Patents by Inventor George F. Wilkinson, Jr.

George F. Wilkinson, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4580188
    Abstract: The continuity of a ground strap (16) is tested by pushing down on a switch activating toggle lever (37). The toggle lever is conductive, is isolated from ground and is coupled to a signal input terminal of a test circuit module (14). Thus, when the hand of the operator touches the toggle lever to activate the test circuit module (14), the resistive path through the operator and the ground strap (16) is coupled into the test circuit as the input-terminal-to-ground resistor of a voltage divider circuit. A resulting voltage at the toggle lever causes an indication by lighting either indicator (33) or indicator (34) whether the operator is properly coupled to ground.
    Type: Grant
    Filed: September 28, 1984
    Date of Patent: April 1, 1986
    Assignee: AT&T Technologies, Inc.
    Inventors: David F. Brown, Joseph L. Jones, Livio R. Melatti, David C. Sullivan, George F. Wilkinson, Jr.
  • Patent number: 4437229
    Abstract: A hybrid integrated circuit package (11) typically includes a circuit substrate or article (12) on which are formed thin film components (17, 18, 19) of a circuit (22) and to which is bonded at least one semiconductor chip (21). Prior to bonding the chip (21) to the article (12) the circuit (22) undergoes various tests and adjustment operations. An electric element, preferably a resistance element (36), is formed on the article (12). The element (36) is functionally independent of the circuit (22) on the article (12). A first, initial value of the element (36) marks the article (12) as belonging to a first group of articles having first circuit characteristics. The initial value of the element (36) is selectively altered to a second value upon a determination that the article (12) has circuit characteristics other than those of the first group. In the described preferred embodiment the first group is a group of electrically acceptable articles (12), while other characteristics are those of defective articles.
    Type: Grant
    Filed: May 24, 1982
    Date of Patent: March 20, 1984
    Assignee: Western Electric Company, Inc.
    Inventors: Joel R. Bitler, Michael W. Bodnar, Raymond H. Booth, Daniel J. Roman, Fred J. Schneider, Philip W. Seitzer, George F. Wilkinson, Jr.
  • Patent number: 4344064
    Abstract: A Hybrid Integrated Circuit package (11) typically includes a circuit substrate or article (12) on which are formed thin film components (17, 18, 19) of a circuit (22) and to which is bonded at least one semiconductor chip (21). Prior to bonding the chip (21) to the article (12) the circuit (22) undergoes various tests and adjustment operations. An electric element, preferably a resistance element (36), is formed on the article (12). The element (36) is functionally independent of the circuit (22) on the article (12). A first, initial value of the element (36) marks the article (12) as belonging to a first group of articles having first circuit characteristics. The initial value of the element (36) is selectively altered to a second value upon a determination that the article (12) has circuit characteristics other than those of the first group. In the described preferred embodiment the first group is a group of electrically acceptable articles (12), while other characteristics are those of defective articles.
    Type: Grant
    Filed: December 6, 1979
    Date of Patent: August 10, 1982
    Assignee: Western Electric Co., Inc.
    Inventors: Joel R. Bitler, Michael W. Bodnar, Raymond H. Booth, Daniel J. Roman, Fred J. Schneider, Philip W. Seitzer, George F. Wilkinson, Jr.