Patents by Inventor George Kren
George Kren has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9194812Abstract: The disclosure is directed to a system and method of managing illumination energy applied to illuminated portions of a scanned wafer to mitigate illumination-induced damage without unnecessarily compromising SNR of an inspection system. The wafer may be rotated at a selected spin frequency for scanning wafer defects utilizing the inspection system. Illumination energy may be varied over at least one scanned region of the wafer as a function of radial distance of an illuminated portion from the center of the wafer and the selected spin frequency of the wafer. Illumination energy may be further applied constantly over one or more scanned regions of the wafer beyond a selected distance from the center of the wafer.Type: GrantFiled: July 21, 2014Date of Patent: November 24, 2015Assignee: KLA-Tencor CorporationInventors: Christian Wolters, Aleksey Petrenko, Kurt L. Haller, Juergen Reich, Zhiwei Xu, Stephen Biellak, George Kren
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Patent number: 9052190Abstract: A method of providing high accuracy inspection or metrology in a bright-field differential interference contrast (BF-DIC) system is described. This method can include creating first and second beams from a first light beam. The first and second beams have round cross-sections, and form first partially overlapping scanning spots radially displaced on a substrate. Third and fourth beams are created from the first light beam or a second light beam. The third and fourth beams have elliptical cross-sections, and form second partially overlapping scanning spots tangentially displaced on the substrate. At least one portion of the substrate can be scanned using the first and second partially overlapping scanning spots as the substrate is rotated. Radial and tangential slopes can be determined using measurements obtained from the scanning using the first and second partially overlapping scanning spots. These slopes can be used to determine wafer shape or any localized topography feature.Type: GrantFiled: March 12, 2013Date of Patent: June 9, 2015Assignee: KLA-Tencor CorporationInventors: Ali Salehpour, Jaydeep Sinha, Kurt Lindsay Haller, Pradeep Vukkadala, George Kren, Jiayao Zhang, Mehdi Vaez-Iravani
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Publication number: 20140328043Abstract: The disclosure is directed to a system and method of managing illumination energy applied to illuminated portions of a scanned wafer to mitigate illumination-induced damage without unnecessarily compromising SNR of an inspection system. The wafer may be rotated at a selected spin frequency for scanning wafer defects utilizing the inspection system. Illumination energy may be varied over at least one scanned region of the wafer as a function of radial distance of an illuminated portion from the center of the wafer and the selected spin frequency of the wafer. Illumination energy may be further applied constantly over one or more scanned regions of the wafer beyond a selected distance from the center of the wafer.Type: ApplicationFiled: July 21, 2014Publication date: November 6, 2014Inventors: Christian Wolters, Aleksey Petrenko, Kurt L. Haller, Juergen Reich, Zhiwei Xu, Stephen Biellak, George Kren
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Publication number: 20140268172Abstract: A method of providing high accuracy inspection or metrology in a bright-field differential interference contrast (BF-DIC) system is described. This method can include creating first and second beams from a first light beam. The first and second beams have round cross-sections, and form first partially overlapping scanning spots radially displaced on a substrate. Third and fourth beams are created from the first light beam or a second light beam. The third and fourth beams have elliptical cross-sections, and form second partially overlapping scanning spots tangentially displaced on the substrate. At least one portion of the substrate can be scanned using the first and second partially overlapping scanning spots as the substrate is rotated. Radial and tangential slopes can be determined using measurements obtained from the scanning using the first and second partially overlapping scanning spots. These slopes can be used to determine wafer shape or any localized topography feature.Type: ApplicationFiled: March 12, 2013Publication date: September 18, 2014Inventors: Ali Salehpour, Jaydeep Sinha, Kurt Lindsay Haller, Pradeep Vukkadala, George Kren, Jiayao Zhang, Mehdi Vaez-Iravani
