Patents by Inventor George H Corrigan, III
George H Corrigan, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11912024Abstract: A print component integrated circuitry package includes a number of temperature sensors where each of the plurality of the temperature sensors is disposed in a corresponding temperature region of an integrated circuitry. In an example, an analog sense bus conductively connects to all of the plurality of temperature sensors and an external sensor pad that is to connect to a corresponding print controller contact.Type: GrantFiled: September 23, 2022Date of Patent: February 27, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: Michael W. Cumbie, James Michael Gardner, Scott A. Linn, George H. Corrigan, III
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Patent number: 11666910Abstract: In one example in accordance with the present disclosure, a microfluidic device is described. The microfluidic device includes a reservoir to contain a first thermally expandable fluid, a first heater to heat the thermally expandable fluid in the reservoir, a channel extending from the reservoir and connected to the reservoir at a first opening, and a liquid volume obstructing the channel.Type: GrantFiled: November 26, 2018Date of Patent: June 6, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Daryl E. Anderson, George H. Corrigan, III, Alexander Govyadinov
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Publication number: 20230018474Abstract: A print component integrated circuitry package includes a number of temperature sensors where each of the plurality of the temperature sensors is disposed in a corresponding temperature region of an integrated circuitry. In an example, an analog sense bus conductively connects to all of the plurality of temperature sensors and an external sensor pad that is to connect to a corresponding print controller contact.Type: ApplicationFiled: September 23, 2022Publication date: January 19, 2023Inventors: Michael W. Cumbie, James Michael Gardner, Scott A. Linn, George H. Corrigan, III
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Patent number: 11479036Abstract: A print component integrated circuitry package includes a number of temperature sensors where each of the plurality of the temperature sensors is disposed in a corresponding temperature region of an integrated circuitry. In an example, an analog sense bus conductively connects to all of the plurality of temperature sensors and an external sensor pad that is to connect to a corresponding print controller contact.Type: GrantFiled: February 6, 2019Date of Patent: October 25, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Michael W. Cumbie, James Michael Gardner, Scott A. Linn, George H. Corrigan, III
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Publication number: 20220073964Abstract: The present disclosure relates to nucleic acid detection devices. The nucleic detection device can include a microfluidic architecture to receive biological fluid, a multimodal sensor bundle, a common transmission line to transmit an enhanced current signal generated by combining current signals from individual sensors, and a current to voltage converter to receive and convert the enhanced current signal to voltage. The multimodal sensor bundle can be positioned to interact with the biological fluid when present within the microfluidic architecture. The multimodal sensor bundle can include multiple types of sensors selected from an electrochemical sensor, an optical sensor, or a potentiometric sensor. Individual sensors of the multimodal sensor bundle independently can generate a current signal in response to interaction with the biological fluid.Type: ApplicationFiled: March 7, 2019Publication date: March 10, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventor: George H. Corrigan, III
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Publication number: 20210354457Abstract: A print component integrated circuitry package includes a number of temperature sensors where each of the plurality of the temperature sensors is disposed in a corresponding temperature region of an integrated circuitry. In an example, an analog sense bus conductively connects to all of the plurality of temperature sensors and an external sensor pad that is to connect to a corresponding print controller contact.Type: ApplicationFiled: February 6, 2019Publication date: November 18, 2021Inventors: Michael W. Cumbie, James Michael Gardner, Scott A. Linn, George H. Corrigan, III
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Patent number: 11097272Abstract: According to an example, a microfluidic apparatus may include a fluid slot and a foyer that is in fluid communication with the fluid slot via a channel having a relatively smaller width than the foyer. The microfluidic apparatus may also include an electrical sensor to measure a change in an electrical field caused by a particle of interest in a fluid passing through the channel from the fluid slot to the foyer, an actuator to apply pressure onto fluid contained in the foyer, and a controller to receive the measured change in the electrical field from the electrical sensor, determine, from the received change in the electrical field, an electrical signature of the particle of interest, and control the actuator to control movement of the particle of interest based upon the determined electrical signature of the particle of interest.Type: GrantFiled: July 26, 2016Date of Patent: August 24, 2021Assignee: Hewlett-Packard Development Company, L.P.Inventors: Chantelle Domingue, Tod Woodford, Manish Giri, Matthew David Smith, George H Corrigan, III, Masoud Zavarehi, Joshua M. Yu
