Abstract: A memory device includes a semiconductor substrate in which memory circuitry has been fabricated. An address converter and a control signal converter are coupled to an address decoder and control logic, respectively. The address and control converters are operable to receive and convert optical address and control signals, respectively, into corresponding electrical address signals applied to the address decoder and control signals applied to the control logic. A read/write circuit on the substrate is coupled to a data converter formed in the substrate. The data converter is operable to receive and convert optical write data signals into corresponding electrical data signals to be applied to the read/write circuit and to receive and convert electrical read data signals into corresponding optical read data signals.

Abstract: A memory device includes a semiconductor substrate in which memory circuitry has been fabricated. An address converter and a control signal converter are coupled to an address decoder and control logic, respectively. The address and control converters are operable to receive and convert optical address and control signals, respectively, into corresponding electrical address signals applied to the address decoder and control signals applied to the control logic. A read/write circuit on the substrate is coupled to a data converter formed in the substrate. The data converter is operable to receive and convert optical write data signals into corresponding electrical data signals to be applied to the read/write circuit and to receive and convert electrical read data signals into corresponding optical read data signals.

Abstract: A memory device includes a semiconductor substrate in which memory circuitry has been fabricated. An address converter and a control signal converter are coupled to an address decoder and control logic, respectively. The address and control converters are operable to receive and convert optical address and control signals, respectively, into corresponding electrical address signals applied to the address decoder and control signals applied to the control logic. A read/write circuit on the substrate is coupled to a data converter formed in the substrate. The data converter is operable to receive and convert optical write data signals into corresponding electrical data signals to be applied to the read/write circuit and to receive and convert electrical read data signals into corresponding optical read data signals.

Abstract: A memory device includes a semiconductor substrate in which memory circuitry has been fabricated. An address converter and a control signal converter are coupled to an address decoder and control logic, respectively. The address and control converters are operable to receive and convert optical address and control signals, respectively, into corresponding electrical address signals applied to the address decoder and control signals applied to the control logic. A read/write circuit on the substrate is coupled to a data converter formed in the substrate. The data converter is operable to receive and convert optical write data signals into corresponding electrical data signals to be applied to the read/write circuit and to receive and convert electrical read data signals into corresponding optical read data signals.

Abstract: A memory device includes a semiconductor substrate in which memory circuitry has been fabricated. An address converter and a control signal converter are coupled to an address decoder and control logic, respectively. The address and control converters are operable to receive and convert optical address and control signals, respectively, into corresponding electrical address signals applied to the address decoder and control signals applied to the control logic. A read/write circuit on the substrate is coupled to a data converter formed in the substrate. The data converter is operable to receive and convert optical write data signals into corresponding electrical data signals to be applied to the read/write circuit and to receive and convert electrical read data signals into corresponding optical read data signals.

Abstract: A blood flow control system comprising a primary arteriovenous fistula connecting a blood source to a vein, and a secondary fistula connected to the first fistual leading to a venous sink. A blood flow control device is engaged with the primary fistula so as to impede the flow therethrough, and is disposed between the secondary fistula and the vein, and it is actuated transcutaneously, whereby restriction of the blood flow through the primary fistula increases the flow of blood to the venous sink.

Abstract: The tobacco harvester is adapted to be mounted adjacent the side of a tractor and includes an inclined chute with a chain conveyor operating in an aperture in the bottom of the chute extending the full length of the chute. The lower end of the inclined chute straddles the tobacco plant and a rotating cutter blade mounted at the lower end of the chute severs the stalk close to the ground. The cut tobacco plant travels top first up the conveyor and at the top end of the chute the top of the stalk passes through an aperture formed by orthogonally disposed stationary bars and into the nip between a pair of rotatable feed rollers, one of which is driven. The feed rollers draw the stalk through the stripper bars to strip the leaves from the stalk so that the stalk and the leaves will fall into separate containers.

Abstract: A gas knife process for controlling the thickness profile of hot-dip aluminum coatings, employs a hybrid gas knife design incorporating both a "curved-lip" with a "bow-tie" orifice. This design, in combination with very close knife to strip distance at the strip edges, was found to provide desirable coating profiles. Best results are obtained with knife deflections of 5.degree. to 30.degree. below the horizontal while utilizing orifice pressures of 15 to 70 mm of Hg at line speeds of 20 to 150 m/min.