Patents by Inventor George E. Hickok

George E. Hickok has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for locating solder bumps on semiconductor chips or chip carriers
    Patent number: 5694482
    Abstract: An automated vision system for identifying patterns, such as the solder bump patterns or leads of electronic components. The system is capable of correctly identifying the deviations of an imaged pattern from the nominal location of a reference pattern even if the imaged features are displaced more than half the minimum distance between any two adjacent features of the reference pattern. Further, the system is not limited to identifying patterns that have been merely translated relative to the reference pattern, but can be used if the imaged pattern has been rotated more than 45.degree. relative to the reference pattern depending on the symmetry of the pattern.
    Type: Grant
    Filed: January 6, 1997
    Date of Patent: December 2, 1997
    Assignee: Universal Instruments Corporation
    Inventors: Ferevdoun Maali, Leonard J. Poch, George E. Hickok