Abstract: A semiconductor package including a conductive clip preferably in the shape of a can, a semiconductor die, and a conductive stack interposed between the die and the interior of the can which includes a conductive platform and a conductive adhesive body.

Abstract: A system and method for dispensing microbial solution into a drain line. The system includes a disposable cartridge adapted to hold a quantity of microbial solution. The cartridge may be provided to the end user containing only a dry mix of microbes in a carrier medium. The end user may then remove a replaceable tab covering a fill hole, fill the cartridge with clean water, and replace the tab. The cartridge may then be inserted into a dispensing assembly, which includes an actuator that engages a nozzle on the cartridge at regular intervals. When the actuator engages the nozzle, a small amount of microbial solution is dispensed and routed through a tube to the drain line. The tube may attach to the drain line through a self-tapping valve assembly.

Abstract: A power module that includes a power circuit assembly in which power components are electrically and mechanically connected without wires.

Abstract: An enterprise planning and performance management system provides a variable-based modeling technique that enables users to interact with a more manageable variable-centric front-end for complex enterprise planning software. The system enables users to specify a plurality of variable definitions via a variable-based user interface. Based on the plurality of variable definitions, the system generates, and in some instances automatically generates, model data that defines an enterprise planning model. The system uses the model data during subsequent enterprise planning sessions. Because model builders typically comprise financial analysts unfamiliar with traditional complex enterprise modeling techniques but familiar with common financial variables of an enterprise, this variable-based modeling technique may facilitate easier model building by allowing these financial analysts to generate model data from the perspective of the more readily understood variables.

Abstract: A semiconductor package including a conductive clip preferably in the shape of a can, a semiconductor die, and a conductive stack interposed between the die and the interior of the can which includes a conductive platform and a conductive adhesive body.

Abstract: A computer readable medium includes executable instruction to compare databases. The executable instructions are configured to identify when a segment of a first database is conditionally out of synchronization with a corresponding segment of a second database to establish a conditionally out of synchronization state at a first time. Executable instructions allow a latency period after the first time in which changes are made to the first database and the second database. Executable instructions also determine after the latency period whether the segment of the first database is in synchronization with the corresponding segment of the second database. Executable instructions also populate a resynchronization table, which is used by a replication mechanism to bring asynchronous rows into synchronization.

Abstract: A power module that includes a power circuit assembly in which power components are electrically and mechanically connected without wires.

Abstract: A substrate, which has semiconductor die arranged thereon, uses at least one solder flow stop, closely surrounding at least a portion of at least one mounting pad on which the die are mounted, to prevent die rotation during solder reflow. The at least one solder stop is non-wetting, during a solder reflow process, to solder used to mount the die.

Abstract: A plurality of semiconductor die, which may be of diverse size and diverse junction pattern, are fixed to a common lead frame and within a common package. The semiconductor die are mounted on respective main pad areas that are laterally spaced from one another and which have respective heat sinks. The heat sinks extend from the boundary of the device package and form external pins that are available for external connection at the same or at different potentials. Isolated pins are also provided. The device package may be used for high and low side chopper circuits, synchronous regulator circuits, single-mode bridges, and the like.