Abstract: An ultrasound acoustic assembly includes a number of ultrasound acoustic arrays, each array comprising an acoustic stack comprising a piezoelectric layer assembled with at least one acoustic impedance dematching layer and with a support layer. The acoustic stack defines a number of dicing kerfs and a number of acoustic elements, such that the dicing kerfs are formed between neighboring ones of the acoustic elements. The dicing kerfs extend through the piezoelectric layer and through the acoustic impedance dematching layer(s) but extend only partially through the support layer. The ultrasound acoustic assembly further includes a number of application specific integrated circuit (ASIC) die. Each ultrasound acoustic array is coupled to a respective ASIC die to form a respective acoustic-electric transducer module. Methods of manufacture are also provided.

Abstract: An ultrasound acoustic assembly includes a number of ultrasound acoustic arrays, each array comprising an acoustic stack comprising a piezoelectric layer assembled with at least one acoustic impedance dematching layer and with a support layer. The acoustic stack defines a number of dicing kerfs and a number of acoustic elements, such that the dicing kerfs are formed between neighboring ones of the acoustic elements. The dicing kerfs extend through the piezoelectric layer and through the acoustic impedance dematching layer(s) but extend only partially through the support layer. The ultrasound acoustic assembly further includes a number of application specific integrated circuit (ASIC) die. Each ultrasound acoustic array is coupled to a respective ASIC die to form a respective acoustic-electric transducer module. Methods of manufacture are also provided.

Abstract: An ultrasound system is provided for imaging an object. The ultrasound system includes an ultrasound probe for acquiring ultrasound data and a cooling subsystem for actively removing heat from the ultrasound probe. The cooling subsystem includes a pump disposed within a reservoir containing a coolant and configured to circulate the coolant through the ultrasound probe via a conduit.

Abstract: An ultrasound system is provided for imaging an object. The ultrasound system includes an ultrasound probe for acquiring ultrasound data and a cooling subsystem for actively removing heat from the ultrasound probe. The cooling subsystem includes a pump disposed within a reservoir containing a coolant and configured to circulate the coolant through the ultrasound probe via a conduit.

Abstract: An ultrasound system including an ultrasound probe, which has an ultrasonic transducer and a physical sensor adapted to sense engagement with a subject to be scanned by the ultrasonic transducer. The ultrasound system also includes a control system coupled to the ultrasound probe.

Abstract: A device comprising an array of sensors built on or in a substrate with a semiconducting surface and means for isolating each sensor element from its neighbors. In the case where the sensors are ultrasonic transducer elements, acoustic isolation is provided in the form of trenches between neighboring transducer elements to reduce acoustic crosstalk. The trenches may be filled with acoustically attenuative material. Electrical isolation in the form of semiconductive junctions is provided between neighboring transducer elements to reduce electrical crosstalk. In one example, back-to-back pn junction diodes are formed by ion implantation in zones located between neighboring transducer elements. These types of isolation can be employed alone or together.

Abstract: A metal cooling tube of a water-cooled nuclear reactor, having an inner surface thereof exposed to an aqueous cooling medium containing hydrogen peroxide. The cooling tube has its inner surface coated with matter selected from the group consisting of the element manganese, molybdenum, zinc, copper, cadmium for absorbing such hydrogen peroxide and then affecting decomposition of the hydrogen peroxide in the aqueous medium. In preferred embodiment such coating is manganese and oxides thereof. A method for lowering the electrochemical corrosion potential of a metal allow cooling tube exposed to an aqueous medium in a water-cooled nuclear reactor is also disclosed. Such method comprises the step of coating an inner surface of such tube with matter selected from the group of elements comprising manganese, molybdenum, zinc, copper, cadmium, so as to permit absorption and hydrogen peroxide in such aqueous medium and effect decomposition of hydrogen peroxide in such aqueous medium.

Abstract: To determine electrical resistance of an ohmic contact between a flexible printed circuit and a metallized layer upon a substrate of piezoelectric material, the printed circuit is provided with two exposed metal pads, in close proximity to each other, and two electrical leads from each pad to locations on the printed circuit that are accessible for probing with a four-lead resistance meter. For measurement of contact resistance in process development and process capability studies, many sets of such pads, of a variety of sizes, may be combined into a single printed circuit. For in-process monitoring of transducer manufacturing, a small number of contact resistance measurement pads may be designed into production printed circuits.

Abstract: A metal cooling tube of a water-cooled nuclear reactor, having an inner surface thereof exposed to an aqueous cooling medium containing hydrogen peroxide. The cooling tube has its inner surface coated with matter selected from the group consisting of the element manganese, molybdenum, zinc, copper, cadmium for absorbing such hydrogen peroxide and then affecting decomposition of the hydrogen peroxide in the aqueous medium. In preferred embodiment such coating is manganese and oxides thereof. A method for lowering the electrochemical corrosion potential of a metal allow cooling tube exposed to an aqueous medium in a water-cooled nuclear reactor is also disclosed. Such method comprises the step of coating an inner surface of such tube with matter selected from the group of elements comprising manganese, molybdenum, zinc, copper, cadmium, so as to permit absorption and hydrogen peroxide in such aqueous medium and effect decomposition of hydrogen peroxide in such aqueous medium.

Abstract: A metal cooling tube of a water-cooled nuclear reactor, having an inner surface thereof exposed to an aqueous cooling medium containing hydrogen peroxide. The cooling tube has its inner surface coated with matter selected from the group consisting of the element manganese, molybdenum, zinc, copper, cadmium for absorbing such hydrogen peroxide and then affecting decomposition of the hydrogen peroxide in the aqueous medium. In preferred embodiment such coating is manganese and oxides thereof. A method for lowering the electrochemical corrosion potential of a metal allow cooling tube exposed to an aqueous medium in a water-cooled nuclear reactor is also disclosed. Such method comprises the step of coating an inner surface of such tube with matter selected from the group of elements comprising manganese, molybdenum, zinc, copper, cadmium, so as to permit absorption and hydrogen peroxide in such aqueous medium and effect decomposition of hydrogen peroxide in such aqueous medium.

Abstract: A method for reducing the corrosion potential of steel vessels and piping used in nuclear reactors, in particular steel vessels and piping carrying high temperature water and/or steam which has a concentration of oxygen therein. A metal hydride is added to the water, the hydrogen of such metal hydride combining with oxidizing agents, typically oxygen, present in the water to reduce the concentration of such oxidizing agents. In the preferred embodiment the metal of the metal hydride is a metal that is capable of reacting with oxygen to form a substantially non-water soluble and substantially electrically insulating compound on the surface of the steel, and in particular is one that may react with and become deposited or incorporated into a pre-existing thin oxide film layer on the surface of the steel to thereby render such thin oxide layer substantially non-electrically conducting.