Abstract: The invention is a personal hydrofoil surfboard that has a wing with a reflexed mean camber line. The invention has greatly improved handling characteristics compared to hydrofoils using conventional wing designs.

Abstract: The invention is an apparatus and method for forming highly uniform layers of metal on a substrate by electro-deposition. The substrate is electroplated in a bath composed of a quiescent (i.e., no external agitation) electrolyte solution using an effective constant current density carefully selected to match the chemical composition of the electrolyte.

Abstract: The invention provides an electroplating composition, method, and improved apparatus, which enables electroplating tin-silver alloys at high speed and without burning. The composition is an aqueous acidic solution including salts of stannous tin and a monovalent silver, and a complexing agent selected from the group consisting of thiocarbazides and thiohydrazides, and optionally an aldehyde and/or dialdehyde organic brightener compound. A sulfonic acid and a surfactant may also be included. The improved apparatus provides a protective structure substantially surrounding the anode(s) to decrease turbulence and the problematic silver displacement reaction.

Abstract: The invention relates to an electrolyte used in connection with the deposition of a gold-tin alloy on an electroplatable substrate. This solution generally includes water; stannous and/or stannic tin ions, a complexing agent to render the stannous and/or stannic tin ions soluble, complexed gold ions, and an alloy stabilizing agent that includes ethoxylated compounds with phosphate ester functional group, brightening additives based on ethoxylated phosphate esters and alkali metal fatty acids dipropionates. The brighteners may be used alone or in conjunction with each other to achieve beneficial synergistic effect. The alloy stabilizing agent is present in an amount sufficient to stabilize the composition of the gold-tin deposit over a usable current density range. The solution has a pH of between 2 and 10 and the gold ions and tin ions are present in relative amounts sufficient to provide a deposit having a gold content less than 90% by weight and a tin content greater than 10% by weight.

Abstract: Improvements in methods for plating metal on substrates are obtained by providing media in the plating solution in sizes that are less than 60% to 80% smaller than the average dimension of the substrates to be plated. It is also advantageous for the substrates and media to be present in the solution at a volume ratio of above 1/1 to about 5/1. Another embodiment of the invention relates to an apparatus for electroplating a metal deposit on electroplatable substrates.

Abstract: The present invention relates to a solution for use in connection with the deposition of tin or tin alloys on platable portions of substrates. This solution comprises water; tin ions in an amount sufficient to provide a tin deposit on platable portions of substrates; a complexing agent of an acid or salt thereof that is stable at a pH of above 5.5 and below 10 present in an amount sufficient to render the metal ion soluble in the solution; and a surfactant of an alkoxylated polyalcohol present in an amount sufficient to complex the metal and render it soluble in the solution to facilitate deposition of tin upon the platable portions of the substrates.

Abstract: The invention relates to an electrolyte used in connection with the deposition of a gold-tin alloy on an electroplatable substrate. This solution generally includes water; stannous and/or stannic tin ions, a complexing agent to render the stannous and/or stannic tin ions soluble, complexed gold ions, and an alloy stabilizing agent that includes ethoxylated compounds with phosphate ester functional group, brightening additives based on ethoxylated phosphate esters and alkali metal fatty acids dipropionates. The brighteners may be used alone or in conjunction with each other to achieve beneficial synergistic effect. The alloy stabilizing agent is present in an amount sufficient to stabilize the composition of the gold-tin deposit over a usable current density range. The solution has a pH of between 2 and 10 and the gold ions and tin ions are present in relative amounts sufficient to provide a deposit having a gold content less than 90% by weight and a tin content greater than 10% by weight.

Abstract: A vessel for contacting a plurality of objects with a fluid. An upwardly directed stream of fluid and a portion of the objects are confined in a conduit such that the fluid stream causes the objects to flow upward from a moving bed thereof to a disengaging position from where they fall onto an inclined distribution surface, are fed into an annular channel having at least an inclined section, and move downward through the inclined section to a feed position at the fluid inlet. The vessel may be used for treating electrically conductive objects wherein the fluid is an electrolyte, an electrode is positioned to contact the moving bed, and a counterelectrode is positioned in spaced relation to the vessel, which may be fixed or portable.

