Abstract: A system for transporting and inspecting, seriatim, semiconductor devices with plural prong type or solder ball type leads includes a head for transporting the semiconductor devices from one support structure, such as a tray or tube, to a second support structure, such as a tray or tape, and wherein two dimensional and three dimensional measurements of the positional accuracy of the leads is carried out during the transport process. The inspection apparatus is interposed in the transport path and includes a first optical sensor such as a CCD camera oriented to capture a two dimensional image of the semiconductor device package and compare the image with a predetermined two dimensional image store in a central processing unit (CPU).