Abstract: An integrated circuit in an ink jet printhead selectively activates one or more printing elements on the printhead based on a multi-dimensional addressing scheme. The integrated circuit includes a plurality of pass switching, power switching, and one or more ground switching devices for selectively connecting one or more power switching devices to ground to activate one or more of the printing elements to print an image on a print medium. The integrated circuit includes a number of first, second, third, and fourth control lines for selectively controlling the activation of one or more of the printing elements.

Abstract: A method of firing a plurality of jetting heaters in an ink jet printer includes identifying a first of the jetting heaters to be fired. A second of the jetting heaters to be fired immediately after the firing of the first jetting heater is also identified. Power is simultaneously applied to each of the first jetting heater and the second jetting heater.

Abstract: An inkjet printhead heater chip has an integral voltage regulator that derives two output voltages from a single chip input voltage. One of the two output voltages powers control logic circuitry as the other powers FET drivers. Preferred output voltages include +3.3 volts for the control logic circuitry and +7.5 volts for the FET drivers. A Vgs of the FET is about +7.5 volts which enables a FET area width of about 400 microns. Outputs of the control logic circuitry provide input to the FET drivers. A resistive heater for ejecting ink couples between a drain of the FET and the chip input voltage. Voltage regulating capacitors exist on the heater chip in parallel with the input voltage and each of the output voltages. Preferred capacitors have a gate oxide and a polysilicon layer overlying a substrate. Inkjet printers for housing the printheads are also disclosed.

Abstract: An ink jet heater chip having improved thermal. The chip includes a semiconductor substrate, a first metal resistive, a second metal conductive layer on a first portion of the resistive layer and on a second portion of the resistive layer defining a heater resistor element. A passivation layer having a thickness defined by a deposition process is deposited on the second metal conductive layer and heater resistor element. A cavitation layer is deposited on the passivation layer and etched. A dielectric layer is deposited and etched to provide a dielectric layer overlying the first portion of the resistive layer. An electrical conduit via is etched in the dielectric layer. A third metal conductive layer is deposited in the via for electrical contact with the second metal conductive layer. Separately deposited dielectric and passivation layers enable independent control of the thickness of the dielectric and passivation layers.

Abstract: A heater chip for use in an inkjet printer which includes a single conductive layer to provide electrical connectivity between power and ground inputs. Wherein the unique power distribution architecture is possible by the formation of a plurality of ink vias in the heater chip which provides for an increase in the chip surface area available for electrical connectivity.

Abstract: A heater chip has a substrate with one inner and two outer ink vias adjacently arranged. Each via has a first and second longitudinal side. A plurality of heaters, formed by thin film layers, are grouped together in six rows where two of the six rows are arranged adjacent to the first longitudinal side of one of the two outer ink vias, two rows are arranged adjacent to either the first or second longitudinal side of the inner via, and two rows are arranged adjacent to the second longitudinal side of the other of the two outer ink vias. Each of the first, second, and third two rows have one row of near heaters and one row of far heaters. The near heaters are closer in distance to their respective ink via than the far heaters. Printheads containing the heater chip and printers are also disclosed.

Abstract: An inkjet printhead heater chip has a silicon substrate with a heater stack formed of a plurality of thin film layers thereon for ejecting an ink drop during use. The thin film layers include: a thermal barrier layer on the silicon substrate; a resistor layer on the thermal barrier layer; a doped diamond-like carbon layer on the resistor layer; and a cavitation layer on the doped diamond-like carbon layer. The doped diamond-like carbon layer preferably includes silicon but may also include nitrogen, titanium, tantalum, combinations thereof or other. When it includes silicon, a preferred silicon concentration ranges from 20 to 25 atomic percent. A preferred cavitation layer includes an undoped diamond-like carbon, tantalum or titanium layer. The doped diamond-like carbon layer ranges in thickness from 500 to 3000 angstroms. The cavitation layer ranges from 500 to 6000 angstroms. Inkjet printheads and printers are also disclosed.

