Abstract: A multilayer ceramic integrated circuit packaging substrate provides a plurality of integrated circuit operating voltages at the integrated circuit mounting surface thereof without requiring a separate input/output pin and internal power distribution plane for every integrated circuit operating voltage. The substrate includes a power via for supplying a first integrated circuit operating voltage at the integrated circuit mounting surface, and a plurality of voltage converting means on the integrated circuit mounting surface for stepping down the first operating voltage to all other requisite operating voltages. The voltage converting means may be resistors or operational amplifier voltage dividers.

Abstract: A method and apparatus for forming multilayer ceramic substrates from large area ceramic green sheets, each having an array of layer sites thereon, by serially aligning each individual layer site with respect to a die cavity and punching the aligned layer site into the die cavity to thereby stack the requisite number of aligned layer sites. Individual layer site alignment ensures that each layer site is aligned with respect to the die cavity so that the dimensional tolerances between layer sites on the large area green sheet are eliminated. Thus, as large a green sheet as is cost effective may be employed, notwithstanding the fact that dimensional distortions on the large area green sheet would preclude alignment of corresponding layer site vias on superimposed large area green sheets.

Abstract: An inspection system for detecting the presence of debris on ceramic green sheets prior to screening. The sheets are deposited on a planar stage using a pick-up head. The pick-up head carries a sensor to determine whether or not debris adhering to the head, the sheet or the stage is presenting a non-planar sheet surface.

Abstract: An improved interposer punch apparatus including a plurality of elongated punch elements, a head slidably supporting the punch elements, means to urge the punch elements in an extended position, a stripper plate, and a base for supporting a substrate to be punched with apertures for receiving the lower ends of the punch elements, the imrovement being a means in said base for forcibly displacing slugs of material punched from a substrate from the ends of the punch elements following a punching operation.

Abstract: A process for monitoring solvent content in a ceramic green sheet wherein the green sheet is partially supported so that a portion of the sheet is free to sag under the influence of gravity, with or without any additional force to enhance or minimize the sag, measuring the rate of sag of the portion of the sheet free to sag, and comparing the rate of sag to a correlation standard of rate of sag versus solvent content of the green sheet under test to determine acceptability.

Abstract: A method of fabricating an improved multi-layer ceramic substrate for mounting semiconductor devices having a low incidence of cracks between metal filled surface vias, the substrate constructed with a top ceramic layer having a thickness that is at least 20 percent greater than the underlying sheets that embody a redistribution system.

Abstract: An improved multi-layer ceramic substrate for mounting semiconductor devices having a low incidence of cracks between metal filled surface vias, the substrate constructed with a top ceramic layer having a thickness that is at least 20 percent greater than the underlying sheets that embody a redistribution system.