Abstract: This invention relates to aqueous electroless nickel plating solutions, and more particularly, to nickel plating solutions based on nickel salts of alkyl sulfonic acids as the source of nickel ions. The plating solutions utilize, as a reducing agent, hypophosphorous acid or bath soluble salts thereof selected from sodium hypophosphite, potassium hypophosphite and ammonium hypophosphite. The electroless nickel plating solutions of the invention are free of added nickel hypophosphite, and free of alkali or alkaline earth metal ions capable of forming an insoluble orthophosphite.

Abstract: This invention relates to aqueous electroless nickel plating solutions, and more particularly, to nickel plating solutions based on nickel salts of alkyl sulfonic acids as the source of nickel ions. The plating solutions utilize, as a reducing agent, hypophosphorous acid or bath soluble salts thereof selected from sodium hypophosphite, potassium hypophosphite and ammonium hypophosphite. The electroless nickel plating solutions of the invention are free of added nickel hypophosphite, and free of alkali or alkaline earth metal ions capable of forming an insoluble orthophosphite.

Abstract: Functional chromium and chromium-alloy deposits are obtained from an electroplating solution having substantially the composition: 22 g/l Cr.sup.+3 ; 250 g/l KCl; 63 g/l H.sub.3 BO.sub.3 ; 30 g/l HCO.sub.2.sup.= ; 15 g/lKBr; and 120 ppm of a wetting agent. The plating solution provides improved efficiency, stress values and appearance over the prior art, and is tolerant of metallic iron and ionic iron and ammonium.