Abstract: In accordance with the present invention, there are provided novel conductive adhesives and methods for the preparation thereof. In another aspect, the present invention provides novel conductive inks and methods for the preparation thereof. In yet another aspect, the present invention provides novel die attach films and methods for the preparation thereof. In still another aspect, the present invention provides novel die attach pastes and methods for the preparation thereof.

Abstract: A steam cooker with a first pot and a second pot is provided. The second pot may fit within the first pot and may be suspended above the bottom of the first pot. The bottom of the first pot may be filled with water. Food may be placed within the second pot. A lid may cover the first pot, sealing the water and the second pot within. The first pot may be heated by a fire or stove. The steam from the heated water may sufficiently cook the food. Further, condensation may be collected and water may drip into the second pot. The water is purified due to the boiling process.

Abstract: A steam cooker with a first pot and a second pot is provided. The second pot may fit within the first pot and may be suspended above the bottom of the first pot. The bottom of the first pot may be filled with water. Food may be placed within the second pot. A lid may cover the first pot, sealing the water and the second pot within. The first pot may be heated by a fire or stove. The steam from the heated water may sufficiently cook the food. Further, condensation may be collected and water may drip into the second pot. The water is purified due to the boiling process.

Abstract: A method for filling through hole interconnects in a substrate used in the manufacture of electronic devices uses a film filler material. The film comprises a resin matrix filled with conductive and/or dielectric particles, and can be a single or multi-layer film. The method comprises providing a substrate for an electronic device having one or more through hole interconnects; providing a film comprising at least one film filler material for the through hole interconnects; deposing the film filler material over the substrate; and pressing the film filler material into the through hole interconnects.

Abstract: A rain gutter cleaning system of the invention comprises a generally planar panel, or two generally planar panels, movably secured to the bottom of the gutter. The rain gutter cleaning system includes a hinge securing one end of the generally planar panel to the gutter. One generally planar panel is normally disposed in a first position. In this first position, the generally planar panel is adjacent to, and generally parallel to, the gutter. The generally planar panel may be moved to second position. In this second position, the generally planar panel is pivotally spaced apart from the gutter.