Abstract: Micro-optical elements (MOEs) are designed and fabricated onto transparent laser driver substrates to collimate or focus the beams from vertical-cavity surface-emitting lasers (VCSELs) in accordance with specific application requirements. One disclosed example teaches the hybrid integration of a top-emitting 850 mm VCSEL array and a transparent sapphire substrate that supports a monolithic MOE with designated optical functionality. A flip-chipping hybridization technique ensures a realistic and reliable process. The VCSEL beams transmit directly through the MOE structure on the transparent sapphire substrate and become well-controlled optical outputs under precise specifications. The optical power loss in such a beam shaping process is minimized compared to configurations based on conventional optical components.

Abstract: An integrated electronic-optoelectronic module comprising: an ultrathin silicon-on-sapphire composite substrate; at least one electronic device fabricated in the ultrathin silicon; and at least one optoelectronic device bonded to the ultrathin silicon-on-sapphire composite substrate and in electrical communication with the at least one electronic device fabricated in the ultrathin silicon layer. For example, VCSELs and photodetectors are integrated with CMOS electronic circuitry to provide useful modules for electro-optical interconnects for computing and switching systems.