Abstract: Apparatus, systems, and methods described herein may couple a base component associated with a portable electronic device (PED) to a display component associated with the PED such that the display component is capable of sliding and rotating relative to the base component. Other embodiments may be described and claimed.

Abstract: A method and apparatus for dissipating heat from an electronic device is described. The method and apparatus provides a scalable, cost effective, highly efficient, universally applied thermal solution for high heat generating electronic components. In one embodiment, a housing attaches over a heat sink for an electronic device. Various cooling attachments can be attached to this housing to provide a multitude of air flow enhancers. The cooling attachments are designed to provide a thermal engineer or a system integrator with several options for cooling an electronic component. The cooling attachments can be placed in multiple configurations to provide unique thermal solutions. In another embodiment, a kit of parts for a cooling system is provided. The kit of parts includes a housing and a variety of cooling attachments.

Abstract: A method and apparatus for dissipating heat from an electronic device is described. The method and apparatus provides a scalable, cost effective, highly efficient, universally applied thermal solution for high heat generating electronic components. In one embodiment, a housing attaches over a heat sink for an electronic device. Various cooling attachments can be attached to this housing to provide a multitude of air flow enhancers. The cooling attachments are designed to provide a thermal engineer or a system integrator with several options for cooling an electronic component. The cooling attachments can be placed in multiple configurations to provide unique thermal solutions. In another embodiment, a kit of parts for a cooling system is provided. The kit of parts includes a housing and a variety of cooling attachments.

Abstract: A computer housing is provided with enhanced interior cooling, to dissipate operating heat from its heat generating internal electronic components, using a single cooling fan disposed inside the housing. During operation thereof the fan draws ambient cooling air into the housing through a hollow support foot attached to the underside of the housing, and the bottom end opening of a hollow front bezel structure, flows the cooling air through the housing and then discharges it therefrom. A pull-out option card carrier defines an interior housing baffle that routes a large portion of the interior housing air flow across the processor portion of the computer motherboard. Additionally, a smaller quantity of ambient cooling air is drawn through side wall openings in the housing into an interior plenum upon the inner side wall of which the motherboard is mounted.

Abstract: A coupling is configured to hold detachably a speaker on a computer component by a gravitational force acting on the speaker. The coupling may be a pocket on the component and a flange on the speaker. The coupling may include vertically aligned projecting elements on the component and corresponding receptacles on the speaker. The coupling may be hidden after the speaker has been mounted. To attach the speaker it is held near the component and then lowered with respect to the coupling mechanism to reach a position where the speaker is fixed relative to the component by a gravitational force.

Abstract: A computer system has control circuitry for detecting directly and independently of temperature the malfunctioning of a fan used for cooling the housing of the computer and for controlling the power supply voltage when malfunctions are detected so as to reduce the temperature within the housing of the computer system.

Abstract: A personal computer has at least one heat producing element within its housing with a fan for cooling the inside of the housing. The fan is controlled by a temperature dependent fan control circuit. A heat sensing device within the fan control circuit adjusts the voltage applied to the fan in a substantially continuous relationship to the temperature inside the housing.

Abstract: An electronics chassis, preferably a personal computer ("PC") power supply chassis, having a construction free of secondary fabrication operations and a method of manufacture therefor.

Abstract: A computer system utilizes a heat sink which optimizes the benefits of both linear airflow and turbulent airflow within the computer housing. The heat sink has rows of metal fingers extending from a metal sheet. A fan generates linear airflow within the housing. The heat sink is attached to a heat producing element such that the rows of fingers are placed parallel to the direction of airflow in the housing. The fingers are spaced apart within a single row to generate turbulence in the airflow, and the rows are spaced apart to prevent the turbulence of one row from interfering with the turbulence of an adjacent row.

Abstract: A natural convection cooled electronic device utilizing a box-like plastic enclosure surrounding the circuitry of the electronic device. The apparatus further includes aluminum heat sinks fastened in good thermal contact with heat dissipating components of the electronic device, wherein the heat sinks include heat fin members which run parallel to the inner walls of the enclosure and are separated from the walls by an air gap. The inner walls of the enclosure are lined with a layer of thermally conductive material, such as copper foil, which spreads the internal heat flux across the total surface area of the enclosure. The exposed surface of the heat flux spreader layer and the facing surface of the heat fin members are further made semi-rough and stained black to eliminate potential hot spots and to increase radiant heat transfer between the heat sinks and the enclosure. An alternative embodiment includes an electrical insulation layer between the electronic circuitry and the heat flux spreader layer.

Abstract: A natural convection cooled electronic device utilizing a box-like plastic enclosure surrounding the circuitry of the electronic device. The apparatus further includes aluminum heat sinks fastened in good thermal contact with heat dissipating components of the electronic device, wherein the heat sinks include heat fin members which run parallel to the inner walls of the enclosure and are separated from the walls by an air gap. The inner walls of the enclosure are lined with a layer of thermally conductive material, such as copper foil, which spreads the internal heat flux across the total surface area of the enclosure. The exposed surface of the heat flux spreader layer and the facing surface of the heat fin members are further made semi-rough and stained black to eliminate potential hot spots and to increase radiant heat transfer between the heat sinks and the enclosure.

Abstract: An improved forging billet of dual alloys and an improved method for forging a dual alloy billet. The billet is cylindrical in shape having an outer tubular portion of one alloy and another alloy filling the central opening through the tubular portion, the ends of the billet include a radial flange of the tubular alloy extending a short distance outward at each end of the billet and having a skirt extending from the outer end of the radial flange axially away from the body of the billet to form a circular opening at each end of the billet which has at least as large a diameter as the outer diameter of the outer tubular portion, and a sandwich structure positioned within each of said circular opening including a plurality of layers of a powdered lubricant, preferably boron nitride lubricant, separated by foil layers, preferably a high purity nickel foil.