Abstract: A micro-fluid ejecting head for use in a micro-fluid ejecting apparatus includes a plurality of micro-fluid ejection devices, a plurality of driver devices for driving the plurality of micro-fluid ejection devices, and a nonvolatile programmable memory matrix. The memory matrix contains embedded programmable memory devices for storing information related to operation of the micro-fluid ejecting head. The memory matrix is configured to communicate with a controller which is external of the micro-fluid ejecting head. The information stored in the memory matrix may include identification information for the micro-fluid ejecting head, alignment characteristics of the micro-fluid ejecting head, information regarding properties of fluid used by the micro-fluid ejecting head, fluid level information, and fluid use information. The external controller accesses the information stored in the memory matrix and controls the plurality of driver devices based on the information accessed from the memory matrix.

Abstract: A process for making a fluid ejector head for a micro-fluid ejection device. In one embodiment, the process comprises depositing a thin film resistive layer on a substrate to provide a plurality of thin film heaters. The thin film resistive layer comprises a tantalum-aluminum-nitride material consisting essentially of AlN, TaN, and TaAl alloys, and containing from about 30 to about 70 atomic % tantalum, from about 10 to about 40 atomic % aluminum and from about 5 to about 30 atomic % nitrogen.

Abstract: An inkjet printhead. The inkjet printhead includes a temperature-sensing resistor with a low voltage end which is connected to a ground structure that at least partially encloses the temperature sensing resistor.

Abstract: Printheads configured to operate in accordance with a plurality of print modes. For example, one of the plurality of print modes can be selected in accordance with a bit of address data received by the printhead. In an exemplary embodiment, the selection of print mode can be accomplished by switching one or more actuator (e.g., heater) circuit addresses on the printhead.

Abstract: A micro-fluid ejecting device includes a semiconductor substrate, a plurality of fluid ejection elements formed on the semiconductor substrate, and a plurality of nonvolatile programmable memory devices for storing information related to the operation of the micro-fluid ejecting device. The programmable memory devices, which are at least partially embedded in the semiconductor substrate, each include a source region and a drain region formed in the semiconductor substrate. The source and drain regions have a conductivity type which is opposite the conductivity type of the semiconductor substrate. An insulative layer is formed on the semiconductor substrate over the source region and drain region. A floating gate region is formed on the insulative layer and is spatially disposed between the source region and drain region. The floating gate region is electrically insulated from the source and drain regions by the insulative layer. Electrical contacts are connected to the source region and the drain region.

Abstract: Test circuits on heater chips for testing a heater circuit having a heater element and a first power device. The test circuit can include a second power device, a test device configured to hold the first power device off and the second power device on for a selected heater circuit when the test device receives a signal to activate the test circuit, and a common test output to transmit a signal indicative of a state of the selected heater circuit. Methods for using the same are also provided.

Abstract: Heater chips for use with a printing device, such as heater chips that include a first heater array, positioned substantially adjacent a first via, and a second heater array, positioned substantially adjacent a second via. The heater chip can also include a region, positioned between the first heater array and the second heater array, and a temperature sensing element operable to sense the temperature of the region, where the temperature sensing element is substantially centrally disposed with respect to the region. According to one embodiment of the invention, the temperature sensing element comprises a temperature sensing resistor.

Abstract: A process for making a fluid ejector head for a micro-fluid ejection device. In one embodiment, the process comprises depositing a thin film resistive layer on a substrate to provide a plurality of thin film heaters. The thin film resistive layer comprises a tantalum-aluminum-nitride material consisting essentially of AlN, TaN, and TaAl alloys, and containing from about 30 to about 70 atomic % tantalum, from about 10 to about 40 atomic % aluminum and from about 5 to about 30 atomic % nitrogen.

Abstract: Heater chips for use with a printing device, such as heater chips that include a first heater array, positioned substantially adjacent a first via, and a second heater array, positioned substantially adjacent a second via. The heater chip can also include a region, positioned between the first heater array and the second heater array, and a temperature sensing element operable to sense the temperature of the region, where the temperature sensing element is substantially centrally disposed with respect to the region. Additionally, the first heater array and the second heater array are operable to receive heating responsive to the temperature of the region sensed by the temperature sensing element to regulate the temperature of the region. According to one embodiment of the invention, the temperature sensing element comprises a temperature sensing resistor and the heating may occur via non-nucleating heating.

Abstract: A heater chip that includes a circuit element, and a bus that can be used to power the circuit element. The heater chip also includes a feedback circuit that is coupled to the power bus. Particularly, the feedback circuit can be configured to indicate if the bus is powered the circuit element.

