Abstract: Apparatus is provided for the automated handling and testing of semiconductor electronic modules which are stored in successive slots along the length of a magazine or container. The magazine is moved lengthwise in step-wise fashion and indexed to cause each module to assume in succession a position over an electrical connector. The connector is mechanically moved to make electrical contact with the electrical connector of the module. The module is thereby connected to an electrical test set which tests the module and provides a signal indicating whether the module has passed or failed and the module is so marked. The modules sequence through the test procedure until all have been tested, at which time the magazine is returned to its initial position.