Patents by Inventor George Krajewski

George Krajewski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7578194
    Abstract: A differential liquid pressure sensor (10) has an upper housing (12) that mounts a connector portion (12a) and receives in a recess a sense element module (14). The sense element module is a body in which a generally U-shaped oil filled passageway (14h) is formed with openings at opposite ends provided on respective first and second diaphragm mounting surfaces. A fluid pressure sense element, such as a piezoresistive sense element (15) is disposed in one of the passageway openings and flexible metal diaphragms (14a, 14b) are mounted on the respective diaphragm mounting surfaces of the module facing a common direction. A lower housing (18) having first and second port connections for the respective diaphragms is disposed on the lower surface of the module.
    Type: Grant
    Filed: February 11, 2008
    Date of Patent: August 25, 2009
    Assignee: Sensata Technologies, Inc.
    Inventors: Costas Hadjiloucas, Andrew Willner, Andrew Amatruda, George Krajewski
  • Publication number: 20090199647
    Abstract: A differential liquid pressure sensor (10) has an upper housing (12) that mounts a connector portion (12a) and receives in a recess a sense element module (14). The sense element module is a body in which a generally U-shaped oil filled passageway (14h) is formed with openings at opposite ends provided on respective first and second diaphragm mounting surfaces. A fluid pressure sense element, such as a piezoresistive sense element (15) is disposed in one of the passageway openings and flexible metal diaphragms (14a, 14b) are mounted on the respective diaphragm mounting surfaces of the module facing a common direction. A lower housing (18) having first and second port connections for the respective diaphragms is disposed on the lower surface of the module.
    Type: Application
    Filed: February 11, 2008
    Publication date: August 13, 2009
    Inventors: Costas Hadjiloucas, Andrew Willner, Andrew Amatruda, George Krajewski