Abstract: An example frame shuffle is communicatively coupled to a midplane of a frame. The frame shuffle includes a first group of optical connectors. Each of which are communicatively coupled to a resource device via the midplane. The frame shuffle also includes a second group of optical connectors, each of which communicatively couples with a frame shuffle of an adjacent frame. The frame shuffle also includes a routing device to optically interconnect the resource devices and another group of resource devices of the adjacent frame. The frame shuffle also includes a frame shuffle fan to provide fresh air through the frame shuffle and direct exhaust air through the midplane.

Abstract: One example of a system includes a blade enclosure and a midplane within the blade enclosure. The midplane supports a first sleeve connector and a second sleeve connector, where each of the first and second sleeve connectors have a first side and a second side. A server blade installed in the blade enclosure includes an air duct coupled to the first side of the first sleeve connector. A cooling module including an air manifold is coupled to the second side of the first sleeve connector to deliver cool air to the air duct of the server blade.

Abstract: An example electro-optical connector may comprise an optical ferrule to optically engage with a complementary optical ferrule on a complementary electro-optical connector, a first conductive guide post disposed adjacent to the optical ferrule to electrically engage with a first guide pocket of the complementary electro-optical connector, and a second conductive guide post disposed on an opposite side of the optical ferrule from the first conductive guide post and to electrically engage with a second guide pocket of the complementary electro-optical connector. The first and second conductive guide posts may align the optical ferrule for engagement with the complementary optical ferrule when the guide posts are engaged with the respective guide pockets, and the first and second conductive guide posts may conduct an electrical signal or electrical power from the electro-optical connector to the complementary electro-optical connector.

Abstract: One example of a system includes a system board including first contacts and second contacts and a cage attached to the system board. The cage includes a first side over the first contacts and a second side over the second contacts. A first lever is coupled to the first side of the cage and pivotable with respect to the cage. A second lever is coupled to the second side of the cage and pivotable with respect to the cage. A removable transceiver module includes third contacts. The transceiver module is installable in at least one of the first side and the second side of the cage using at least one of the first lever and the second lever.

Abstract: One example of a multi-chip module includes a substrate, a semiconductor chip, and an optical transceiver. The substrate has a first side and a second side opposite the first side. The semiconductor chip is electrically coupled to the first side of the substrate. The optical transceiver is electrically coupled to the second side of the substrate.

Abstract: An example frame shuffle is communicatively coupled to a midplane of a frame. The frame shuffle includes a first group of optical connectors. Each of which are communicatively coupled to a resource device via the midplane. The frame shuffle also includes a second group of optical connectors, each of which communicatively couples with a frame shuffle of an adjacent frame. The frame shuffle also includes a routing device to optically interconnect the resource devices and another group of resource devices of the adjacent frame. The frame shuffle also includes a frame shuffle fan to provide fresh air through the frame shuffle and direct exhaust air through the midplane.

Abstract: One example of a multi-chip module includes a substrate, a semiconductor chip, and an optical transceiver. The substrate has a first side and a second side opposite the first side. The semiconductor chip is electrically coupled to the first side of the substrate. The optical transceiver is electrically coupled to the second side of the substrate.

Abstract: One example of a system includes a blade enclosure and a midplane within the blade enclosure. The midplane supports a first sleeve connector and a second sleeve connector, where each of the first and second sleeve connectors have a first side and a second side. A server blade installed in the blade enclosure includes an air duct coupled to the first side of the first sleeve connector. A cooling module including an air manifold is coupled to the second side of the first sleeve connector to deliver cool air to the air duct of the server blade.

Abstract: A socket (130) employs a substrate (310) including a conductive network. An array of first contacts (136) is on a top surface of the substrate (310) and arranged to engage an integrated circuit (110). An array of second contacts (138) is on a bottom surface of the substrate (310) and arranged to engage a circuit board (120). The conductive network electrically connects the first contacts (136) respectively to the second contacts (138), and the first contacts (136) include a routed first contact (136?) that the conductive network routes horizontally in or on the substrate (310).