Abstract: A method informs a user of an ink jet printer of the end of life of a consumable. The consumable supplies ink to a printhead having a plurality of ink ejection nozzles and an associated plurality of ink jetting actuators, each of the plurality of ink jetting actuators being addressable. The printhead includes a plurality of address lines for facilitating selection of one or more of the plurality of ink jetting actuators. The method includes the steps of defining a notice threshold that is associated with a corresponding amount of ink remaining in the consumable; providing control logic for selectively controlling the plurality of address lines; determining whether the amount of ink remaining in the consumable has reached the notice threshold; and upon reaching the notice threshold, reducing an image density of images formed by the printhead by selectively disabling at least one of the plurality of address lines.

Abstract: An inkjet printhead heater chip has an integral voltage regulator that derives two output voltages from a single chip input voltage. One of the two output voltages powers control logic circuitry as the other powers FET drivers. Preferred output voltages include +3.3 volts for the control logic circuitry and +7.5 volts for the FET drivers. A Vgs of the FET is about +7.5 volts which enables a FET area width of about 400 microns. Outputs of the control logic circuitry provide input to the FET drivers. A resistive heater for ejecting ink couples between a drain of the FET and the chip input voltage. Voltage regulating capacitors exist on the heater chip in parallel with the input voltage and each of the output voltages. Preferred capacitors have a gate oxide and a polysilicon layer overlying a substrate. Inkjet printers for housing the printheads are also disclosed.

Abstract: An inkjet printhead heater chip has an ink via asymmetrically arranged in a reciprocating direction of inkjet printhead movement. The ink via has two sides and a longitudinal extent substantially parallel to a print medium advance direction. A column of fluid firing elements exists exclusively along a single side of the two sides. The heater chip and ink via each have a centroid and neither resides coincidentally with one another. Preferably, the heater chip centroid resides externally to a boundary of the ink via. In other aspects, the column of fluid firing elements can be a sole column or plural and may be centered in the reciprocating direction. The ink via can be a sole via or plural. The heater chip can be rectangular and the ink vias can be closer to either the long or short ends thereof. Inkjet printers for housing the printheads are also disclosed.

Abstract: An ink jet heater chip having improved thermal. The chip includes a semiconductor substrate, a first metal resistive, a second metal conductive layer on a first portion of the resistive layer and on a second portion of the resistive layer defining a heater resistor element. A passivation layer having a thickness defined by a deposition process is deposited on the second metal conductive layer and heater resistor element. A cavitation layer is deposited on the passivation layer and etched. A dielectric layer is deposited and etched to provide a dielectric layer overlying the first portion of the resistive layer. An electrical conduit via is etched in the dielectric layer. A third metal conductive layer is deposited in the via for electrical contact with the second metal conductive layer. Separately deposited dielectric and passivation layers enable independent control of the thickness of the dielectric and passivation layers.

Abstract: An ink jet printing apparatus forms a printed image on a print medium based on image data. The apparatus includes an ink jet print head having ink ejection nozzles in a nozzle array. Ink is ejected from the nozzles and onto the print medium as the print head scans across the print medium in a scan direction, thereby forming the image on the print medium. The nozzle array on the print head includes a first substantially columnar array of nozzles aligned with a print medium advance direction which is perpendicular to the scan direction. The first array has a first upper subarray pair that includes a first upper left and a first upper right subarray of nozzles. The first upper left and a first upper right subarrays each include a substantially linear arrangement of n number of nozzles having equal nozzle-to-nozzle spacings. The nozzle-to-nozzle spacing in the first upper right subarray is equivalent to the nozzle-to-nozzle spacing in the first upper left subarray.

Abstract: A micro-miniature fluid ejecting device. The fluid ejecting device includes a semiconductor substrate having fluid ejectors formed on a surface of the substrate. A flexible circuit is fixedly attached to the semiconductor substrate. The flexible circuit has power contacts for providing power to the fluid ejectors. At least one drive circuit is connected to the fluid ejectors. The drive circuit is disposed on one of the semiconductor substrate and the flexible circuit. A fluid sequencer is connected to the drive circuit for selectively activating the fluid ejectors. The fluid sequencer is also disposed on one of the semiconductor substrate and the flexible circuit. The semiconductor substrate is attached to a housing. A fluid source is provided for supplying fluid to the semiconductor substrate for ejection by the fluid ejectors. The fluid ejecting device provides low cost construction for application specific miniature fluid jetting devices.

