Patents by Inventor George Erskine

George Erskine has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6815959
    Abstract: A pin configured to be disposed within a probe is provided. The probe may be configured to measure a property of a conductive layer. The pin may include a contact surface which may be substantially planar. The pin may also include a first portion extending from the contact surface. A cross-sectional area of the first portion, in a direction substantially parallel to the contact surface, may be substantially equal to a surface area of the contact surface across a length of the first portion. A system configured to measure a property of a conductive layer is also provided. The system may include a mounting device and at least two probes coupled to the mounting device. The probes may be configured to measure the property of a conductive layer. In addition, the mounting device may be configured such that one of the probes may contact the conductive layer during measurement.
    Type: Grant
    Filed: April 9, 2002
    Date of Patent: November 9, 2004
    Assignee: KLA-Tencor Technologies Corp.
    Inventors: Walter H. Johnson, Torsten Borchers, Daniel Griffing, Andrei Danet, George Erskine
  • Publication number: 20030060092
    Abstract: A pin configured to be disposed within a probe is provided. The probe may be configured to measure a property of a conductive layer. The pin may include a contact surface which may be substantially planar. The pin may also include a first portion extending from the contact surface. A cross-sectional area of the first portion, in a direction substantially parallel to the contact surface, may be substantially equal to a surface area of the contact surface across a length of the first portion. A system configured to measure a property of a conductive layer is also provided. The system may include a mounting device and at least two probes coupled to the mounting device. The probes may be configured to measure the property of a conductive layer. In addition, the mounting device may be configured such that one of the probes may contact the conductive layer during measurement.
    Type: Application
    Filed: April 9, 2002
    Publication date: March 27, 2003
    Inventors: Walter H. Johnson, Torsten Borchers, Daniel Griffing, Andrei Danet, George Erskine