Patents by Inventor George J. Chou

George J. Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8388890
    Abstract: A nickel based alloy coating and a method for applying the nickel based alloy as a coating to a substrate. The nickel based alloy comprises about 0.1-15% rhenium, about 5-55% of an element selected from the group consisting of cobalt, iron and combinations thereof, sulfur included as a microalloying addition in amounts from about 100 parts per million (ppm) to about 300 ppm, the balance nickel and incidental impurities. The nickel-based alloy of the present invention is applied to a substrate, usually an electromechanical device such as a MEMS, by well-known plating techniques. However, the plating bath must include sufficient sulfur to result in deposition of 100-300 ppm sulfur as a microalloyed element. The coated substrate is heat treated to develop a two phase microstructure in the coating.
    Type: Grant
    Filed: June 22, 2007
    Date of Patent: March 5, 2013
    Assignee: Tyco Electronics Corporation
    Inventors: Robert D Hilty, Valerie Lawrence, George J Chou
  • Patent number: 7585173
    Abstract: An electrical contact is provided that includes an elastomeric body extending between a base portion and a mating end portion. The elastomeric body includes a ledge extending from the mating end portion to the base portion of the elastomeric body. The ledge is defined by a portion of the elastomeric body. An electrically conductive pad extends over at least a portion of the mating end portion. An electrically conductive trace is formed on a surface of the ledge. The electrically conductive trace extends from the mating end portion to the base portion of the elastomeric body. The electrically conductive trace is in electrical contact with the electrically conductive pad for electrically connecting the electrically conductive pad with an electrically conductive element engaging the base portion of the elastomeric body.
    Type: Grant
    Filed: March 30, 2007
    Date of Patent: September 8, 2009
    Assignee: Tyco Electronics Corporation
    Inventors: Robert D. Hilty, Matthew R. McAlonis, George J. Chou, Dmitry Zhmurkin, Jeffery W. Mason
  • Publication number: 20080242128
    Abstract: An electrical contact is provided that includes an elastomeric body extending between a base portion and a mating end portion. The elastomeric body includes a ledge extending from the mating end portion to the base portion of the elastomeric body. The ledge is defined by a portion of the elastomeric body. An electrically conductive pad extends over at least a portion of the mating end portion. An electrically conductive trace is formed on a surface of the ledge. The electrically conductive trace extends from the mating end portion to the base portion of the elastomeric body. The electrically conductive trace is in electrical contact with the electrically conductive pad for electrically connecting the electrically conductive pad with an electrically conductive element engaging the base portion of the elastomeric body.
    Type: Application
    Filed: March 30, 2007
    Publication date: October 2, 2008
    Inventors: Robert D. Hilty, Matthew R. McAlonis, George J. Chou, Dmitry Zhmurkin, Jeffery W. Mason
  • Publication number: 20080202641
    Abstract: A nickel based alloy coating and a method for applying the nickel based alloy as a coating to a substrate. The nickel based alloy comprises about 0.1-15% rhenium, about 5-55% of an element selected from the group consisting of cobalt, iron and combinations thereof, sulfur included as a microalloying addition in amounts from about 100 parts per million (ppm) to about 300 ppm, the balance nickel and incidental impurities. The nickel-based alloy of the present invention is applied to a substrate, usually an electromechanical device such as a MEMS, by well-known plating techniques. However, the plating bath must include sufficient sulfur to result in deposition of 100-300 ppm sulfur as a microalloyed element. The coated substrate is heat treated to develop a two phase microstructure in the coating.
    Type: Application
    Filed: June 22, 2007
    Publication date: August 28, 2008
    Applicant: TYCO ELECTRONICS CORPORATION
    Inventors: Robert D. HILTY, Valerie LAWRENCE, George J. CHOU