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Publication number: 20210178385Abstract: In one example in accordance with the present disclosure, a microfluidic device is described. The microfluidic device includes a reservoir to contain a first thermally expandable fluid, a first heater to heat the thermally expandable fluid in the reservoir, a channel extending from the reservoir and connected to the reservoir at a first opening, and a liquid volume obstructing the channel.Type: ApplicationFiled: November 26, 2018Publication date: June 17, 2021Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Daryl E. Anderson, George H. Corrigan III, Alexander Govyadinov
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Patent number: 10876986Abstract: The present disclosure is drawn to an insulated sensor including a silicon substrate with active circuitry on a surface thereof, an electrode disposed on the silicon substrate, a passivation layer having a thickness from greater than 500 Angstroms to 3,000 Angstroms disposed on the active circuitry, and an electrode insulating layer having a thickness from 10 Angstroms to 500 Angstroms disposed on the electrode.Type: GrantFiled: October 5, 2016Date of Patent: December 29, 2020Assignee: Hewlett-Packard Development Company, L.P.Inventors: George H. Corrigan, III, Chantelle Domingue, Sadiq Bengali
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Patent number: 10589522Abstract: A fluidic die may include a number of actuators. The number of actuators form a number of primitives. The fluidic die may include a digital-to-analog converter (DAC) to drive a number of the delay circuits. The delay circuits delay a number of activation pulses that activate the actuators associated with the primitives to reduce peak power demands of the fluidic die. A number of delay circuits may be coupled to each primitive.Type: GrantFiled: April 9, 2018Date of Patent: March 17, 2020Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Scott A. Linn, George H. Corrigan, III, Michael W. Cumbie
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Publication number: 20190285564Abstract: The present disclosure is drawn to an insulated sensor including a silicon substrate with active circuitry on a surface thereof, an electrode disposed on the silicon substrate, a passivation layer having a thickness from greater than 500 Angstroms to 3,000 Angstroms disposed on the active circuitry, and an electrode insulating layer having a thickness from 10 Angstroms to 500 Angstroms disposed on the electrode.Type: ApplicationFiled: October 5, 2016Publication date: September 19, 2019Applicant: Hewlett-Packard Development Company, L.P.Inventors: George H. CORRIGAN, III, Chantelle DOMINGUE, Sadiq BENGALI
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Patent number: 10378946Abstract: In some examples, a method of sensing an ink level includes applying a pre-charge voltage to a sense capacitor to charge the sense capacitor with a charge, sharing the charge between the sense capacitor and a reference capacitor, causing a reference voltage at a gate of an evaluation transistor, and determining a resistance from a drain to a source of the evaluation transistor that results from the reference voltage.Type: GrantFiled: February 2, 2017Date of Patent: August 13, 2019Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Ning Ge, Trudy Benjamin, Teck-Khim Neo, Joseph M. Torgerson, Neel Banerjee, George H. Corrigan, III
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Publication number: 20190210025Abstract: According to an example, a microfluidic apparatus may include a fluid slot and a foyer that is in fluid communication with the fluid slot via a channel having a relatively smaller width than the foyer. The microfluidic apparatus may also include an electrical sensor to measure a change in an electrical field caused by a particle of interest in a fluid passing through the channel from the fluid slot to the foyer, an actuator to apply pressure onto fluid contained in the foyer, and a controller to receive the measured change in the electrical field from the electrical sensor, determine, from the received change in the electrical field, an electrical signature of the particle of interest, and control the actuator to control movement of the particle of interest based upon the determined electrical signature of the particle of interest.Type: ApplicationFiled: July 26, 2016Publication date: July 11, 2019Inventors: Chantelle DOMINGUE, Tod WOODFORD, Manish GIRI, Matthew David SMITH, George H CORRIGAN III, Masoud ZAVAREHI, Joshua M. YU
