Patents by Inventor George H Corrigan, III

George H Corrigan, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11912024
    Abstract: A print component integrated circuitry package includes a number of temperature sensors where each of the plurality of the temperature sensors is disposed in a corresponding temperature region of an integrated circuitry. In an example, an analog sense bus conductively connects to all of the plurality of temperature sensors and an external sensor pad that is to connect to a corresponding print controller contact.
    Type: Grant
    Filed: September 23, 2022
    Date of Patent: February 27, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W. Cumbie, James Michael Gardner, Scott A. Linn, George H. Corrigan, III
  • Patent number: 11666910
    Abstract: In one example in accordance with the present disclosure, a microfluidic device is described. The microfluidic device includes a reservoir to contain a first thermally expandable fluid, a first heater to heat the thermally expandable fluid in the reservoir, a channel extending from the reservoir and connected to the reservoir at a first opening, and a liquid volume obstructing the channel.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: June 6, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Daryl E. Anderson, George H. Corrigan, III, Alexander Govyadinov
  • Publication number: 20230018474
    Abstract: A print component integrated circuitry package includes a number of temperature sensors where each of the plurality of the temperature sensors is disposed in a corresponding temperature region of an integrated circuitry. In an example, an analog sense bus conductively connects to all of the plurality of temperature sensors and an external sensor pad that is to connect to a corresponding print controller contact.
    Type: Application
    Filed: September 23, 2022
    Publication date: January 19, 2023
    Inventors: Michael W. Cumbie, James Michael Gardner, Scott A. Linn, George H. Corrigan, III
  • Patent number: 11479036
    Abstract: A print component integrated circuitry package includes a number of temperature sensors where each of the plurality of the temperature sensors is disposed in a corresponding temperature region of an integrated circuitry. In an example, an analog sense bus conductively connects to all of the plurality of temperature sensors and an external sensor pad that is to connect to a corresponding print controller contact.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: October 25, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W. Cumbie, James Michael Gardner, Scott A. Linn, George H. Corrigan, III
  • Publication number: 20220073964
    Abstract: The present disclosure relates to nucleic acid detection devices. The nucleic detection device can include a microfluidic architecture to receive biological fluid, a multimodal sensor bundle, a common transmission line to transmit an enhanced current signal generated by combining current signals from individual sensors, and a current to voltage converter to receive and convert the enhanced current signal to voltage. The multimodal sensor bundle can be positioned to interact with the biological fluid when present within the microfluidic architecture. The multimodal sensor bundle can include multiple types of sensors selected from an electrochemical sensor, an optical sensor, or a potentiometric sensor. Individual sensors of the multimodal sensor bundle independently can generate a current signal in response to interaction with the biological fluid.
    Type: Application
    Filed: March 7, 2019
    Publication date: March 10, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventor: George H. Corrigan, III
  • Publication number: 20210354457
    Abstract: A print component integrated circuitry package includes a number of temperature sensors where each of the plurality of the temperature sensors is disposed in a corresponding temperature region of an integrated circuitry. In an example, an analog sense bus conductively connects to all of the plurality of temperature sensors and an external sensor pad that is to connect to a corresponding print controller contact.
    Type: Application
    Filed: February 6, 2019
    Publication date: November 18, 2021
    Inventors: Michael W. Cumbie, James Michael Gardner, Scott A. Linn, George H. Corrigan, III
  • Patent number: 11097272
    Abstract: According to an example, a microfluidic apparatus may include a fluid slot and a foyer that is in fluid communication with the fluid slot via a channel having a relatively smaller width than the foyer. The microfluidic apparatus may also include an electrical sensor to measure a change in an electrical field caused by a particle of interest in a fluid passing through the channel from the fluid slot to the foyer, an actuator to apply pressure onto fluid contained in the foyer, and a controller to receive the measured change in the electrical field from the electrical sensor, determine, from the received change in the electrical field, an electrical signature of the particle of interest, and control the actuator to control movement of the particle of interest based upon the determined electrical signature of the particle of interest.
