panel to the gutter. One generally planar panel is normally disposed in a first position. In this first position, the generally planar panel is adjacent to, and generally parallel to, the gutter. The generally planar panel may be moved to second position. In this second position, the generally planar panel is pivotally spaced apart from the gutter.

Abstract: A communications link for a cellular communications system (10) includes a first airplane (35) for flying in a first pattern (86) and including a first antenna for transmitting RF beams (92) to form a first footprint (96) on a first target geographic area (98) to provide cellular phone users (18) within the footprint with a first communications link. A second airplane (35?) flies in a second pattern (86) and includes a second antenna for transmitting RF beams (92) to form a second footprint (96) on a second target geographic area (98) to provide cellular phone users (18) within the second footprint with a second communications link. The first and second airplanes each fly at an altitude that is below a high altitude level and that is varied to enable continuous uninterrupted coverage to be provided to a service area below in a weather pattern-independent and geographic feature-independent manner.

Abstract: Resveratrol, a component of a variety of common edible plants, including peanuts and red grapes, is a phytoestrogen. Resveratrol inhibits proliferation of skin epidermal cells (keratinocytes) and stimulates their differentiation. Resveratrol was also found to inhibit melanin production by skin cells and to alleviate skin irritation that may be caused by alpha-hydroxy acids. Resveratrol is useful in improving the appearance of wrinkled, lined, dry, flaky, aged or photodamaged skin and improving skin thickness, elasticity, flexibility, radiance, glow and plumpness.

Abstract: A microelectronic assembly (10) includes an integrated circuit die (12) mounted onto a substrate (14) by solder bump interconnections (32). The die (12) and the substrate (14) are spaced apart by a gap (30) that is filled with a polymeric encapsulant (16). The die (12) includes a die perimeter (24) and a face (27) facing away from the substrate (14). A polymeric reinforcement (18) is disposed onto the die face (27) to protect the die (12) and to reduce the effects of thermally induced stresses on the die (12) and the solder bump interconnections (32). The polymeric reinforcement (18) is spaced apart from the die perimeter (24) to maintain a desired peripheral fillet geometry of the encapsulant (16).