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Patent number: 8786850Abstract: The disclosure is directed to a system and method of managing illumination energy applied to illuminated portions of a scanned wafer to mitigate illumination-induced damage without unnecessarily compromising SNR of an inspection system. The wafer may be rotated at a selected spin frequency for scanning wafer defects utilizing the inspection system. Illumination energy may be varied over at least one scanned region of the wafer as a function of radial distance of an illuminated portion from the center of the wafer and the selected spin frequency of the wafer. Illumination energy may be further applied constantly over one or more scanned regions of the wafer beyond a selected distance from the center of the wafer.Type: GrantFiled: October 29, 2012Date of Patent: July 22, 2014Assignee: KLA-Tencor CorporationInventors: Christian Wolters, Aleksey Petrenko, Kurt L. Haller, Juergen Reich, Zhiwei Xu, Stephen Biellak, George Kren
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Patent number: 8494802Abstract: Computer-implemented methods, computer-readable media, and systems for determining one or more characteristics of a wafer are provided.Type: GrantFiled: June 19, 2009Date of Patent: July 23, 2013Assignee: KLA-Tencor Corp.Inventors: Haiguang Chen, Daniel Kavaldjiev, Louis Vintro, George Kren
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Patent number: 8432944Abstract: Disclosed herein is a method and apparatus for automatic correction of beam waist position drift in real time, using wafer inspection data taken during normal tool operation. Also disclosed herein is an improved laser astigmatism corrector for use either internal or external to the laser.Type: GrantFiled: June 6, 2011Date of Patent: April 30, 2013Assignee: KLA-Technor CorporationInventors: Anatoly Romanovsky, George Kren, Bret Whiteside
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Publication number: 20110315897Abstract: Disclosed herein is a method and apparatus for automatic correction of beam waist position drift in real time, using wafer inspection data taken during normal tool operation. Also disclosed herein is an improved laser astigmatism corrector for use either internal or external to the laser.Type: ApplicationFiled: June 6, 2011Publication date: December 29, 2011Inventors: Anatoly Romanovsky, George Kren, Bret Whiteside
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Patent number: 8068234Abstract: An interferometer system and method may be used to measure substrate thickness or shape. The system may include two spaced apart reference flats having that form an optical cavity between two parallel reference surfaces. A substrate holder may be configured to place the substrate in the cavity with first and second substrate surfaces substantially parallel with corresponding first and second reference surfaces such that a space between the first or second substrate surface is three millimeters or less from a corresponding one of the reference surfaces or a damping surface. Interferometer devices may be located on diametrically opposite sides of the cavity and optically coupled thereto. The interferometers can map variations in spacing between the substrate surfaces and the reference surfaces, respectively, through interference of light optically coupled to and from to the cavity via the interferometer devices.Type: GrantFiled: February 18, 2009Date of Patent: November 29, 2011Assignee: KLA-Tencor CorporationInventors: Shouhong Tang, George Kren, Dieter Mueller, Brian Haas, Daniel Kavaldjiev
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Publication number: 20110196639Abstract: Computer-implemented methods, computer-readable media, and systems for determining one or more characteristics of a wafer are provided.Type: ApplicationFiled: June 19, 2009Publication date: August 11, 2011Applicant: Kla-Tencor CorporationInventors: Haiguang Chen, Daniel Kavaldjiev, Louis Vintro, George Kren
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Publication number: 20100208272Abstract: An interferometer system and method may be used to measure substrate thickness or shape. The system may include two spaced apart reference flats having that form an optical cavity between two parallel reference surfaces. A substrate holder may be configured to place the substrate in the cavity with first and second substrate surfaces substantially parallel with corresponding first and second reference surfaces such that a space between the first or second substrate surface is three millimeters or less from a corresponding one of the reference surfaces or a damping surface. Interferometer devices may be located on diametrically opposite sides of the cavity and optically coupled thereto. The interferometers can map variations in spacing between the substrate surfaces and the reference surfaces, respectively, through interference of light optically coupled to and from to the cavity via the interferometer devices.Type: ApplicationFiled: February 18, 2009Publication date: August 19, 2010Applicant: KLA-Tencor CorporationInventors: Shouhong Tang, George Kren, Dieter Mueller, Brian Haas, Daniel Kavaldjiev
