Abstract: A beam splitter for transmitting and deflecting light comprises a foil having a top surface and at least one hole therethrough. A highly reflective finish is provided on the top surface of the foil. Light is transmitted through the holes in the foil while other light is reflected from the reflective finish on the top surface.

Abstract: An industrial process oxygen analyzer, and method of using same, incorporates an automotive oxygen sensor to minimize the criticalness of controlling heater temperature during operation. Higher sensor heater temperature, required to accommodate the automotive oxygen sensor, is achieved by application of higher supply voltage to the sensor heater. Current limiting of the heater supply circuit reduces stress on the sensor heater, even at the higher operating temperature.

Abstract: A pneumatic servo comprises a motor having a shaft for rotation in response to an electrical signal. A cam is connected to the shaft for rotation therewith. The cam has an outer profiled periphery and opposite sides. A pneumatic nozzle having an opening for directing a flow of gas toward one side of the cam near the periphery, obscures the flow by different amounts as the cam rotates to create a back pressure in the nozzle comprising a pneumatic signal. A curved projection engages an opposite side of the cam, the projection being aligned with the nozzle opening and reducing oscillation excursions of the servo at gas pressures in the nozzle of above 12 psi.

Abstract: An arrangement for providing radio frequency and electromagnetic interference protection to at least part of circuitry mounted on a circuit board comprises alternating slots and bridges which form a boundary between a protected area of the circuit board and an unprotected area of the circuit board. The circuit portions which require protection are mounted in the protected area and are covered by a top cover having fingers which extend through the slots. Connecting lines between the protected and unprotected portions of the circuit portions extend along the bridges between the slots. A bottom cover engages under the protected area and mates to the top cover for providing electromagnetic interference protection for the circuit portions within the protected area.

Abstract: An industrial process oxygen analyzer, and method of using same, incorporates an automotive oxygen sensor to minimize the criticalness of controlling heater temperature during operation. Higher sensor heater temperature, required to accommodate the automotive oxygen sensor, is achieved by application of higher supply voltage to the sensor heater. Current limiting of the heater supply circuit reduces stress on the sensor heater, even at the higher operating temperature.

Abstract: A combustion control system includes a sensor assembly and a process controller, the sensor assembly including sensors for providing output signals indicative of process variables, the process controller responding to the output signals to maintain a desired operation of the process. The process controller continuously monitors parameters of the sensors and provides alarms whenever any of these parameters deviate from setpoint values, the process controller automatically prioritizing these alarms to provide a display of only the most relevant alarms. A housing enclosing the process controller provides EMI/RFI shielding of the process controller including the attenuation and absorption of the EMI/RFI energy.

Abstract: A device for sealing and isolating analyzer gas sample flows in an aspirated sampling system is provided with a drainage channel surrounding the gas sample inlet to isolate the inlet in the plane of the sealing surface from a pressurized air supply channel in the sealing surface and intercept leakage from the air supply channel. The drainage channel is connected to a cavity via a constricted flow path to reduce leakage pressure and the cavity is vented to the environment.

Abstract: A cover for a portion of a control panel module is disclosed. The cover is pivotally attached to an edge of the control panel module and encloses a configuration plug for reprogramming purposes and other switches on the control panel module. The top surface of the cover can be utilized to support the cord which interconnects a reprogramming device to the configuration plug on the control panel module during the programming process. A projection is provided on the top surface of the cover to prevent the cord from slipping off of the cover when the reprogramming device is so interconnected.

Abstract: A mounting bracket assembly for electronic instrument mounting which also provides for heat dissipation and environmental protection. Side slots in the sides of the mounting bracket permit natural convection air currents to circulate through a plurality of openings in the top and bottom sides of the housing module secured by the assembly to a control panel, but prevent direct entry of liquids, particle contaminents or projections from coming into contact with the electronics contained therein.

Abstract: A filter cleaning system for an opacity monitor which has a light source and a light sensor on opposite sides of a first optical path through a gas whose opacity is to be measured, comprises a mechanism for calibrating the opacity monitor during a calibration period and a purging air arrangement for supplying purging air to pipes in the first optical path to keep the interior of the pipes clean. A primary filter is connected to the blower for filtering the purging air. Three-way valves are connected to the input and the output of the blower so that a secondary filter can be utilized to supply clean air in a reverse flow through the primary filter to clean the primary filter. The primary filter is cleaned during this blow-down period at the same time that calibration is taking place for the opacity monitor. In this way, no measuring time is wasted and still the life of the primary filter is extended.

Abstract: A temperature-actuated flow control device has a fluid inlet connected to an exhaust line with a control chamber located therebetween. The control chamber has a free-floating bi-metallic circular element which is flexed in response to temperature changes between a first position stopping flow between the inlet and the exhaust line and a second position opening the flow therebetween. This flow control device, when adapted to a gas sampling system, allows the bi-metallic element remain in a first position at normal operating temperatures to permit the continuous sampling of the sample gas. Whenever the temperature falls below the dew point of the sample gas, the bi-metallic element returns to its second position to stop the sampling of sample gas by the system to prevent condensation in the system.

Abstract: A temperature-actuated flow control device has a fluid inlet connected to an exhaust line with a control chamber located therebetween. The control chamber has a free-floating bi-metallic circular element which is flexed in response to temperature changes between a first position stopping flow between the inlet and the exhaust line and a second position opening the flow therebetween. This flow control device, when adapted to a gas sampling system, allows the bi-metallic element remain in a first position at normal operating temperatures to permit the continuous sampling of the sample gas. Whenever the temperature falls below the dew point of the sample gas, the bi-metallic element returns to its second position to stop the sampling of sample gas by the system to prevent condensation in the system.

Abstract: A pressure sensitive Silicon chip is indirectly bonded to a Stainless Steel housing of an electronic pressure transmitter through an intermediate holder assembly. This indirect bonding prevents thermal cracking of the Silicon chip due to the difference in thermal expansion of the Stainless Steel housing and the Silicon chip. The holder assembly includes a Borosilicate glass tube having the Silicon chip bonded thereto which tube is soldered to a Nickel-Iron alloy holder by a eutectic alloy solder. In assembly, the Nickel-Iron holder is first brazed to the stainless Steel housing at a first temperature greater than the maximum non-destructive temperature of either the chip or the glass tube and the glass tube is then soldered to the Nickel-Iron holder at a lower temperature which will not destroy the chip or the tube holder.