    Type: Grant
    Filed: July 26, 2016
    Date of Patent: August 24, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chantelle Domingue, Tod Woodford, Manish Giri, Matthew David Smith, George H Corrigan, III, Masoud Zavarehi, Joshua M. Yu
  • Publication number: 20210178385
    Abstract: In one example in accordance with the present disclosure, a microfluidic device is described. The microfluidic device includes a reservoir to contain a first thermally expandable fluid, a first heater to heat the thermally expandable fluid in the reservoir, a channel extending from the reservoir and connected to the reservoir at a first opening, and a liquid volume obstructing the channel.
    Type: Application
    Filed: November 26, 2018
    Publication date: June 17, 2021
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Daryl E. Anderson, George H. Corrigan III, Alexander Govyadinov
  • Patent number: 10876986
    Abstract: The present disclosure is drawn to an insulated sensor including a silicon substrate with active circuitry on a surface thereof, an electrode disposed on the silicon substrate, a passivation layer having a thickness from greater than 500 Angstroms to 3,000 Angstroms disposed on the active circuitry, and an electrode insulating layer having a thickness from 10 Angstroms to 500 Angstroms disposed on the electrode.
    Type: Grant
    Filed: October 5, 2016
    Date of Patent: December 29, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: George H. Corrigan, III, Chantelle Domingue, Sadiq Bengali
  • Patent number: 10589522
    Abstract: A fluidic die may include a number of actuators. The number of actuators form a number of primitives. The fluidic die may include a digital-to-analog converter (DAC) to drive a number of the delay circuits. The delay circuits delay a number of activation pulses that activate the actuators associated with the primitives to reduce peak power demands of the fluidic die. A number of delay circuits may be coupled to each primitive.
    Type: Grant
    Filed: April 9, 2018
    Date of Patent: March 17, 2020
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Scott A. Linn, George H. Corrigan, III, Michael W. Cumbie
  • Publication number: 20190285564
    Abstract: The present disclosure is drawn to an insulated sensor including a silicon substrate with active circuitry on a surface thereof, an electrode disposed on the silicon substrate, a passivation layer having a thickness from greater than 500 Angstroms to 3,000 Angstroms disposed on the active circuitry, and an electrode insulating layer having a thickness from 10 Angstroms to 500 Angstroms disposed on the electrode.
    Type: Application
    Filed: October 5, 2016
    Publication date: September 19, 2019
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: George H. CORRIGAN, III, Chantelle DOMINGUE, Sadiq BENGALI
  • Patent number: 10378946
    Abstract: In some examples, a method of sensing an ink level includes applying a pre-charge voltage to a sense capacitor to charge the sense capacitor with a charge, sharing the charge between the sense capacitor and a reference capacitor, causing a reference voltage at a gate of an evaluation transistor, and determining a resistance from a drain to a source of the evaluation transistor that results from the reference voltage.
    Type: Grant
    Filed: February 2, 2017
    Date of Patent: August 13, 2019
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Ning Ge, Trudy Benjamin, Teck-Khim Neo, Joseph M. Torgerson, Neel Banerjee, George H. Corrigan, III
  • Publication number: 20190210025
    Abstract: According to an example, a microfluidic apparatus may include a fluid slot and a foyer that is in fluid communication with the fluid slot via a channel having a relatively smaller width than the foyer. The microfluidic apparatus may also include an electrical sensor to measure a change in an electrical field caused by a particle of interest in a fluid passing through the channel from the fluid slot to the foyer, an actuator to apply pressure onto fluid contained in the foyer, and a controller to receive the measured change in the electrical field from the electrical sensor, determine, from the received change in the electrical field, an electrical signature of the particle of interest, and control the actuator to control movement of the particle of interest based upon the determined electrical signature of the particle of interest.
    Type: Application
    Filed: July 26, 2016
    Publication date: July 11, 2019
    Inventors: Chantelle DOMINGUE, Tod WOODFORD, Manish GIRI, Matthew David SMITH, George H CORRIGAN III, Masoud ZAVAREHI, Joshua M. YU
  • Publication number: 20190016127
    Abstract: A fluidic die may include a number of actuators. The number of actuators form a number of primitives. The fluidic die may include a digital-to-analog converter (DAC) to drive a number of the delay circuits. The delay circuits delay a number of activation pulses that activate the actuators associated with the primitives to reduce peak power demands of the fluidic die. A number of delay circuits may be coupled to each primitive.
