Abstract: A light-emitting diode (LED) printhead has associated therewith a gradient index fiber lens array for collecting light from the LED's and focussing same onto a photosensitive surface for recording. The fiber lens array includes a segment that is spaced in overlying relationship to the printhead and has a series of optical fibers for conveying light generally parallel with the plane of the LED's. Various configurations of inputs to said array are described for collecting light from the LED's. The relationship between the array and the printhead provides for a narrow construction allowing space for other recording components to fit more readily about the photosensitive surface.

Abstract: Disclosed is a breakage resistant semiconductor wafer and a method for the fabrication thereof. Intersecting grooves are formed on one side of the wafer to facilitate ultimate subdivision thereof. A portion, such as a peripheral portion, of the wafer remains ungrooved. The ungrooved portion substantially increases the strength of the wafer and prevents premature breakage. When it is desired to subdivide the wafer, laser scribe lines are formed on the opposite side of the wafer in registry with the grooves. In an alternate embodiment the second side of the wafer is also grooved. However, the grooves on the second side of the wafer traverse the entirety thereof.