Patents by Inventor George S. Bokisa
George S. Bokisa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10062918Abstract: An aqueous electrolyte for a metal-halogen flow battery includes an electrolyte that includes zinc bromide, a chelating agent, and a metal plating enhancer. The metal plating enhancer may include Bi, Pb, Te, Se, and/or Tl, salts thereof, or any combination thereof.Type: GrantFiled: March 10, 2016Date of Patent: August 28, 2018Assignees: PRIMUS POWER CORPORATION, COVENTYA, INC.Inventors: Nicholas Williams, John Joseph Curley, Hooman Hafezi, George S. Bokisa, Sr., Stephen Joseph Carpmail, Joseph Brian Apisdorf
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Publication number: 20160276691Abstract: An aqueous electrolyte for a metal-halogen flow battery includes an electrolyte that includes zinc bromide, a chelating agent, and a metal plating enhancer. The metal plating enhancer may include Bi, Pb, Te, Se, and/or Tl, salts thereof, or any combination thereof.Type: ApplicationFiled: March 10, 2016Publication date: September 22, 2016Inventors: Nicholas WILLIAMS, John Joseph CURLEY, Hooman HAFEZI, George S. BOKISA, SR., Stephen Joseph CARPMAIL, Joseph Brian APISDORF
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Patent number: 7195702Abstract: Disclosed are systems and methods of plating a tin alloy in an efficient, economical, and environmentally friendly manner. An electrochemical cell containing an anolyte compartment and a catholyte compartment separated by a selective membrane is employed. The selective membrane prevents ionic metals from migrating from the catholyte compartment to the anolyte compartment. A conduit may be employed in the electrochemical cell to permit one way flow of anolyte to the catholyte compartment thereby replenishing tin to the catholyte compartment.Type: GrantFiled: June 6, 2003Date of Patent: March 27, 2007Assignee: Taskem, Inc.Inventors: George S. Bokisa, Sr., William E. Eckles, Robert E. Frischauf
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Publication number: 20040245113Abstract: Disclosed are systems and methods of plating a tin alloy in an efficient, economical, and environmentally friendly manner. An electrochemical cell containing an anolyte compartment and a catholyte compartment separated by a selective membrane is employed. The selective membrane prevents ionic metals from migrating from the catholyte compartment to the anolyte compartment. A conduit may be employed in the electrochemical cell to permit one way flow of anolyte to the catholyte compartment thereby replenishing tin to the catholyte compartment.Type: ApplicationFiled: June 6, 2003Publication date: December 9, 2004Inventors: George S. Bokisa, William E. Eckles, Robert E. Frischauf
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Patent number: 6720499Abstract: A printed circuit board including electrical circuitry formed on an outer surface of the printed circuit board, the circuitry comprising copper or a copper alloy; a final finish on the circuitry, the final finish including a coating of tin on the copper or copper alloy circuitry; and an alloy cap layer on the tin coating, the alloy cap layer comprising at least two immersion-platable metals. The immersion platable metals in the alloy cap layer may be at least two metals selected from tin, silver, bismuth, copper, nickel, lead, zinc, indium, palladium, platinum, gold, cadmium, ruthenium and cobalt. The circuitry remains whisker free and solderable.Type: GrantFiled: November 1, 2001Date of Patent: April 13, 2004Assignee: Atotech Deutschland GmbHInventors: George S. Bokisa, Craig V. Bishop, John R. Kochilla
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Patent number: 6602440Abstract: This invention relates to a method of forming a substrate with preparing a surface capable of making a cocontinuous bond comprising the steps of 1) obtaining a copper or copper alloy substrate and 2) applying an etching composition which comprises (a) an acid, (b) an oxidizing agent, (c) a copper complexing agent, and (d) a copper complex, wherein the copper complex is present in an amount which precipitates when applied to the copper or copper alloy substrate. The method also includes the step of 3) treating the substrate with a coating composition and/or 4) applying a stripping composition to the substrate. The invention also relates to copper articles, having surface porosity, including multilayer articles such as printed circuit boards and compositions used in the method. The present invention provides microporous copper or copper alloy substrates which have improved adhesion properties to organic material.Type: GrantFiled: August 13, 2001Date of Patent: August 5, 2003Assignee: Atotech Deutschland GmbHInventors: Craig V. Bishop, George S. Bokisa, Robert J. Durante, John R. Kochilla
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Patent number: 6579591Abstract: This invention relates to a method of forming a substrate with preparing a surface capable of making a cocontinuous bond comprising the steps of 1) obtaining a copper or copper alloy substrate and 2) applying an etching composition which comprises (a) an acid, (b) an oxidizing agent, (c) a copper complexing agent, and (d) a copper complex, wherein the copper complex is present in an amount which precipitates when applied to the copper or copper alloy substrate. The method also includes the step of 3) treating the substrate with a coating composition and/or 4) applying a stripping composition to the substrate. The invention also relates to copper articles, having surface porosity, including multilayer articles such as printed circuit boards and compositions used in the method. The present invention provides microporous copper or copper alloy substrates which have improved adhesion properties to organic material.Type: GrantFiled: July 17, 2001Date of Patent: June 17, 2003Assignee: Atotech Deutschland GmbHInventors: Craig V. Bishop, George S. Bokisa, Robert J. Durante, John R. Kochilla