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Patent number: 7505144Abstract: A system and method for in-line inspection of specimens such as semiconductor wafers is provided. The system provides scanning of sections of specimens having predetermined standardized characteristics using a diffraction grating that widens and passes nth order (n>0) wave fronts to the specimen surface and a reflective surface for the transmitted light beam. Light energy is transmitted in a narrow swath across the portion of the surface having the standardized features. The wavefronts are combined using a second diffraction grating and passed to a camera system having a desired aspect ratio.Type: GrantFiled: October 18, 2004Date of Patent: March 17, 2009Assignee: KLA-Tencor Technologies CorporationInventors: Dieter Mueller, George Kren, Cedric Affentauschegg
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Publication number: 20090040514Abstract: A system for inspecting specimens such as semiconductor wafers is provided. The system provides scanning of dual-sided specimens using a damping arrangement which filters unwanted acoustic and seismic vibration, including an optics arrangement which scans a first portion of the specimen and a translation or rotation arrangement for translating or rotating the specimen to a position where the optics arrangement can scan the remaining portion(s) of the specimen. The system further includes means for stitching the scans together, thereby providing both damping of the specimen and the need for smaller and less expensive optical elements.Type: ApplicationFiled: October 7, 2008Publication date: February 12, 2009Applicant: KLA-Tencor Technologies CorporationInventors: Paul J. Sullivan, George Kren, Rodney C. Smedt, Hans J. Hansen, David W. Shortt, Daniel Ivanov Kavaldjiev, Christopher F. Bevis
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Patent number: 7477371Abstract: A light beam is directed towards a surface along a direction normal to the surface. The surface is caused to move so that the beam scans the surface along a spiral path. An ellipsoidal mirror is placed with its axis along the surface normal to collect light scattered by the surface and any anomalies at the surface at collection angles away from the surface normal. In some applications, a lens arrangement with its axis along the surface normal is also used to collect the light scattered by the surface and any anomalies. The light scattered by the mirror and lenses may be directed to the same or different detectors. Preferably light scattered by the surface within a first range of collection angles from the axis is detected by a first detector and light scattered by the surface within a second range of collection angles from the axis is detected by a second detector.Type: GrantFiled: August 15, 2006Date of Patent: January 13, 2009Assignee: KLA-Tencor CorporationInventors: Norbert Marxer, Kenneth P. Gross, Hubert Altendorfer, George Kren
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Patent number: 7436506Abstract: A system for inspecting specimens such as semiconductor wafers is provided. The system provides scanning of dual-sided specimens using a damping arrangement which filters unwanted acoustic and seismic vibration, including an optics arrangement which scans a first portion of the specimen and a translation or rotation arrangement for translating or rotating the specimen to a position where the optics arrangement can scan the remaining portion(s) of the specimen. The system further includes means for stitching the scans together, thereby providing both damping of the specimen and the need for smaller and less expensive optical elements.Type: GrantFiled: March 1, 2006Date of Patent: October 14, 2008Assignee: KLA-Tencor CorporationInventors: Paul J. Sullivan, George Kren, Rodney C. Smedt, Hans J. Hansen, David W. Shortt, Daniel Ivanov Kavaldjiev, Christopher F. Bevis
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Patent number: 7417724Abstract: Wafer inspection systems and methods are provided. One inspection system includes a module measurement cell coupled to a host inspection system by a wafer handler. The module measurement cell is configured to inspect a wafer using one or more modes prior to inspection of the wafer by the host inspection system. The one or more modes include backside inspection, edge inspection, frontside macro defect inspection, or a combination thereof. Another inspection system includes two or more low resolution electronic sensors arranged at multiple viewing angles. The sensors are configured to detect light returned from a wafer substantially simultaneously. A method for analyzing inspection data includes selecting a template corresponding to a support device that contacts a backside of a wafer prior to inspection of the backside of the wafer. The method also includes subtracting data representing the template from inspection data generated by inspection of the backside of the wafer.Type: GrantFiled: May 10, 2007Date of Patent: August 26, 2008Assignee: KLA-Tencor Technologies Corp.Inventors: Paul Sullivan, George Kren, Eliezer Rosengaus, Patrick Huet, Robinson Piramuthu, Martin Plihal, Yan Xiong