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Publication number: 20190016127Abstract: A fluidic die may include a number of actuators. The number of actuators form a number of primitives. The fluidic die may include a digital-to-analog converter (DAC) to drive a number of the delay circuits. The delay circuits delay a number of activation pulses that activate the actuators associated with the primitives to reduce peak power demands of the fluidic die. A number of delay circuits may be coupled to each primitive.Type: ApplicationFiled: April 9, 2018Publication date: January 17, 2019Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Scott A. Linn, George H. Corrigan III, Michael W. Cumbie
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Patent number: 10082414Abstract: In some examples, an ink level sensor includes a sense capacitor between a first node and ground, a first switch to couple a first voltage to the first node and charge the sense capacitor, a second switch to couple the first node with a second node and share the charge between the sense capacitor and a reference capacitor, causing a second voltage at the second node, and a transistor having a drain, a gate coupled to the second node, and a source coupled to ground, the transistor to provide a drain to source resistance in proportion to the second voltage.Type: GrantFiled: February 2, 2017Date of Patent: September 25, 2018Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Ning Ge, Trudy Benjamin, Teck-Khim Neo, Joseph M. Torgerson, Neel Banerjee, George H. Corrigan, III
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Patent number: 10022962Abstract: A fluidic die may include a number of actuators. The number of actuators form a number of primitives. The fluidic die may include a digital-to-analog converter (DAC) to drive a number of the delay circuits. The delay circuits delay a number of activation pulses that activate the actuators associated with the primitives to reduce peak power demands of the fluidic die. A number of delay circuits may be coupled to each primitive.Type: GrantFiled: August 1, 2017Date of Patent: July 17, 2018Assignee: Hewlett-Packard Development Company, L.P.Inventors: Scott A. Linn, George H. Corrigan, III, Michael W. Cumbie
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Patent number: 9969157Abstract: A fluidic die may include a number of actuators. The number of actuators form a number of primitives. The fluidic die may include a digital-to-analog converter (DAC) to drive a number of the delay circuits. The delay circuits delay a number of activation pulses that activate the actuators associated with the primitives to reduce peak power demands of the fluidic die. A number of delay circuits may be coupled to each primitive.Type: GrantFiled: August 1, 2017Date of Patent: May 15, 2018Assignee: Hewlett-Packard Development Company, L.P.Inventors: Scott A. Linn, George H. Corrigan, III, Michael W. Cumbie
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Publication number: 20170146383Abstract: In some examples, an ink level sensor includes a sense capacitor between a first node and ground, a first switch to couple a first voltage to the first node and charge the sense capacitor, a second switch to couple the first node with a second node and share the charge between the sense capacitor and a reference capacitor, causing a second voltage at the second node, and a transistor having a drain, a gate coupled to the second node, and a source coupled to ground, the transistor to provide a drain to source resistance in proportion to the second voltage.Type: ApplicationFiled: February 2, 2017Publication date: May 25, 2017Inventors: Ning Ge, Trudy Benjamin, Teck-Khim Neo, Joseph M. Torgerson, Neel Banerjee, George H. Corrigan, III
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Publication number: 20170144451Abstract: In some examples, a method of sensing an ink level includes applying a pre-charge voltage to a sense capacitor to charge the sense capacitor with a charge, sharing the charge between the sense capacitor and a reference capacitor, causing a reference voltage at a gate of an evaluation transistor, and determining a resistance from a drain to a source of the evaluation transistor that results from the reference voltage.Type: ApplicationFiled: February 2, 2017Publication date: May 25, 2017Inventors: Ning Ge, Trudy Benjamin, Teck-Khim Neo, Joseph M. Torgerson, Neel Banerjee, George H. Corrigan, III
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Patent number: 9599500Abstract: In an embodiment, a method of sensing an ink level includes applying a pre-charge voltage Vp to a sense capacitor to charge the sense capacitor with a charge Q1, sharing Q1 between the sense capacitor and a reference capacitor, causing a reference voltage Vg at the gate of an evaluation transistor, and determining a resistance from drain to source of the evaluation transistor that results from Vg.Type: GrantFiled: June 27, 2011Date of Patent: March 21, 2017Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Ning Ge, Trudy Benjamin, Teck-Khim Neo, Joseph M. Torgerson, Neel Banerjee, George H. Corrigan, III