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Patent number: 6506314Abstract: The present invention relates to a process for treating a metal substrate to improve adhesion of polymeric materials thereto, comprising the steps of intergranular etching a surface of the metal substrate; and applying an immersion plated metal to the intergranular etched surface by immersing the surface in an immersion plating composition comprising one or more plating metals selected from tin, silver, bismuth, copper, nickel, lead, zinc, indium, palladium, platinum, gold, cadmium, ruthenium, cobalt, gallium and germanium. In one embodiment, the immersion plated metal is tin. In one embodiment, the process further comprises a step of adhering the immersion metal plated surface to a surface of a polymeric non-conductive material. In another embodiment, the polymeric nonconductive material is one or more of PTFE, an epoxy resin, a polyimide, a polycyanate ester, a butadiene terephthalate resin, or mixtures thereof.Type: GrantFiled: July 27, 2000Date of Patent: January 14, 2003Assignee: Atotech Deutschland GmbHInventors: Dickson L. Whitney, Jr., George S. Bokisa, Craig V. Bishop, Americus C. Vitale
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Publication number: 20020064676Abstract: A printed circuit board including electrical circuitry formed on an outer surface of the printed circuit board, the circuitry comprising copper or a copper alloy; a final finish on the circuitry, the final finish including a coating of tin on the copper or copper alloy circuitry; and an alloy cap layer on the tin coating, the alloy cap layer comprising at least two immersion-platable metals. The immersion platable metals in the alloy cap layer may be at least two metals selected from tin, silver, bismuth, copper, nickel, lead, zinc, indium, palladium, platinum, gold, cadmium, ruthenium and cobalt. The circuitry remains whisker free and solderable.Type: ApplicationFiled: November 1, 2001Publication date: May 30, 2002Inventors: George S. Bokisa, Craig V. Bishop, John R. Kochilla
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Publication number: 20020056702Abstract: This invention relates to a method of forming a substrate with preparing a surface capable of making a cocontinuous bond comprising the steps of 1) obtaining a copper or copper alloy substrate and 2) applying an etching composition which comprises (a) an acid, (b) an oxidizing agent, (c) a copper complexing agent, and (d) a copper complex, wherein the copper complex is present in an amount which precipitates when applied to the copper or copper alloy substrate. The method also includes the step of 3) treating the substrate with a coating composition and/or 4) applying a stripping composition to the substrate. The invention also relates to copper articles, having surface porosity, including multilayer articles such as printed circuit boards and compositions used in the method. The present invention provides microporous copper or copper alloy substrates which have improved adhesion properties to organic material.Type: ApplicationFiled: August 13, 2001Publication date: May 16, 2002Inventors: Craig V. Bishop, George S. Bokisa, Robert J. Durante, John R. Kochilla
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Publication number: 20020048685Abstract: This invention relates to a method of forming a substrate with preparing a surface capable of making a cocontinuous bond comprising the steps of 1) obtaining a copper or copper alloy substrate and 2) applying an etching composition which comprises (a) an acid, (b) an oxidizing agent, (c) a copper complexing agent, and (d) a copper complex, wherein the copper complex is present in an amount which precipitates when applied to the copper or copper alloy substrate. The method also includes the step of 3) treating the substrate with a coating composition and/or 4) applying a stripping composition to the substrate. The invention also relates to copper articles, having surface porosity, including multilayer articles such as printed circuit boards and compositions used in the method. The present invention provides microporous copper or copper alloy substrates which have improved adhesion properties to organic material.Type: ApplicationFiled: July 17, 2001Publication date: April 25, 2002Inventors: Craig V. Bishop, George S. Bokisa, Robert J. Durante, John R. Kochilla
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Patent number: 6361823Abstract: A process of preserving solderability and inhibiting tin whisker growth of exposed copper or copper alloy surfaces on a substrate comprises the steps of preparing an immersion tin plating solution substantially free of other immersion-platable metals; applying the immersion tin plating solution to the substrate to form a tin coating on the surfaces; preparing an immersion alloy plating solution containing at least two immersion-platable metals; applying the immersion alloy plating solution to the substrate by immersing the substrate in the immersion alloy plating solution to form an alloy cap layer on the tin coating. The immersion platable metals in the immersion alloy plating solution may be at least two metals selected from tin, silver, bismuth, copper, nickel, lead, zinc, indium, palladium, platinum, gold, cadmium, ruthenium and cobalt.Type: GrantFiled: December 3, 1999Date of Patent: March 26, 2002Assignee: Atotech Deutschland GmbHInventors: George S. Bokisa, Craig V. Bishop, John R. Kochilla
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Patent number: 6284309Abstract: This invention relates to a method of forming a substrate with preparing a surface capable of making a cocontinuous bond comprising the steps of 1) obtaining a copper or copper alloy substrate and 2) applying an etching composition which comprises (a) an acid, (b) an oxidizing agent, (c) a copper complexing agent, and (d) a copper complex, wherein the copper complex is present in an amount which precipitates when applied to the copper or copper alloy substrate. The method also includes the step of 3) treating the substrate with a coating composition and/or 4) applying a stripping composition to the substrate. The invention also relates to copper articles, having surface porosity, including multilayer articles such as printed circuit boards and compositions used in the method. The present invention provides microporous copper or copper alloy substrates which have improved adhesion properties to organic material.Type: GrantFiled: December 19, 1997Date of Patent: September 4, 2001Assignee: Atotech Deutschland GmbHInventors: Craig V. Bishop, George S. Bokisa, Robert J. