Abstract: An encapsulated OLED device includes a substrate having a predetermined glass seal area and defining a sealed region and one or more OLED unit(s) provided over the substrate, each OLED unit having a light-emitting portion including at least one first electrode, at least one second electrode spaced from the first electrode, and an organic EL media layer provided between the first and second electrodes, wherein the light-emitting portion is provided within the sealed region. The device also includes an inorganic protection layer provided over the glass seal area and over at least a portion of the sealed region, a cover provided over the substrate and OLED unit(s), and sintered glass frit seal material provided in the glass seal area and in contact with both the cover and the inorganic protection layer to bond the cover to the inorganic protection layer and provide sealing against moisture penetration into the sealed region.

Abstract: A method of encapsulating a plurality of OLED devices formed on a common substrate includes stacking a number of repeating assemblies of patterned layers over the OLED devices while leaving outermost portions of electrical interconnects of such encapsulated devices accessible for connecting electrical leads thereto.