    Type: Application
    Filed: April 9, 2018
    Publication date: January 17, 2019
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Scott A. Linn, George H. Corrigan III, Michael W. Cumbie
  • Patent number: 10082414
    Abstract: In some examples, an ink level sensor includes a sense capacitor between a first node and ground, a first switch to couple a first voltage to the first node and charge the sense capacitor, a second switch to couple the first node with a second node and share the charge between the sense capacitor and a reference capacitor, causing a second voltage at the second node, and a transistor having a drain, a gate coupled to the second node, and a source coupled to ground, the transistor to provide a drain to source resistance in proportion to the second voltage.
    Type: Grant
    Filed: February 2, 2017
    Date of Patent: September 25, 2018
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Ning Ge, Trudy Benjamin, Teck-Khim Neo, Joseph M. Torgerson, Neel Banerjee, George H. Corrigan, III
  • Patent number: 10022962
    Abstract: A fluidic die may include a number of actuators. The number of actuators form a number of primitives. The fluidic die may include a digital-to-analog converter (DAC) to drive a number of the delay circuits. The delay circuits delay a number of activation pulses that activate the actuators associated with the primitives to reduce peak power demands of the fluidic die. A number of delay circuits may be coupled to each primitive.
    Type: Grant
    Filed: August 1, 2017
    Date of Patent: July 17, 2018
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Scott A. Linn, George H. Corrigan, III, Michael W. Cumbie
  • Patent number: 9969157
    Abstract: A fluidic die may include a number of actuators. The number of actuators form a number of primitives. The fluidic die may include a digital-to-analog converter (DAC) to drive a number of the delay circuits. The delay circuits delay a number of activation pulses that activate the actuators associated with the primitives to reduce peak power demands of the fluidic die. A number of delay circuits may be coupled to each primitive.
    Type: Grant
    Filed: August 1, 2017
    Date of Patent: May 15, 2018
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Scott A. Linn, George H. Corrigan, III, Michael W. Cumbie
  • Publication number: 20170146383
    Abstract: In some examples, an ink level sensor includes a sense capacitor between a first node and ground, a first switch to couple a first voltage to the first node and charge the sense capacitor, a second switch to couple the first node with a second node and share the charge between the sense capacitor and a reference capacitor, causing a second voltage at the second node, and a transistor having a drain, a gate coupled to the second node, and a source coupled to ground, the transistor to provide a drain to source resistance in proportion to the second voltage.
    Type: Application
    Filed: February 2, 2017
    Publication date: May 25, 2017
    Inventors: Ning Ge, Trudy Benjamin, Teck-Khim Neo, Joseph M. Torgerson, Neel Banerjee, George H. Corrigan, III
  • Publication number: 20170144451
    Abstract: In some examples, a method of sensing an ink level includes applying a pre-charge voltage to a sense capacitor to charge the sense capacitor with a charge, sharing the charge between the sense capacitor and a reference capacitor, causing a reference voltage at a gate of an evaluation transistor, and determining a resistance from a drain to a source of the evaluation transistor that results from the reference voltage.
    Type: Application
    Filed: February 2, 2017
    Publication date: May 25, 2017
    Inventors: Ning Ge, Trudy Benjamin, Teck-Khim Neo, Joseph M. Torgerson, Neel Banerjee, George H. Corrigan, III
  • Patent number: 9599500
    Abstract: In an embodiment, a method of sensing an ink level includes applying a pre-charge voltage Vp to a sense capacitor to charge the sense capacitor with a charge Q1, sharing Q1 between the sense capacitor and a reference capacitor, causing a reference voltage Vg at the gate of an evaluation transistor, and determining a resistance from drain to source of the evaluation transistor that results from Vg.
    Type: Grant
    Filed: June 27, 2011
    Date of Patent: March 21, 2017
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Ning Ge, Trudy Benjamin, Teck-Khim Neo, Joseph M. Torgerson, Neel Banerjee, George H. Corrigan, III