Abstract: A heat spreader to be molded into an encapsulated IC package in contact with a die attach pad carrying an IC die is adapted to be placed in a substantially rectangular mold cavity and to retain its position in the cavity while encapsulation material is injected. The heat spreader has a body portion with appendages extending toward each of the four walls, and the ends of the appendages furthest from the body are formed downward such as by bending to provide a support for the spreader from the bottom surface of the mold cavity substantially at the lines where the sidewalls meet the bottom surface of the mold cavity. In a preferred embodiment there are two appendages toward each sidewall, and the heat spreader before and during the molding process is supported from the bottom surface of the mold cavity by dimples through the body, forming additional supports.

Abstract: A method and apparatus for supporting a sensor in a vehicle in a manner to properly orient the axis of sensitivity of the sensor includes a lead frame having a substantially planar base portion with a plurality of leads extending from opposing ends thereof. The lead frame comprises a support plate portion extending perpendicularly from the base portion. A sensor and optional integrated circuit chip are mounted on the support plate portion. The lead frame further includes at least one support leg extending angularly between the base portion and support plate portion for rigidly supporting the support plate portion with respect to the base portion. Accordingly, a sensor, such as an accelerometer, may be positioned in the vehicle in a position mounted perpendicularly with respect to the mounting surface of the assembly in the vehicle for properly orienting the axis of sensitivity of the sensor.

Abstract: An integrated-circuit package assembly includes a separate silicon substrate to which an integrated-circuit die is fixed. The separate silicon substrate serves as a heat spreader for the integrated-circuit die. The separate silicon substrate to which the integrated-circuit die is fixed is packaged in either a molded package body or a cavity-type package body. For the molded package body, the package body is molded around a leadframe, the integrated-circuit die, and the separate silicon substrate to which the integrated-circuit die is fixed. For a molded package body, the leadframe has bonding fingers formed at the inward ends thereof which are attached to the separate silicon substrate or the lead frame may have a die-attach pad to which is fixed the separate silicon substrate. For the cavity-type package, the package body includes a mounting surface formed adjacent to a cavity formed therein and the mounting surface has the separate silicon substrate fixed to the top surface thereof.

Abstract: An improved packaging technique for packaging a thermally-enhanced, molded-plastic quad flat package (TE-QFP). An integrated-circuit die is attached to a thermally conductive, electrically-insulated substrate having a stepped area formed into the outer margins thereof. A lead frame has inwardly-extending fingers, which are attached to the stepped areas in the outer margins of the thermally conductive, electrically-insulated substrate. The stepped area centers the thermally conductive, electrically-insulated substrate and attached integrated-circuit die within the mold cavity so that the flow of plastic material is balanced over the top and bottom of the substrate to provide a molded package body substantially free of voids.