Abstract: A device and a process for integrating light energy transmit and/or receive functions with active devices such as GaAs or InP devices or light emitting devices, such as lasers. The device and process includes forming a passivation layer on top of the active device and forming a silicon photodetector on top of the passivation layer. The photodetector may be formed utilizing a standard solar cell growth process and may be formed as a mesa on top of the active or light-emitting device, thus forming a relatively less complicated semiconductor with an integrated monitoring device.

Abstract: A solar cell comprises a superstrate formed from a material that is transparent to light, a first layer formed of delta doped silicon, a plurality of layers formed from semiconductor materials, each characterized by multi-quantum wells and multiple band gaps, a first semiconductor layer having a band gap energy state that is the smallest, the last semiconductor layer having-a band gap that is the largest, and the intermediate semiconductor layers having band gaps transitioning from the smallest to the largest, a second layer overlying the semiconductor layers and formed of delta doped silicon, an n-cap layer formed on the second delta doped layer, and a metal layer formed on the n-cap layer and serving to reflect light into the semiconductor.

Abstract: A method of solar cell external interconnection and a solar cell panel (1) made thereby are disclosed. An assembly (2) including a solar cell module (4), a flexible lead frame (5) to which the solar cell module is to be interconnected and a solder located between the solar cell module and the flexible lead frame, is provided. The solder is heated by directing a hot gas (42) into the area of the solder to melt the solder and form a soldered connection (6) between the solar cell module and the lead frame. The soldered assembly is attached to a module carrier panel (3) by embedding a portion of the assembly in a first, flexible adhesive (32) and another portion of the assembly in a second, thermally curable adhesive (33) which is then cured to anchor the assembly on the module carrier panel.

Abstract: A vacuum chuck (34) for holding thin sheet material, particularly during high-temperature manufacturing processes, and an apparatus (10) for forming a substantially uniform coating of a substance on a thin sheet material. The vacuum chuck includes a chuck body (36) having a gas-permeable support surface (38) for supporting the thin sheet material to define a vacuum chamber (49) having an inlet (54), a valve member (56) for controlling fluid flow through the vacuum chamber inlet, and a locking shim (58) for holding the valve member in the vacuum chamber inlet.