Patents by Inventor George P. Schmitt

George P. Schmitt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fiber reinforced epoxy prepreg and fabrication thereof
    Patent number: 5143756
    Abstract: A dicyandiamide crosslinked epoxy prepreg substantially free from dicyandiamide crystals is obtained by subjecting an epoxy composition containing dicyandiamide to elevated temperature to thereby form a substantially prereacted product, adding solvents if desired, desolvating, and then thermally advancing the prereacted product to the desired state of crosslinking to thereby form the prepreg.
    Type: Grant
    Filed: August 27, 1990
    Date of Patent: September 1, 1992
    Assignee: International Business Machines Corporation
    Inventors: Michael J. Cibulsky, Kostas Papathomas, George P. Schmitt
  • Multiple wire photosensitive adhesive for wire embedment
    Patent number: 4855333
    Abstract: A high density dimensionally stable encapsulated wire circuit board and a method of making such a board is described. A photo-curable adhesive having a unique combination of rheological properties is utilized to bond insulated wires to a substrate. The unique combination of rheological properties of the adhesive used in the encapsulated wire circuit boards of this invention include a specified range of values for the Storage Shear Modulus and specified range of values for the Loss Angle ratio.A new photo-curable adhesive having these properties and a method of obtaining such an adhesive are also described.
    Type: Grant
    Filed: April 6, 1987
    Date of Patent: August 8, 1989
    Assignee: International Business Machines Corp.
    Inventors: William J. Rudik, George P. Schmitt, John F. Shipley
  • Circuit board including multiple wire photosensitive adhesive
    Patent number: 4544801
    Abstract: A high density dimensionally stable encapsulated wire circuit board and a method of making such a board is described. A photo-curable adhesive having a unique combination of rheological properties is utilized to bond insulated wires to a substrate. The unique combination of rheological properties of the adhesive used in the encapsulated wire circuit boards of this invention include a specified range of values for the Storage Shear Modulus and specified range of values for the Loss Angle ratio.
    Type: Grant
    Filed: August 9, 1984
    Date of Patent: October 1, 1985
    Assignee: International Business Machines Corporation
    Inventors: William J. Rudik, George P. Schmitt, John F. Shipley
  • Method and composition for applying coatings on printed circuit boards
    Patent number: 4479983
    Abstract: A coating is produced by a method including a screen printing of a photopolymerizable composition on a printed circuit board, illuminating said composition to partially polymerize it and bake it to complete the polymerization.The composition used by said method contains a reaction product of a monoethylenically unsaturated carboxylic acid with a material of the group of epoxy resin and epoxidized novolak, a phenoxy resin, a thickening agent, a polyethylenically unsaturated compound, a photo-initiator and a solvent.The coating produced according to this invention is used as solder mask.
    Type: Grant
    Filed: January 7, 1983
    Date of Patent: October 30, 1984
    Assignee: International Business Machines Corporation
    Inventors: Bernd K. Appelt, George P. Schmitt, John F. Shipley