Patents by Inventor George Lin Huikai

George Lin Huikai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Transistor outline package
    Patent number: 8908728
    Abstract: A transistor outline package with integrated thermoelectric cooler is disclosed. The thermoelectric cooler is arranged on a heatsink which extends vertically into the housing of the transistor outline package.
    Type: Grant
    Filed: July 8, 2013
    Date of Patent: December 9, 2014
    Assignee: Schott AG
    Inventors: George Lin Huikai, Amy Soon Li Ping, Tetsushi Morikawa, Rohit Bhosale, Shaifullah Bin Mohamed Kamari