Abstract: Micro-fluid ejection device actuator chips and methods of measuring temperature of a micro-fluid ejection device actuator chip are provided. An exemplary micro-fluid ejection device includes an actuator chip for delivering fluid from the device. In one such device, one or more fluid vias include a column of actuators per at least one of the sides of the vias that are apportioned into temperature zones. A temperature sense element or resistor (TSR), per each of the zones, measures a temperature therefor. In this manner, average die or chip temperature along a length of the one or more vias can be controlled closer to a predetermined value. In various aspects, individual actuators are apportioned into zones and dedicated TSRs sense temperatures of the zones. In turn, corrective action may be caused to increase or decrease temperature as the case may be. Representative zones include three per each side of a fluid via.

Abstract: A semiconductor substrate for a micro-fluid ejecting device. The semiconductor substrate includes a plurality of fluid ejection devices disposed on the substrate. A plurality of driver transistors are disposed on the substrate for driving the plurality of fluid ejection devices. A programmable memory matrix containing embedded programmable memory devices is operatively connected to the micro-fluid ejecting device for collecting and storing information on the semiconductor substrate for operation of the micro-fluid ejecting device. The programmable memory matrix provides a high density of memory bits embedded on the substrate for storing information about the micro-fluid ejecting device.

Abstract: An inkjet printhead heater chip includes a resistor layer, a dielectric layer on the resistor layer and a cavitation layer on the dielectric layer. A grounded-gate MOSFET electrically attaches to the cavitation layer to protect the dielectric layer from breakdown during an electrostatic discharge (ESD) event. Protection typically embodies the safe distribution of ESD current to ground during user printhead installation. Locations of the grounded-gate MOSFET(s) include terminal ends of one or more columns of ink ejecting elements formed by the resistor layer. Also, the MOSFET source electrically connects to the gate while the drain attaches to the cavitation layer. The drain attaches via first and second metallization lines, including attachment generally above the cavitation layer. The dielectric layer is diamond like carbon layer and is about 2000 angstroms thick. Inkjet printheads and printers are also disclosed.

Abstract: Test circuits on heater chips for testing a heater circuit having a heater element and a first power device. The test circuit can include a second power device, a test device configured to hold the first power device off and the second power device on for a selected heater circuit when the test device receives a signal to activate the test circuit, and a common test output to transmit a signal indicative of a state of the selected heater circuit. Methods for using the same are also provided.

Abstract: Some embodiments of the present invention provide an inkjet print head having a housing defining an ink reservoir, a nozzle portion including a nozzle plate defining an ink chamber in fluid communication with the ink reservoir, and forming a fluid flow path between the ink chamber and the ink reservoir, and a substrate coupled to the nozzle plate and having a surface substantially positioned over the nozzle plate. At least one heating element can be coupled to the substrate, and can be positioned adjacent the surface to heat a portion of the ink chamber. In some embodiments, the inkjet print head comprises a control circuit coupled to the at least one heating element for controlling the heating element, and a temperature sense element positioned substantially between the at least one heating element and the control circuit or in at least partially overlapping relationship with the heating element.

Abstract: An inkjet print head chip having MOS logic blocks that also includes temperature sense resistors implanted in the chip. These resistors are preferably made of N-Well material.

Abstract: An improved heater chip for an ink jet print head, the chip including an active heater array and an inactive heater array located adjacent to and extending away from the end of the active heater array. The inactive heater array provides a region adjacent the end of the active heater array that is substantially planar, and also provides a plurality of current paths which reduces energy differences between heater resistors adjacent the end of the active heater array and other heater resistors in the heater array.

Abstract: A semiconductor substrate for a micro-fluid ejection head. The substrate includes a plurality of fluid ejection actuators disposed on the substrate. Each of the fluid ejection actuators includes a thin heater stack comprising a thin film heater and one or more protective layers adjacent the heater. The thin film heater is made of a tantalum-aluminum-nitride thin film material having a nano-crystalline structure consisting essentially of AlN, TaN, and TaAl alloys, and has a sheet resistance ranging from about 30 to about 100 ohms per square. The thin film material contains from about 30 to about 70 atomic % tantalum, from about 10 to about 40 atomic % aluminum and from about 5 to about 30 atomic % nitrogen.

Abstract: Power is provided from one portion of a printer, such as a printer electronics module, to another portion of the printer, such as a printhead. Logic signals produced in a first electronic module of the printer are transmitted to a second electronics module of the printer. A power signal is derived from the logic signals without interfering with the magnitude or duration of logic signals, and the logic power signal is applied to power the second electronic module without having a separate dedicated power line.

Abstract: A semiconductor substrate for a microfluid ejection head. The substrate includes a plurality of fluid ejection actuators disposed on the substrate. A plurality of driver transistors are disposed on the substrate for driving the plurality of fluid ejection actuators. Each of the driver transistors have an active area ranging from about 1000 to less than about 15,000 ?m2. A plurality of logic circuits including at least one logic transistor are coupled to the driver transistors. The driver and logic transistors are provided by a high density array of MOS transistors wherein at least the logic transistors have a gate length of from about 0.1 to less than about 3 microns.