Abstract: A multi-band electronically scanned array antenna including a first sub-assembly having electronic circuits for a first frequency band; a second sub-assembly mechanically coupled to the first sub-assembly and having electronic circuits for a second frequency band; and an aperture adjacent to the first sub-assembly, the aperture being shared by the first sub-assembly and the second sub-assembly. The array antenna may further include a band switching circuit, or a combining circuit for coupling the first sub-assembly or the second sub-assembly to the aperture. The array antenna may also include a third sub-assembly including electronic circuits for a third frequency band. In this way, the aperture is shared by the first sub-assembly, the second sub-assembly, and the third sub-assembly to provide a smaller and lighter array antenna.

Abstract: According to one embodiment, an antenna apparatus includes first and second antenna arrays configured in a support structure. Each antenna array has multiple antenna elements that transmit and/or receive electro-magnetic radiation. The elements of the first antenna array are oriented in a boresight direction that is different from the boresight direction in which the elements of the second antenna array are oriented. A plurality of switches alternatively couples the first antenna elements or the second antenna elements to a signal distribution circuit.

Abstract: A multi-band electronically scanned array antenna including a first sub-assembly having electronic circuits for a first frequency band; a second sub-assembly mechanically coupled to the first sub-assembly and having electronic circuits for a second frequency band; and an aperture adjacent to the first sub-assembly, the aperture being shared by the first sub-assembly and the second sub-assembly. The array antenna may further include a band switching circuit, or a combining circuit for coupling the first sub-assembly or the second sub-assembly to the aperture. The array antenna may also include a third sub-assembly including electronic circuits for a third frequency band. In this way, the aperture is shared by the first sub-assembly, the second sub-assembly, and the third sub-assembly to provide a smaller and lighter array antenna.

Abstract: A system for stabilizing an electronic array includes at least one component having a notch and at least one stabilizing bar. The stabilizing bar comprises a first pair of contact points. The at least one stabilizing bar is positioned upon the at least one component such that the first pair of points deform against the at least one component below the notch.

Abstract: According to one embodiment, an antenna apparatus includes first and second antenna arrays configured in a support structure. Each antenna array has multiple antenna elements that transmit and/or receive electro-magnetic radiation. The elements of the first antenna array are oriented in a boresight direction that is different from the boresight direction in which the elements of the second antenna array are oriented. A plurality of switches alternatively couples the first antenna elements or the second antenna elements to a signal distribution circuit.

Abstract: A system for stabilizing an electronic array includes at least one component having a notch and at least one stabilizing bar. The stabilizing bar comprises a first pair of contact points. The at least one stabilizing bar is positioned upon the at least one component such that the first pair of points deform against the at least one component below the notch.

Abstract: An apparatus includes a heat receiving portion which receives heat within a footprint from a heat generating structure, and a cooling arrangement which causes flow of a coolant that absorbs heat at the heat receiving portion, the cooling arrangement being disposed in its entirety within a width of the footprint in a particular direction. A different feature involves an apparatus which includes a heat receiving portion at which a coolant receives heat, and a coolant separating portion which receives coolant traveling away from the heat receiving portion, and which separates liquid coolant from vapor coolant.

Abstract: An apparatus includes a heat receiving portion which receives heat within a footprint from a heat generating structure, and a cooling arrangement which causes flow of a coolant that absorbs heat at the heat receiving portion, the cooling arrangement being disposed in its entirety within a width of the footprint in a particular direction. A different feature involves an apparatus which includes a heat receiving portion at which a coolant receives heat, and a coolant separating portion which receives coolant traveling away from the heat receiving portion, and which separates liquid coolant from vapor coolant.

Abstract: According to an embodiment of the present invention, a thermal management system for electronic components includes a plastic coldplate having a mounting surface for mounting one or more electronic components, one or more passageways configured to have a fluid flow therethrough disposed within the plastic coldplate, and a highly conductive material disposed within the plastic coldplate and thermally coupled to the mounting surface. The highly conductive material is operable to transfer heat from the mounting surface to the fluid flow.

Abstract: According to an embodiment of the present invention, a thermal management system for electronic components includes a plastic coldplate having a mounting surface for mounting one or more electronic components, one or more passageways configured to have a fluid flow therethrough disposed within the plastic coldplate, and a highly conductive material disposed within the plastic coldplate and thermally coupled to the mounting surface. The highly conductive material is operable to transfer heat from the mounting surface to the fluid flow.

Abstract: An apparatus includes a heat receiving portion which receives heat within a footprint from a heat generating structure, and a cooling arrangement which causes flow of a coolant that absorbs heat at the heat receiving portion, the cooling arrangement being disposed in its entirety within a width of the footprint in a particular direction. A different feature involves an apparatus which includes a heat receiving portion at which a coolant receives heat, and a coolant separating portion which receives coolant traveling away from the heat receiving portion, and which separates liquid coolant from vapor coolant.

Abstract: A tail fin assembly for a guided projectile which is capable of withstanding the high pressures experienced during launch, which is also capable of stabilizing the projectile during initial flight shortly after emergence from the cannon or large gun barrel and which is also capable of freely spinning relative to the projectile front section for the remainder of the flight to minimize projectile roll to accomplish all of these capabilities sequentially during a single launch. The assembly includes the projectile and a rotatable member, preferably a tail fin assembly with tail fins which is rotatable about the projectile major axis and which is normally locked against rotation about the projectile. A locking structure is provided for locking the rotatable member against the rotation which is responsive to a predetermined condition to permit rotation of the rotatable member about the projectile.