Patents by Inventor George H. Daskalakis
George H. Daskalakis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11051436Abstract: Particular embodiments described herein provide for an electronic device that can be configured to enable a modular printed circuit board separation tool. The separation tool can include a main body and a plurality of separation blades that extend from the main body. Each of the plurality of separation blades can be tapered and configured to fit between connections of a testing housing and a power and signal supply housing and when pressure is applied to the main body, the separation blades slide between the connections of the testing housing and the power and signal supply housing and separate the testing housing and the power and signal supply housing.Type: GrantFiled: December 27, 2019Date of Patent: June 29, 2021Assignee: Intel CorporationInventors: George H. Daskalakis, Reed D. Vilhauer
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Publication number: 20200137934Abstract: Particular embodiments described herein provide for an electronic device that can be configured to enable a modular printed circuit board separation tool. The separation tool can include a main body and a plurality of separation blades that extend from the main body. Each of the plurality of separation blades can be tapered and configured to fit between connections of a testing housing and a power and signal supply housing and when pressure is applied to the main body, the separation blades slide between the connections of the testing housing and the power and signal supply housing and separate the testing housing and the power and signal supply housing.Type: ApplicationFiled: December 27, 2019Publication date: April 30, 2020Applicant: Intel CorporationInventors: George H. Daskalakis, Reed D. Vilhauer
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Patent number: 10152100Abstract: In one example an electronic device comprises a chassis, a processing device disposed in the chassis, a first heat spreader positioned adjacent the processing device and in thermal communication with the processing device, and a second heat spreader positioned adjacent the first heat spreader and in thermal communication with the first heat spreader. In some examples the second heat spreader is moveable between a first position in which the second heat spreader is disposed within the chassis and a second position in which at least a portion of the second heat spreader extends outside the chassis. Other examples may be described.Type: GrantFiled: July 1, 2016Date of Patent: December 11, 2018Assignee: Intel CorporationInventors: Michael Ahrens, George H. Daskalakis, Steven J. Lofland, David Pidwerbecki, Bo Qiu, James C. Raupp, Stacy L. Yee
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Patent number: 9980412Abstract: Apparatuses, systems and methods associated with flexible heat spreader design are disclosed herein. In embodiments, an electronic device may include a component, a heat dissipation member, and a flexible member. The heat dissipation member may be coupled to the component via a flexible portion of the electronic device, the component located on a first side of the flexible portion and the heat dissipation member located on a second side of the flexible portion. The flexible member may be thermally coupled to the component and the heat dissipation member, wherein the flexible member extends along the flexible portion from the first side to the second side and is to transfer heat from the component to the heat dissipation member. Other embodiments may be described and/or claimed.Type: GrantFiled: September 29, 2016Date of Patent: May 22, 2018Assignee: Intel CorporationInventors: Bo Qiu, Xi Guo, James C. Raupp, Michael Ahrens, David Pidwerbecki, Steven J. Lofland, George H. Daskalakis, Stacy L. Yee, Mark MacDonald
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Patent number: 9971382Abstract: Systems, methods and apparatuses may provide for a flexible display assembly including a flexible display and a backplane coupled to the flexible display, wherein at least a portion of the backplane comprises a super elastic sheet. In one example, the backplane includes a first rigid sheet metal portion and a second rigid sheet metal portion, wherein the super-elastic sheet is joined between the first and second rigid sheet metal portions.Type: GrantFiled: July 1, 2016Date of Patent: May 15, 2018Assignee: Intel CorporationInventors: Michael Ahrens, George H. Daskalakis, Steven J. Lofland, David Pidwerbecki, Bo Qiu, James C. Raupp, Stacy L. Yee