Abstract: An integrated circuit in an ink jet printhead selectively activates one or more printing elements on the printhead based on a multi-dimensional addressing scheme. The integrated circuit includes a plurality of pass switching, power switching, and one or more ground switching devices for selectively connecting one or more power switching devices to ground to activate one or more of the printing elements to print an image on a print medium. The integrated circuit includes a number of first, second, third, and fourth control lines for selectively controlling the activation of one or more of the printing elements.

Abstract: The invention provides a method for reducing ink corrosion of exposed metal layers on a chip surface of a semiconductor chip for an ink jet printhead. The method includes depositing a protective layer in a plasma process to the chip surface, the protective layer being deposited adjacent ink ejectors so that the protective layer substantially circumscribes an ink via in the chip. A thick film layer is applied to the protective layer and chip, whereby the protective layer and thick film layer are sufficient to promote increased adhesion between the thick film layer and a nozzle plate attached to the thick film layer thereby substantially reducing a tendency for the nozzle plate and thick film layer to delaminate from one another during printhead manufacture or use and interrupting contact between ink and the exposed metal layers on the chip surface.

Abstract: A heater chip has a substrate with one inner and two outer ink vias adjacently arranged. Each via has a first and second longitudinal side. A plurality of heaters, formed by thin film layers, are grouped together in six rows where two of the six rows are arranged adjacent to the first longitudinal side of one of the two outer ink vias, two rows are arranged adjacent to either the first or second longitudinal side of the inner via, and two rows are arranged adjacent to the second longitudinal side of the other of the two outer ink vias. Each of the first, second, and third two rows have one row of near heaters and one row of far heaters. The near heaters are closer in distance to their respective ink via than the far heaters. Printheads containing the heater chip and printers are also disclosed.

Abstract: The invention provides a method for reducing ink corrosion of exposed metal layers on a chip surface of a semiconductor chip for an ink jet printhead. The method includes depositing a protective layer in a plasma process to the chip surface, the protective layer being deposited adjacent ink ejectors so that the protective layer substantially circumscribes an ink via in the chip. A thick film layer is applied to the protective layer and chip, whereby the protective layer and thick film layer are sufficient to promote increased adhesion between the thick film layer and a nozzle plate attached to the thick film layer thereby substantially reducing a tendency for the nozzle plate and thick film layer to delaminate from one another during printhead manufacture or use and interrupting contact between ink and the exposed metal layers on the chip surface.

Abstract: The present invention is directed toward an improved heater chip for an ink jet printer. The heater chip has a diamond-like-carbon coating that functions as the cavitation and passivation layers of the heating elements on the heater chip. To improve the efficiency of the heater chip, the diamond-like-carbon coating is surrounded by a material that has a lower thermal conductivity than diamond. This surrounding layer limits thermal diffusion from the heating elements into the heater chip. A smoothing layer of tantalum is deposited over the diamond-like-carbon layer to insure that vaporization of the ink occurs at the ink's superheat limit. The diamond-like-carbon layer is preferably less than 8700 Angstroms in thickness such that less than 1 microjoule of energy is required to expel of ink droplet having a mass between 2-4 nanograms.

Abstract: An n-bit serial shift register in an ink jet print head operates in a print mode or a test mode. When the shift register is operating in the print mode, n bits of print data are serially scanned into n number of bit registers and are then latched out to heater addressing logic circuitry in the print head to control a print operation. When the circuit is operating in the test mode, x bits of test point data from x number of test nodes in the print head are loaded in parallel into x number of the n number of bit registers, and are then serially scanned out to a test data output. In this manner, a single shift register may be used to scan in print data and scan out test data, thereby providing observability and controllability of the internal logic nodes of the print head while minimizing logic size and the number of input/output connections on the print head.

Abstract: A heater chip for use in an inkjet printer which includes a single conductive layer to provide electrical connectivity between power and ground inputs. Wherein the unique power distribution architecture is possible by the formation of a plurality of ink vias in the heater chip which provides for an increase in the chip surface area available for electrical connectivity.