Abstract: The invention relates to a plasma processing reactor apparatus for semiconductor processing a substrate. The apparatus includes a chamber. The apparatus further includes a top electrode configured to be coupled to a first RF power source having a first RF frequency and a bottom electrode configured to be coupled to second RF power source having a second RF frequency that is lower than the first RF frequency. The apparatus additionally includes an insulating shroud that lines an interior of the chamber, the insulating shroud being configured to be electrically floating during the processing. The apparatus further includes a perforated plasma confinement ring disposed outside of an outer periphery of the bottom electrode, a top surface of the perforated plasma confinement ring being disposed below a top surface of the substrate and electrically grounded during the processing.

Abstract: A semiconductor manufacturing process wherein deep and narrow 0.6 micron and smaller openings are plasma etched in doped and undoped silicon oxide. The etching gas includes fluorocarbon, oxygen and nitrogen reactants which cooperate to etch the silicon oxide while providing enough polymer build-up to obtain anisotropically etched openings and avoid etch stop of etched openings having aspect ratios of 5:1 and higher. The process is useful for etching 0.25 micron and smaller contact or via openings and can be carried out in a parallel plate plasma reactor having a showerhead electrode.

Abstract: Disclosed is a method for improving the selectivity of dielectric layers to photoresist layers and base layers. The method is performed in a plasma processing chamber, and the photoresist layer is coated over the dielectric layer. The method includes introducing an etchant source gas into the plasma processing chamber, which consists essentially of a CxFy gas and an N.sub.2 gas. The method further includes striking a plasma in the plasma processing chamber from the etchant source gas. The method additionally includes etching at least a portion of the dielectric layer with the plasma through to a base layer that underlies the dielectric layer. The method is also well suited for anisotropically etching an oxide layer with very high selectivities to Si, Si.sub.3 N.sub.4, TiN, and metal silicides.

Abstract: A torsional twist wrist exercising device includes a pair of hand grips disposed in contiguous end-to-end relation on a common central longitudinal axis. The grips are operatively interconnected with each other so as to normally maintain their contiguous relation, but permitting rotative movements thereof relative to each other about their common axis. A central longitudinally extended shaft is affixed at one end to one of the grips and a central longitudinally extended bore is formed within the other grip for coaxially receiving said shaft. At least one torsion spring is supported upon the shaft and spring retaining members are provided for detachably securing one end of the spring to the shaft and the other end of the spring to the wall defining the interior surface of the bore. A cap member is provided for maintaining the contiguous end-to-end relation of the grips during exercising use.