Abstract: Systems and methods for introducing DC bias in a radio frequency (RF) signal communicated over a transmission line are provided. In one example implementation, the RF system can include a transmission line having a first port and a second port. The transmission line can be configured to communicate an RF signal between a first port and a second port. One or more DC bias resistors can be coupled to the transmission line at a location between the first port and the second port. Each DC bias resistor can provide a path for injecting DC current to the transmission line to provide DC bias for the RF signal. Each DC bias resistor can be coupled to the transmission line via a point connection.

Abstract: Systems and methods for introducing DC bias in a radio frequency (RF) signal communicated over a transmission line are provided. In one example implementation, the RF system can include a transmission line having a first port and a second port. The transmission line can be configured to communicate an RF signal between a first port and a second port. One or more DC bias resistors can be coupled to the transmission line at a location between the first port and the second port. Each DC bias resistor can provide a path for injecting DC current to the transmission line to provide DC bias for the RF signal. Each DC bias resistor can be coupled to the transmission line via a point connection.

Abstract: A modular electronic assembly and a method for making a modular electronic assembly are disclosed. The subject modular electronic assembly is constructed in such a way as to maximize available surface area on printed wiring boards by incorporating pretested discrete passive elements within the body of such printed wiring boards and electrically connecting the elements in a volume-efficient manner. A modular electronic assembly constructed according to the presently disclosed subject matter is formed by arranging a plurality of diverse, pretested passive components between a plurality of copper and tacky epoxy sheets, holding the passive components in place by an epoxy resin layer and electrically connecting the components together by electrical vias penetrating the tacky epoxy layers.

Abstract: A transmission line capacitor includes at least two side-by-side capacitor portions spaced apart between a separating portion all contained in a single monolithic body. Such transmission line capacitors provide specific capacitor functionality for parallel transmission lines in a printed circuit board environment, while also maintaining a desired impedance value between the transmission paths. The transmission line capacitors offer both biasing functionality for blocking undesired DC voltages as well as AC coupling functionality for passing AC voltage signals with preserved data integrity. A first embodiment may be formed with a dielectric material having a relatively low dielectric constant, allowing high capacitor “height” with fixed spacing between distinct capacitive structures. Another embodiment may be formed with a relative high K dielectric and then slotted with an air gap between capacitive structures.

Abstract: A modular electronic assembly and a method for making a modular electronic assembly are disclosed. The subject modular electronic assembly is constructed in such a way as to maximize available surface area on printed wiring boards by incorporating pretested discrete passive elements within the body of such printed wiring boards and electrically connecting the elements in a volume-efficient manner. A modular electronic assembly constructed according to the presently disclosed subject matter is formed by arranging a plurality of diverse, pretested passive components between a plurality of copper and tacky epoxy sheets, holding the passive components in place by an epoxy resin layer and electrically connecting the components together by electrical vias penetrating the tacky epoxy layers.

Abstract: A transmission line capacitor includes at least two side-by-side capacitor portions spaced apart between a separating portion all contained in a single monolithic body. Such transmission line capacitors provide specific capacitor functionality for parallel transmission lines in a printed circuit board environment, while also maintaining a desired impedance value between the transmission paths. The transmission line capacitors offer both biasing functionality for blocking undesired DC voltages as well as AC coupling functionality for passing AC voltage signals with preserved data integrity. A first embodiment may be formed with a dielectric material having a relatively low dielectric constant, allowing high capacitor “height” with fixed spacing between distinct capacitive structures. Another embodiment may be formed with a relative high K dielectric and then slotted with an air gap between capacitive structures.