Abstract: A package for electronic components, especially MMIC components, is disclosed. The package is constructed from layers of ceramic cofired to form an annular piece. Metal pieces are brazed onto the top and bottom of the annular piece to hermetically seal the package. Certain of the ceramic pieces are coated with patterns of conductive material before cofiring. The conductive material forms DC power distribution lines to electronic components within the package and low loss RF feedthroughs into the package.

Abstract: A sealed, electrically conducting package having a strip transmission line disposed therein. The package comprises a connector mounted in a wall of the package at a first end of the connector, with a second end of the connector protruding into the package. The connector has an electrically conductive shell which is substantially cylindrical at the first end of the connector and secured to the wall. A center conductor is disposed longitudinally through the connector, the center conductor having a generally circular cross-section at the first end of the connector and having a generally semicircular cross section, comprising a rounded portion and a planar portion, at the second end of the connector. The shell is disposed about substantially only the rounded portion of the center conductor at the second end of the connector. An electrically conductive member is coupled between the planar portion of the center conductor and the strip transmission line.