Abstract: Techniques and devices related to power adapters for mobile devices and, in particular, small form factor power adapters that allow a voltage droop during a power pulse exceeding a maximum output of the power adapter are discussed. For example, a small form factor and low voltage power adapter may include an adapter output power protection control that limits an output of the power adapter in response to a power pulse exceeding a maximum output of the power adapter.

Abstract: Particular embodiments described herein provide for an electronic device, such as a notebook computer or laptop, that includes a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include means for establishing a first electrical connection between a first base and a lid portion; and means for establishing a second electrical connection between a second base and the lid portion. The lid portion is removably coupled to a selected one of the first base and the second base.

Abstract: Techniques and devices related to power adapters for mobile devices and, in particular, small form factor power adapters that allow a voltage droop during a power pulse exceeding a maximum output of the power adapter are discussed. For example, a small form factor and low voltage power adapter may include an adapter output power protection control that limits an output of the power adapter in response to a power pulse exceeding a maximum output of the power adapter.

Abstract: Particular embodiments described herein provide for an electronic device, such as a notebook computer or laptop, that includes a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include means for establishing a first electrical connection between a first base and a lid portion; and means for establishing a second electrical connection between a second base and the lid portion. The lid portion is removably coupled to a selected one of the first base and the second base.

Abstract: A keyboard is to be designed as a standardized keyboard having a certain length, width and thickness. The keyboard may be used interchangeably among different mobile computer systems. A keyboard cable associated with the keyboard may be designed such that it can accommodate an interface connector at any location relative to a bottom end of the keyboard. One or more control devices may also be used in conjunction with the keyboard. The control device may be designed with standardized dimensions, electrical interface, interface connector and cable length to enable it to accompany the keyboard among the different mobile computer systems.

Abstract: According to one embodiment, a system is disclosed. The system includes a chassis including a plurality of hardware components and a system board having a central processing unit (CPU). The system board is adaptable to be mounted with common interface features within the chassis with the CPU facing the bottom of the chassis or with the CPU facing away from the bottom of the chassis. Other embodiments may be described.

Abstract: According to one embodiment, a system is disclosed. The system includes a chassis including a printed circuit board (PCB) and a battery pack. The battery pack includes a connector to enable the battery pack to couple to a PCB which is mounted either above the centerline of the battery pack connector and on or below the centerline of the battery pack power connector.

Abstract: A thermal management device includes a thermally conductive core, a thermally conductive frame positioned around the core, the frame defining at least one opening, and at least one thermally conductive insert disposed in the opening in the frame.

Abstract: A thermal management device includes a thermally conductive core, a thermally conductive frame positioned around the core, the frame defining at least one opening, and at least one thermally conductive insert disposed in the opening in the frame.

Abstract: A device is disclosed herein for engaging and disengaging electrical connector halves, particularly electrical connector halves mounted on printed assembly boards that are to be electrically connected to a back plane. The device provides a drive train mechanism comprised of a plurality of gears and racks that, when attached, act to reduce the insertion force required to make the electrical connector halves disposed on the printed board assemblies and the back plane. A further aspect of the present invention involves the method of attaching a back plane to at least one stationary printed board assembly by actuation of a drive train.

Abstract: A processor retention assembly is disclosed. An embodiment of the processor retention assembly includes a first dual processor retention module and a second dual processor retention module. A connecting member is attached to the first dual processor retention module at a first end and is attached to the second dual processor retention module at a second end. In accordance with another embodiment of the present invention, covers are hingedly attached to each of the first and second dual processor retention modules.

Abstract: A device is disclosed herein for engaging and disengaging electrical connector halves, particularly electrical connector halves mounted on printed assembly boards that are to be electrically connected to a back plane. The device provides a drive train mechanism comprised of a plurality of gears and racks that, when attached, act to reduce the insertion force required to make the electrical connector halves disposed on the printed board assemblies and the back plane. A further aspect of the present invention involves the method of attaching a back plane to at least one stationary printed board assembly by actuation of a drive train.

Abstract: A method and apparatus for supporting within a chassis enclosure a plurality of microprocessors, each operably coupled to a heat sink, includes mounting within the chassis enclosure one or more retention brackets, each retention bracket adapted to receive at least one microprocessor and a cover engaged about the top of at least one microprocessor, the cover being releasably fastenable to the retention bracket, and further including the coupling together of multiple retention brackets to form a bridge-like assembly.