Abstract: An electronic component with insulative tape-held solder forms is disclosed. Electronic components may be any of the integrated circuit chips, chip packages and printed circuit boards. The solder forms are coupled to conductive pads of the electronic component through through-holes in the insulative tape. The solder forms may be shaped as balls, cylinders, polygonal boxes, barrels, or hour-glasses. The insulative tape is thermally conductive and heat resistant. The tape may be made of an organic material such as an elastomer. The tape may further have impregnated materials such as ceramic, aluminum nitride, or solder flux to improve its thermal, mechanical, and/or electrical properties.

Abstract: A roll of tape with solder forms and methods for transferring the solder forms only or both the solder forms and portions of the tape to electronic components are disclosed. Electronic components may be any of integrated circuit chips, chip packages and printed circuit boards. Transferring solder forms to electronic components is a two-step process: (a) the solder forms are positioned and placed on a roll of tape off-line and (b) the solder forms on the roll of tape are transferred to the electronic components in an assembly line. The solder forms may be temporarily or permanently attached to the tape. In the first instance, only the solder forms are transferred. In the latter instance, tape portions are transferred to the electronic components with the solder forms. The solder forms may be attached to one side of the tape or in through-holes in the tape using either UV sensitive adhesives or cold adhesives such as solder flux.

Abstract: An optical system is described consisting of reflection birefringent light valves, polarizing beam splitter, color image combining prisms, illumination system having a light tunnel, projection lens, filters for color and contrast control, and screen placed in a configuration offering advantages for a high resolution color display.

Abstract: The subject invention provides a method of treating benign prostatic hyperplasia in a subject which comprises administering to the subject a therapeutically effective amount of a compound which binds to a human .alpha..sub.1C adrenergic receptor with a binding affinity greater than ten-fold higher than the binding affinity with which the compound binds to a human .alpha..sub.1A adrenergic receptor, a human .alpha..sub.1B adrenergic receptor, a human histamine H.sub.1 receptor and .alpha..sub.2 adrenergic receptor. The subject invention also provides a method of inhibiting contraction of prostate tissue which comprises contacting the prostate tissue with an effective contraction-inhibiting amount of such compound.

Abstract: This invention relates to novel aromatic amine compounds having the structure: ##STR1## where each W, Z.sup.1 and Z.sup.2 is independently H, C.sub.1 -C.sub.6 alkyl, C.sub.1 -C.sub.6 alkoxy, OH, F, Cl, Br, I, NO.sub.2, CN, SO.sub.2 NHR.sup.3, NR.sup.4.sub.2, CONR.sup.3.sub.2, COR.sup.5 ; where each R.sup.1 and R.sup.2 is independently H, C.sub.1 -C.sub.6 straight or branched chain alkyl or phenyl; where each X and Y is independently CH.sub.2, NR.sup.4, S, S.dbd.O, SO.sub.2 ; where n is 0, 1 or 2; where each p and q is independently 1 or 2; where R.sup.3 is H, C.sub.1 -C.sub.6 straight or branched chain alkyl or phenyl; where R.sup.4 is H, C.sub.1 -C.sub.6 straight or branched chain alkyl or COR.sup.3 ; and where R.sup.5 is H, C.sub.1 -C.sub.6 straight or branched chain alkyl or phenyl, C.sub.1 -C.sub.6 straight or branched chain alkoxy or OH.

Abstract: A roll of tape with solder forms and methods for transferring the solder forms only or both the solder forms and portions of the tape to electronic components are disclosed. Electronic components may be any of integrated circuit chips, chip packages and printed circuit boards. Transferring solder forms to electronic components is a two-step process: (a) the solder forms are positioned and placed on a roll of tape off-line and (b) the solder forms on the roll of tape are transferred to the electronic components in an assembly line. The solder forms may be temporarily or permanently attached to the tape. In the first instance, only the solder forms are transferred. In the latter instance, tape portions are transferred to the electronic components with the solder forms. The solder forms may be attached to one side of the tape or in through-holes in the tape using either UV sensitive adhesives or cold adhesives such as solder flux.

Abstract: A method of treating benign prostatic hyperplasia in a subject which comprises administering to the subject a therapeutically effective amount of a compound which binds to a human .alpha..sub.1C adrenergic receptor with a binding affinity greater than ten-fold higher than the binding affinity with which the compound binds to a human .alpha..sub.1A adrenergic receptor, a human .alpha..sub.1B adrenergic receptor, and a human histamine H.sub.1 receptor, and, binds to a human .alpha..sub.2 adrenergic receptor with a binding affinity which is greater than ten-fold lower than the binding affinity with which the compound binds to such .alpha..sub.1C adrenergic receptor. Compounds meeting these criteria are provided.

Abstract: A lens system for a laser scanning apparatus which incorporates two transfer lenses in tandem. The transfer lenses include angular reflecting mirrors, correction lenses, and concave mirrors. The transfer lenses are located between the projection mask and the target of the scanning apparatus wherein the laser beam passed through the projection mask is reflected by an angularly disposed mirror through the first correction lens onto the first concave mirror where it is reflected back through the first correction lens and onto another angularly disposed mirror where the beam is sent to and back from the second concave mirror through the second correction lens and then onto the target.

Abstract: Structure is disclosed for the ablation of material by the use of a laser beam wherein the laser provides a beam which is directed through an illumination and projection optical system for imaging on the material which is to be ablated. In the present invention the peak power of the laser beam is adjustable. The laser beam peak power adjustment structure includes a laser that provides a pulsed beam. The laser beam is directed into a beam splitter wherein the laser beam is split into two beam components. The first beam component passes through beam splitter with negligible or no delay, then passes through a quarter waveplate and impinges on a first mirror which reflects it back to the beam splitter. The second beam component is directed at an angle of 90 degrees by the beam splitter and toward a second mirror. The second mirror is at a predetermined distance from the beam splitter which introduces a total predetermined delay for the reflected second beam component as it is directed back to the beam splitter.