Abstract: A vessel for contacting a plurality of objects with a fluid. An upwardly directed stream of fluid and a portion of the objects are confined in a conduit such that the fluid stream causes the objects to flow upward from a moving bed thereof to a disengaging position from where they fall onto a distribution shield and move downward to a feed position. The vessel may be used for treating electrically conductive objects wherein the fluid is an electrolyte, an electrode is positioned to contact the moving bed, and a counterelectrode is positioned in spaced relation to the moving bed. The vessel may be fixed or portable.

Abstract: A solution for use in connection with the deposition of one or more metals on electroplatable substrates. This solution includes water; a metal ion; and a complexing agent. The complexing agent is advantageously an organic compound having between 4 and 18 carbon atoms which includes at least two hydroxyl groups and a five or six membered ring that contains at least one oxygen atom. The compound is present in an amount sufficient to complex the metal in the solution and inhibit oxidation of the metal. In particular, the complexing agent and metal ion are present in a concentration ratio of between about 3:1 and 9:1 to reduce or minimize agglomeration of the substrates during electroplating. If necessary, a suitable pH adjusting agent can be included in the solution to maintain the pH of the solution in the range of between about 3.5 to 5.5.

Abstract: A solution for use in connection with the deposition of one or more metals on electroplatable substrates. This solution includes water; a metal ion; and a complexing agent. The complexing agent is advantageously an organic compound having between 4 and 18 carbon atoms which includes at least two hydroxyl groups and a five or six membered ring that contains at least one oxygen atom. The compound is present in an amount sufficient to complex the metal in the solution and inhibit oxidation of the metal. If necessary, a suitable pH adjusting agent can be included in the solution to maintain the pH of the solution in the range of between 2 and 10 and preferably to a pH of about 3.5 to 5.5. At the preferred pH range, the solution is particularly useful for electroplating composite articles that have electroplatable portions and non-electroplatable portions without deleteriously affecting the non-electroplatable portions.

Abstract: A vessel for contacting a plurality of objects with a fluid. An upwardly directed stream of fluid and a portion of the objects are confined in a conduit such that the fluid stream causes the objects to flow upward from a moving bed thereof to a disengaging position from where they fall onto a distribution shield and move downward to a feed position. The vessel may be used for treating electrically conductive objects wherein the fluid is an electrolyte, an electrode is positioned to contact the moving bed, and a counterelectrode is positioned in spaced relation to the moving bed. The vessel may be fixed or portable.

Abstract: A water purification system and method suitable for use in swimming pools, spas, hot tubs, water storage tanks, wells and water cooling towers employs a galvanic cell having a silver or copper or zinc anode electrically connected to a cathode made from a metal of still higher electrochemical potential, normally a platinum group metal and preferably palladium. A galvanic cell of some tens of square centimeters in size and some hundreds of grams in weight liberates sufficient silver or copper ions so as to treat a multi-thousand liter body of water, such as a swimming pool, for, typically under normal contamination, some months until the anode is consumed. Copper and/or silver ions liberated from the galvanic cell suppress bacterial, fungal and/or algae growth, thus, significantly reducing the amount of chlorine, bromine or other chemicals needed to maintain water quality.

Abstract: A vessel for contacting a plurality of objects with a fluid and including at least one bottom wall inclined downwardly from at least one sidewall to an inlet for providing an upwardly directed stream of fluid, and a distribution shield arranged in spaced relation to the bottom wall. The fluid stream causes the objects to flow upward from a moving bed thereof to a disengaging position. The distribution shield has an upper surface inclined downwardly and extending away from the vicinity of the object disengaging position to a return position such that disengaged objects fall on the upper surface of the distribution shield and move downward thereon to the return position from which they fall onto an upper portion of the inclined bottom wall and move downward thereon to a feed position.

Abstract: Technetium is separated from radio-contaminated metal in a three-step process. The contaminated metal is dissolved in an acid solution; the technetium, present in the resultant solution as pertechnetate ions, is quantitatively reduced to its metallic state through a metal displacement (cementation) reaction with a base metal of lower reduction potential; and the desired metal is electrolytically recovered from the solution, substantially free from technetium contamination.