Abstract: A lamination apparatus, system, and method. The apparatus, system and method are for a lamination press for laminating at least one laminating film to a subject, which may include: an upper press comprising a gel plate, an upper vacuum chamber, and tooling suitable to apply the laminating film; a lower press suitable to maintain the subject to receive the laminating film, and comprising a lower vacuum chamber, an air bearing stage, and servo-positioned tooling; and an aligner that applies the servo-positioned tooling to maintain positional balance and alignment of the subject by the air bearing stage during the laminating while enabling vertical flexure of the lower press, wherein the positional balance and alignment is substantially continuously monitored by a controller.

Abstract: A lamination apparatus, system, and method. The apparatus, system and method are for a lamination press for laminating at least one laminating film to a subject, which may include: an upper press comprising a gel plate, an upper vacuum chamber, and tooling suitable to apply the laminating film; a lower press suitable to maintain the subject to receive the laminating film, and comprising a lower vacuum chamber, an air bearing stage, and servo-positioned tooling; and an aligner that applies the servo-positioned tooling to maintain positional balance and alignment of the subject by the air bearing stage during the laminating while enabling vertical flexure of the lower press, wherein the positional balance and alignment is substantially continuously monitored by a controller.

Abstract: A lamination apparatus, system, and method. The apparatus, system and method are for a lamination press for laminating at least one laminating film to a subject, which may include: an upper press comprising a gel plate, an upper vacuum chamber, and tooling suitable to apply the laminating film; a lower press suitable to maintain the subject to receive the laminating film, and comprising a lower vacuum chamber, an air bearing stage, and servo-positioned tooling; and an aligner that applies the servo-positioned tooling to maintain positional balance and alignment of the subject by the air bearing stage during the laminating while enabling vertical flexure of the lower press, wherein the positional balance and alignment is substantially continuously monitored by a controller.

Abstract: An apparatus, system and method for providing a clamping system for a part associated with a pallet. The apparatus, system and method may include: two opposing jaws on the pallet, each comprising a gripper for gripping the part, and a jaw base. The jaw base may include: gearing that synchronizes actuation of the opposing jaws; and a roller distal from the gripper. The part-clamp may also include: a centering spring that compresses to put pressure against the other of the opposing jaws; and a cam off the pallet, comprising a cam shaft that drives a cam face into the rollers to actuate the two grippers.

Abstract: A lamination apparatus, system, and method. The apparatus, system and method are for a lamination press for laminating at least one laminating film to a subject, which may include: an upper press comprising a gel plate, an upper vacuum chamber, and tooling suitable to apply the laminating film; a lower press suitable to maintain the subject to receive the laminating film, and comprising a lower vacuum chamber, an air bearing stage, and servo-positioned tooling; and an aligner that applies the servo-positioned tooling to maintain positional balance and alignment of the subject by the air bearing stage during the laminating while enabling vertical flexure of the lower press, wherein the positional balance and alignment is substantially continuously monitored by a controller.

Abstract: The disclosure provides an apparatus, system and method for a moveable bearing stage that allows for highly refined alignment and placement, and particularly planar alignment and placement, of component or devices through the use of robotics.

Abstract: The disclosure provides an apparatus, system and method for a moveable bearing stage that allows for highly refined alignment and placement, and particularly planar alignment and placement, of component or devices through the use of robotics.

Abstract: The disclosure provides an apparatus, system and method for a moveable bearing stage that allows for highly refined alignment and placement, and particularly planar alignment and placement, of component or devices through the use of robotics.

Abstract: A lamination apparatus, system, and method. The apparatus, system and method are for a lamination press for laminating at least one laminating film to a subject, which may include: an upper press comprising a gel plate, an upper vacuum chamber, and tooling suitable to apply the laminating film; a lower press suitable to maintain the subject to receive the laminating film, and comprising a lower vacuum chamber, an air bearing stage, and servo-positioned tooling; and an aligner that applies the servo-positioned tooling to maintain positional balance and alignment of the subject by the air bearing stage during the laminating while enabling vertical flexure of the lower press, wherein the positional balance and alignment is substantially continuously monitored by a controller.

Abstract: The disclosure provides an apparatus, system and method for a moveable bearing stage that allows for highly refined alignment and placement, and particularly planar alignment and placement, of component or devices through the use of robotics.

Abstract: An apparatus, system and method for providing a Bernoulli-based wafer pre-aligner. The pre-aligner may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; and a plurality of Bernoulli pads on the wafer support for providing an interface between the wafer support and a one of the semiconductor wafers, wherein the interface comprises a gap there between.

Abstract: An apparatus, system and method for providing a Bernoulli-based wafer pre-aligner. The pre-aligner may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; and a plurality of Bernoulli pads on the wafer support for providing an interface between the wafer support and a one of the semiconductor wafers, wherein the interface comprises a gap there between.