Abstract: An automatic wafer prober is interfaced with any one of a number of different die testers by storing in memory associated with the wafer prober a plurality of sets of data there being one set of data for each of a plurality of different die testers to be interfaced to the prober. Each set of data defines at least the sense (polarity) of a plurality of test result output signals derived from the particular die tester to be interfaced with the prober. The proper set of stored data is selected by the operator, such as by a digital switch, and a microprocessor employs the selected set of data for modifying the sense of the test result output signals derived from the die tester as fed into the wafer prober so that the die tester output signals as fed into the wafer prober are the same for any one of the plurality of different die tester. In a preferred embodiment, the microprocessor generates a test start signal which is outputted from the prober to the die tester.