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Patent number: 7227628Abstract: Wafer inspection systems and methods are provided. One inspection system includes a module measurement cell coupled to a host inspection system by a wafer handler. The module measurement cell is configured to inspect a wafer using one or more modes prior to inspection of the wafer by the host inspection system. The one or more modes include backside inspection, edge inspection, frontside macro defect inspection, or a combination thereof. Another inspection system includes two or more low resolution electronic sensors arranged at multiple viewing angles. The sensors are configured to detect light returned from a wafer substantially simultaneously. A method for analyzing inspection data includes selecting a template corresponding to a support device that contacts a backside of a wafer prior to inspection of the backside of the wafer. The method also includes subtracting data representing the template from inspection data generated by inspection of the backside of the wafer.Type: GrantFiled: October 12, 2004Date of Patent: June 5, 2007Assignee: KLA-Tencor Technologies Corp.Inventors: Paul Sullivan, George Kren, Eliezer Rosengaus, Patrick Huet, Robinson Piramuthu, Martin Plihal, Yan Xiong
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Publication number: 20070103676Abstract: A light beam is directed towards a surface along a direction normal to the surface. The surface is caused to move so that the beam scans the surface along a spiral path. An ellipsoidal mirror is placed with its axis along the surface normal to collect light scattered by the surface and any anomalies at the surface at collection angles away from the surface normal. In some applications, a lens arrangement with its axis along the surface normal is also used to collect the light scattered by the surface and any anomalies. The light scattered by the mirror and lenses may be directed to the same or different detectors. Preferably light scattered by the surface within a first range of collection angles from the axis is detected by a first detector and light scattered by the surface within a second range of collection angles from the axis is detected by a second detector.Type: ApplicationFiled: August 15, 2006Publication date: May 10, 2007Applicant: KLA-Tencor CorporationInventors: Norbert Marxer, Kenneth Gross, Hubert Altendorfer, George Kren
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Publication number: 20060232770Abstract: A system for inspecting specimens such as semiconductor wafers is provided. The system provides scanning of dual-sided specimens using a damping arrangement which filters unwanted acoustic and seismic vibration, including an optics arrangement which scans a first portion of the specimen and a translation or rotation arrangement for translating or rotating the specimen to a position where the optics arrangement can scan the remaining portion(s) of the specimen. The system further includes means for stitching the scans together, thereby providing both damping of the specimen and the need for smaller and less expensive optical elements.Type: ApplicationFiled: March 1, 2006Publication date: October 19, 2006Inventors: Paul Sullivan, George Kren, Rodney Smedt, Hans Hansen, David Shortt, Daniel Kavaldjiev, Christopher Bevis
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Patent number: 7102744Abstract: A light beam is directed towards a surface along a direction normal to the surface. The surface is caused to move so that the beam scans the surface along a spiral path. An ellipsoidal mirror is placed with its axis along the surface normal to collect light scattered by the surface and any anomalies at the surface at collection angles away from the surface normal. In some applications, a lens arrangement with its axis along the surface normal is also used to collect the light scattered by the surface and any anomalies. The light scattered by the mirror and lenses may be directed to the same or different detectors. Preferably light scattered by the surface within a first range of collection angles from the axis is detected by a first detector and light scattered by the surface within a second range of collection angles from the axis is detected by a second detector.Type: GrantFiled: July 10, 2003Date of Patent: September 5, 2006Assignee: KLA-Tencor CorporationInventors: Norbert Marxer, Kenneth P. Gross, Hubert Altendorfer, George Kren