Patents by Inventor George H. Kumpf

George H. Kumpf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High impedance electromagnetic surface and method
    Patent number: 7528788
    Abstract: A high impedance surface (300) has a printed circuit board (302) with a first surface (314) and a second surface (316), and a continuous electrically conductive plate (319) disposed on the second surface (316) of the printed circuit board (302). A plurality of electrically conductive plates (318) is disposed on the first surface (314) of the printed circuit board (302), while a plurality of elements are also provided. Each element comprises at least one of (1) at least one multi-layer inductor (330, 331) electrically coupled between at least two of the electrically conductive plates (318) and embedded within the printed circuit board (302), and (2) at least one capacitor (320) electrically coupled between at least two of the electrically conductive plates (318).
    Type: Grant
    Filed: July 17, 2008
    Date of Patent: May 5, 2009
    Assignee: Motorola, Inc.
    Inventors: Gregory J. Dunn, Robert T. Croswell, George H. Kumpf, John A. Svigelj
  • HIGH IMPEDANCE ELECTROMAGNETIC SURFACE AND METHOD
    Publication number: 20080272982
    Abstract: A high impedance surface (300) has a printed circuit board (302) with a first surface (314) and a second surface (316), and a continuous electrically conductive plate (319) disposed on the second surface (316) of the printed circuit board (302). A plurality of electrically conductive plates (318) is disposed on the first surface (314) of the printed circuit board (302), while a plurality of elements are also provided. Each element comprises at least one of (1) at least one multi-layer inductor (330, 331) electrically coupled between at least two of the electrically conductive plates (318) and embedded within the printed circuit board (302), and (2) at least one capacitor (320) electrically coupled between at least two of the electrically conductive plates (318).
    Type: Application
    Filed: July 17, 2008
    Publication date: November 6, 2008
    Applicant: MOTOROLA, INC.
    Inventors: Gregory J. Dunn, Robert T. Croswell, George H. Kumpf, John A. Svigelj
  • High impedance electromagnetic surface and method
    Patent number: 7423608
    Abstract: A high impedance surface (300) has a printed circuit board (302) with a first surface (314) and a second surface (316), and a continuous electrically conductive plate (319) disposed on the second surface (316) of the printed circuit board (302). A plurality of electrically conductive plates (318) is disposed on the first surface (314) of the printed circuit board (302), while a plurality of elements are also provided. Each element comprises at least one of (1) at least one multi-layer inductor (330, 331) electrically coupled between at least two of the electrically conductive plates (318) and embedded within the printed circuit board (302), and (2) at least one capacitor (320) electrically coupled between at least two of the electrically conductive plates (318).
    Type: Grant
    Filed: December 20, 2005
    Date of Patent: September 9, 2008
    Assignee: Motorola, Inc.
    Inventors: Gregory J. Dunn, Robert T. Croswell, George H. Kumpf, John A. Svigelj