Abstract: A wafer packaging system for clean packaging and damage-free transporting of semiconductor wafers. The system includes tubular outer and inner containers, the inner container adapted to be contained by the outer container with the longitudinal axes of both containers extending in the same axial direction. The inner container includes provision for holding a plurality of the semiconductor wafers in spaced face-to-face relationship. The system provides a sealed container arrangement preventing contaminants outside the outer container from contaminating wafers within the inner container. Shock-absorbing features associated with the containers prevent shocks applied to the outer container from damaging the wafers.