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Publication number: 20180092253Abstract: Apparatuses, systems and methods associated with flexible heat spreader design are disclosed herein. In embodiments, an electronic device may include a component, a heat dissipation member, and a flexible member. The heat dissipation member may be coupled to the component via a flexible portion of the electronic device, the component located on a first side of the flexible portion and the heat dissipation member located on a second side of the flexible portion. The flexible member may be thermally coupled to the component and the heat dissipation member, wherein the flexible member extends along the flexible portion from the first side to the second side and is to transfer heat from the component to the heat dissipation member. Other embodiments may be described and/or claimed.Type: ApplicationFiled: September 29, 2016Publication date: March 29, 2018Inventors: Bo Qiu, Xi Guo, James C. Raupp, Michael Ahrens, David Pidwerbecki, Steven J. Lofland, George H. Daskalakis, Stacy L. Yee, Mark MacDonald
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Publication number: 20180091987Abstract: Disclosed is a mobile device. The mobile device may be located proximate a mobile terminal and controlled by the mobile terminal. The mobile device may include a processor and a memory. The memory may store instructions that, when executed by the processor, cause the processor to: determine a mode of operation of the mobile device, determine a thermal profile for the mode of operation of the mobile device, and implement a power profile to achieve the thermal profile.Type: ApplicationFiled: September 29, 2016Publication date: March 29, 2018Inventors: Ralph V. Miele, Eduardo Escamilla, James Utz, James M. Yoder, Tongyan Zhai, Baomin Liu, Meenakshi Gupta, Brian R. Peil, Venkat R. Gaurav, Drew G. Damm, Andrew Larson, Ricky O. Branner, Steven J. Lofland, George H. Daskalakis, James C. Raupp, Michael Ahrens, David Pidwerbecki, Bo Qiu, Stacy L. Yee
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Publication number: 20180004261Abstract: In one example an electronic device comprises a chassis, a processing device disposed in the chassis, a first heat spreader positioned adjacent the processing device and in thermal communication with the processing device, and a second heat spreader positioned adjacent the first heat spreader and in thermal communication with the first heat spreader. In some examples the second heat spreader is moveable between a first position in which the second heat spreader is disposed within the chassis and a second position in which at least a portion of the second heat spreader extends outside the chassis. Other examples may be described.Type: ApplicationFiled: July 1, 2016Publication date: January 4, 2018Applicant: Intel CorporationInventors: Michael Ahrens, George H. Daskalakis, Steven J. Lofland, David Pidwerbecki, Bo Qiu, James C. Raupp, Stacy L. Yee
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Publication number: 20180004252Abstract: Systems, methods and apparatuses may provide for a flexible display assembly including a flexible display and a backplane coupled to the flexible display, wherein at least a portion of the backplane comprises a super elastic sheet. In one example, the backplane includes a first rigid sheet metal portion and a second rigid sheet metal portion, wherein the super-elastic sheet is joined between the first and second rigid sheet metal portions.Type: ApplicationFiled: July 1, 2016Publication date: January 4, 2018Inventors: Michael Ahrens, George H. Daskalakis, Steven J. Lofland, David Pidwerbecki, Bo Qiu, James C. Raupp, Stacy L. Yee
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Publication number: 20170131739Abstract: A device, system, and method are described. In one embodiment, the device includes a latch. The latch at different times is located in at least a rest position and a non-rest position. The latch receiving a manipulation force to move the latch from the rest position to the non-rest position. The latch is capable of delaying its return to the rest position after a period of time.Type: ApplicationFiled: October 5, 2016Publication date: May 11, 2017Applicant: lntel CorporationInventors: Jered H. Wikander, George H. Daskalakis, Denica N. Larsen, Hue V Lam
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Publication number: 20140193193Abstract: A device, system, and method are described. In one embodiment, the device includes a latch. The latch at different times is located in at least a rest position and a non-rest position. The latch receiving a manipulation force to move the latch from the rest position to the non-rest position. The latch is capable of delaying its return to the rest position after a period of time.Type: ApplicationFiled: December 27, 2013Publication date: July 10, 2014Inventors: Jered H. WIKANDER, George H. DASKALAKIS, Denica N. LARSEN
