Abstract: A formable or deformable material is pressed into place and in contact with the leads connected to semiconductor device. A connection is made through a snap or other device to ground or to some other suitable connection. With the deformable material in place, any static electricity appearing on the semiconductor device is dispersed to ground. In this way, static electricity building on a semiconductor device is prevented from being transferred to other connected devices and injury to those devices. The deformable material is electrically conductive and makes contact by being pressed into place around, or on to, exposed contact leads.