Abstract: A socket (130) employs a substrate (310) including a conductive network. An array of first contacts (136) is on a top surface of the substrate (310) and arranged to engage an integrated circuit (110). An array of second contacts (138) is on a bottom surface of the substrate (310) and arranged to engage a circuit board (120). The conductive network electrically connects the first contacts (136) respectively to the second contacts (138), and the first contacts (136) include a routed first contact (136?) that the conductive network routes horizontally in or on the substrate (310).

Abstract: A flexible grounding strip comprising an electrically conductive strip having an elongated base, opposite sides of which extend to respective flanges spaced from the base. Each flange extends from one side of the base and terminates at an edge generally facing the opposed side of the base. The edges are spaced from each other. Each of the opposite sides have lengthwise spaced slots extending partly across the base towards the opposite side of the base. The slots extending from one side of the base are interleaved with slots extending from the opposite side of the base.

Abstract: A memory package comprising a first cover portion connected to a second cover portion. The first cover portion supports a first electronics sub-assembly that comprise a circuit board with at least one memory module socket and at least one controller chip mounted thereto. The second cover portion supports a second electronics sub-assembly that comprises a circuit board with at least one memory module socket and at least one controller chip mounted thereto. The first and second cover portions are moveable between a closed position wherein the electronics sub-assemblies are nested and an open position wherein the electronics sub-assemblies are not nested.

Abstract: According to one embodiment, the present invention includes a first electrical connector located on a computer component and a biasing mechanism having a leverage member, such that actuation of the leverage member biases the first electrical connector between engaged and disengaged positions with respect to a second electrical connector separate from the computer component.

Abstract: A flexible grounding strip comprises an elongated electrically conductive strip having a base extending between spaced, opposed sidewalls. At least one of the sidewalls has a flange spaced from the base and extending towards the opposed sidewall. Each of the sidewalls has a series of lengthwise-spaced slots extending widthwise across the sidewall into and at least partly across the base towards the opposed sidewall. The slot dimensions and spacing impart flexibility to enable the strip to bend transversely of its length.

Abstract: A memory package comprising a first circuit board having a plurality of memory element sockets and a second circuit board coupled to the first circuit board and comprising a controller chip. The first and second circuit boards are disposed within a tray having a base and two sides. A handle is connected to the tray such that the handle is pivotal with respect to the tray. The handle has a lever system and latch that is slidably engaged with the lever system.

Abstract: A mounting device for securing an electronic device to an equipment rack includes a mounting member and a securing device mounted on an end thereof.

Abstract: A system for facilitating the mounting of circuit boards within an enclosure. The system includes one or more standoffs that are each received through appropriately formed corresponding openings through a printed circuit board. A flexible clip is attached to the printed circuit board proximate each opening. Each clip includes a retainer portion designed to receive the head of the standoff. Thus, the printed circuit board may be attached to the standoffs simply by placing the circuit board openings over the standoffs and moving the printed circuit board laterally until the clips and standoffs are engaged.

Abstract: A system for facilitating the mounting of circuit boards within an enclosure. The system includes one or more standoffs that are each received through appropriately formed corresponding openings through a printed circuit board. A flexible clip is attached to the printed circuit board proximate each opening. Each clip includes a retainer portion designed to receive the head of the standoff. Thus, the printed circuit board may be attached to the standoffs simply by placing the circuit board openings over the standoffs and moving the printed circuit board laterally until the clips and standoffs are engaged.

Abstract: A system for facilitating the mounting of circuit boards within an enclosure. The system includes one or more standoffs that are each received through appropriately formed corresponding openings through a printed circuit board. A flexible clip is attached to the printed circuit board proximate each opening. Each clip includes a retainer portion designed to receive the head of the standoff. Thus, the printed circuit board may be attached to the standoffs simply by placing the circuit board openings over the standoffs and moving the printed circuit board laterally until the clips and standoffs are engaged.

Abstract: A system for facilitating the mounting of circuit boards within an enclosure. The system includes one or more standoffs that are each received through appropriately formed corresponding openings through a printed circuit board. A flexible clip is attached to the printed circuit board proximate each opening. Each clip includes a retainer portion designed to receive the head of the standoff. Thus, the printed circuit board may be attached to the standoffs simply by placing the circuit board openings over the standoffs and moving the printed circuit board laterally until the clips and standoffs are engaged.