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Patent number: 7672120Abstract: A keyboard is to be designed as a standardized keyboard having a certain length, width and thickness. The keyboard may be used interchangeably among different mobile computer systems. A keyboard cable associated with the keyboard may be designed such that it can accommodate an interface connector at any location relative to a bottom end of the keyboard. One or more control devices may also be used in conjunction with the keyboard. The control device may be designed with standardized dimensions, electrical interface, interface connector and cable length to enable it to accompany the keyboard among the different mobile computer systems.Type: GrantFiled: March 31, 2006Date of Patent: March 2, 2010Assignee: Intel CorporationInventors: Ed H. Kohlman, Hong W. Wong, Daryl J. Nelson, Wah Yiu Kwong, George H. Daskalakis
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Publication number: 20080156431Abstract: A customizable notebook panel (CNP) manufactured with a photo image is to be attached to a surface of a computer system using a white color adhesive. To prevent streaks and bubbles from being visible on the CNP, a filler layer is used in between the CNP and the surface. Other techniques to reduce the visibility of the streaks and bubbles may include increasing the thickness of the adhesive layer and using inks that are opaque.Type: ApplicationFiled: December 28, 2006Publication date: July 3, 2008Inventors: George H. Daskalakis, Hong W. Wong, Daryl J. Nelson, Ed H. Kohlman, Michael S. Harrison, Emity Pan, Wah Yiu Kwong
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Patent number: 7280347Abstract: According to one embodiment, a system is disclosed. The system includes a chassis including a printed circuit board (PCB) and a battery pack. The battery pack includes a connector to enable the battery pack to couple to a PCB which is mounted either above the centerline of the battery pack connector and on or below the centerline of the battery pack power connector.Type: GrantFiled: December 29, 2004Date of Patent: October 9, 2007Assignee: Intel CorporationInventors: Hong W. Wong, Wah Yiu Kwong, Don J. Nguyen, Shawn S. McEuen, George H. Daskalakis, Daryl J. Nelson
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Patent number: 6551120Abstract: A retention mechanism for securing an electrical connector of a printed circuit card to an electrical connector of a main circuit board is presented. The retention mechanism has a base, through which each of the connectors fit, having a number of snaplets and a number of guiding ledges. The snaplets secure the retention mechanism to the electrical connector of the main circuit board, while the guiding ledges support the positioning of the electrical connector of the printed circuit card in the electrical connector of the main circuit board. A locking feature secures the electrical connector of the printed circuit card in place by fitting into a slot between a card arm and the main body of the printed circuit card. A handle extends from the locking feature, allowing for easy manipulation, so that the locking feature may be locked and unlocked and the printed circuit card may be inserted or removed at will.Type: GrantFiled: September 2, 1999Date of Patent: April 22, 2003Assignee: Intel CorporationInventors: George H. Daskalakis, Daryl J. Nelson
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Publication number: 20020142642Abstract: A retention mechanism for securing an electrical connector of a printed circuit card to an electrical connector of a main circuit board is presented. The retention mechanism has a base, through which each of the connectors fit, having a number of snaplets and a number of guiding ledges. The snaplets secure the retention mechanism to the electrical connector of the main circuit board, while the guiding ledges support the positioning of the electrical connector of the printed circuit card in the electrical connector of the main circuit board. A locking feature secures the electrical connector of the printed circuit card in place by fitting into a slot between a card arm and the main body of the printed circuit card. A handle extends from the locking feature, allowing for easy manipulation, so that the locking feature may be locked and unlocked and the printed circuit card may be inserted or removed at will.Type: ApplicationFiled: September 2, 1999Publication date: October 3, 2002Inventors: GEORGE H. DASKALAKIS, DARYL J. NELSON
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Patent number: 6361343Abstract: A circuit card retention mechanism having a base which is mounted around an electrical connecter of a mother board and has various embodiments of an extension piece for securing a circuit card to the electrical connecter of the mother board is presented. The base of the retention mechanism has a number of pointed bites which incline inwardly from the base and, working in opposition to one another, securely fasten the base to the electrical connecter of the mother board. A tie-wrap may be attached to the base and connected by a circuit card hook or a circuit card holder to the circuit card. Alternatively, a retainer clip with a snap lock which snaps onto the circuit card may be utilized.Type: GrantFiled: September 21, 1999Date of Patent: March 26, 2002Assignee: Intel CorporationInventors: George H. Daskalakis, Brian A. Scott