Abstract: A cold drink container vending machine having a front window panel through which cold drinks in serpentine tracks can be viewed for selection. Pre-cooled cold drink container holding racks are aligned with the serpentine tracks so that the pre-cooled containers can be viewed when vendable containers in the serpentine tracks are depleted. Continuous advertisement is provided in the form of the cold drink containers themselves which are viewed through the transparent front window panel.

Abstract: A process for fabricating an X-ray spectrometer having imaging and energy resolution of X-ray sources. The spectrometer has an array of adjoining rectangularly shaped detector cells formed in a silicon body. The walls of the cells are created by laser drilling holes completely through the silicon body and diffusing n.sup.+ phosphorous doping material therethrough. A thermally migrated aluminum electrode is formed centrally through each of the cells.

Abstract: A gallium arsenide photo-responsive device (40) is provided with an intermediate, transparent layer (28) of refractory metal or alkaline earth metal forming a tenacious bond between a non-hydroscopic oxide layer (24) and a noble metal Schottky barrier layer (30). The device has a gallium arsenide substrate with a predetermined type conductivity and a gallium arsenide epitaxial layer (16) with the same type conductivity but a lower charge carrier concentration grown on the substrate. The oxide layer (24) is formed to cover the epitaxial layer (16) and the transparent metal layer (28) followed by the noble metal layer (30) are deposited upon the oxide layer. An interdigitated ohmic contact (32) is then formed upon the noble metal layer.

Abstract: An X-ray spectrometer for providing imaging and energy resolution of an X-ray source comprised of a thick silicon wafer (10) having an embedded matrix or grid of aluminum completely through the wafer fabricated, for example, by thermal migration. The aluminum matrix defines the walls (16, 18) of a rectangular array of silicon X-ray detector cells (14) or "pixels". A thermally diffused aluminum electrode (20) is also formed centrally through each of the silicon cells (14) with biasing means (22, 26, 28) being connected to the aluminum cell walls (16, 18) and the centralized aluminum electrode (20) for causing lateral charge carrier depletion between the cell walls so that incident X-ray energy causes a photo-electric reaction within the silicon producing collectible charge carriers in the form of electrons which are collected and used for imaging.

Abstract: A double level metal interconnection structure and process for making same are disclosed, wherein an etch-stop layer is formed on the first metal layer to prevent over-etching thereof when forming the second level metal line in a via hole in an insulating layer thereover, by means of reactive plasma etching. The etch-stop layer is composed of chromium and the reactive plasma etching is carried out with a halocarbon gas.

Abstract: An improved mask fabrication process is disclosed which may be broadly applied to ion-implantation, reactive plasma etching, or the etching of semiconductor structures. The process is based upon the deposition onto an oxide coated or bare semiconductor surface, of a first photoresist layer having formed therein a plurality of windows and which is hardened by a wet chemical technique so as to have an increased resistance to dissolution in solvents. A second photoresist layer is deposited over the surface and windows of the first layer and a subplurality of windows are formed therein over selected windows in the first photoresist layer so as to selectively block a portion of the plurality of windows in the first layer. This composite mask invention may then be employed to carry out an ion-implantation step, wet etching step or reactive plasma etching step on the oxide or semiconductor surface exposed through composite windows.

Abstract: A double level metal interconnection structure and process for making same are disclosed, wherein an etch-stop layer is formed on the first metal layer to prevent over-etching thereof when forming the second level metal line in a via hole in an insulating layer thereover, by means of reactive plasma etching. The etch-stop layer is composed of chromium and the reactive plasma etching is carried out with a halocarbon gas.