Patents by Inventor George Henry Thiel

George Henry Thiel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method to accommodate increase in volume expansion during solder reflow
    Patent number: 7703199
    Abstract: Solder balls, such as, low melt C4 solder balls undergo volume expansion during reflow. Where the solder balls are encapsulated, expansion pressure can cause damage to device integrity. A volume expansion region in the semiconductor chip substrate beneath each of the solder balls accommodates volume expansion. Air-cushioned diaphgrams, deformable materials and non-wettable surfaces may be used to permit return of the solder during cooling to its original site. A porous medium with voids sufficient to accommodate expansion may also be used.
    Type: Grant
    Filed: May 24, 2006
    Date of Patent: April 27, 2010
    Assignee: International Business Machines Corporation
    Inventors: David Vincent Caletka, Krishna Darbha, Donald W. Henderson, Lawrence P. Lehman, George Henry Thiel
  • Method of accommodating in volume expansion during solder reflow
    Patent number: 7086147
    Abstract: Solder balls such as, low melt C4 solder balls, undergo volume expansion during reflow, such as may occur during attachment of chip modules to a PCB. Where the solder balls are encapsulated, expansion pressure can cause damage to device integrity. A volume expansion region in the semiconductor chip substrate beneath each of the solder balls accommodated this volume expansion. Air-cushioned diaphgrams, deformable materials and non-wettable surfaces may be used to permit return of the solder during cooling to its original site. A porous medium with voids sufficient to accommodate expansion may also be used.
    Type: Grant
    Filed: January 29, 2004
    Date of Patent: August 8, 2006
    Assignee: International Business Machines Corporation
    Inventors: David Vincent Caletka, Krishna Darbha, Donald W. Henderson, Lawrence P. Lehman, George Henry Thiel
  • Structure to accommodate increase in volume expansion during solder reflow
    Publication number: 20040183094
    Abstract: Solder balls, such as, low melt C4 solder balls undergo volume expansion during reflow. Where the solder balls are encapsulated, expansion pressure can cause damage to device integrity. A volume expansion region in the semiconductor chip substrate beneath each of the solder balls accommodates volume expansion. Air-cushioned diaphgrams, deformable materials and non-wettable surfaces may be used to permit return of the solder during cooling to its original site. A porous medium with voids sufficient to accommodate expansion may also be used.
    Type: Application
    Filed: January 29, 2004
    Publication date: September 23, 2004
    Applicant: International Business Machines Corporation
    Inventors: David Vincent Caletka, Krishna Darbha, Donald W. Henderson, Lawrence P. Lehman, George Henry Thiel
  • Structure to accommodate increase in volume expansion during solder reflow
    Patent number: 6686664
    Abstract: Solder balls, such as, low melt C4 solder balls undergo volume expansion during reflow. Where the solder balls are encapsulated, expansion pressure can cause damage to device integrity. A volume expansion region in the semiconductor chip substrate beneath each of the solder balls accommodates volume expansion. Air-cushioned diaphgrams, deformable materials and non-wettable surfaces may be used to permit return of the solder during cooling to its original site. A porous medium with voids sufficient to accommodate expansion may also be used.
    Type: Grant
    Filed: April 30, 2001
    Date of Patent: February 3, 2004
    Assignee: International Business Machines Corporation
    Inventors: David Vincent Caletka, Krishna Darbha, Donald W. Henderson, Lawrence P. Lehman, George Henry Thiel
  • Structure to accommodate increase in volume expansion during solder reflow
    Publication number: 20020158110
    Abstract: Solder balls, such as, low melt C4 solder balls undergo volume expansion during reflow. Where the solder balls are encapsulated, expansion pressure can cause damage to device integrity. A volume expansion region in the semiconductor chip substrate beneath each of the solder balls accommodates volume expansion. Air-cushioned diaphgrams, deformable materials and non-wettable surfaces may be used to permit return of the solder during cooling to its original site. A porous medium with voids sufficient to accommodate expansion may also be used.
    Type: Application
    Filed: April 30, 2001
    Publication date: October 31, 2002
    Applicant: International Business Machines Corporation
    Inventors: David Vincent Caletka, Krishna Darbha, Donald W. Henderson, Lawrence P. Lehman, George Henry Thiel
  • Integrated circuit package
    Patent number: 6226187
    Abstract: The bond strength between a semiconductor chip and a metal heat sink in an integrated circuit package can be improved by using an adhesive system comprising two separate layers, one layer exhibiting preferential bonding strength for the chip and the other layer exhibiting preferential bonding strength for the metal heat sink.
    Type: Grant
    Filed: August 5, 1999
    Date of Patent: May 1, 2001
    Assignee: International Business Machines Corporation
    Inventors: David Lee Questad, Anne Marie Quinn, George Henry Thiel, Donna Jean Trevitt, Tien Yue Wu, Patrick Robert Zippetelli
  • Integrated circuit package including a heat sink and an adhesive
    Patent number: 6084299
    Abstract: The bond strength between a semiconductor chip and a metal heat sink in an integrated circuit package can be improved by using an adhesive system comprising two separate layers, one layer exhibiting preferential bonding strength for the chip and the other layer exhibiting preferential bonding strength for the metal heat sink.
    Type: Grant
    Filed: November 9, 1995
    Date of Patent: July 4, 2000
    Assignee: International Business Machines Corporation
    Inventors: David Lee Questad, Anne Marie Quinn, George Henry Thiel, Donna Jean Trevitt, Tien Yue Wu, Patrick Robert Zippetelli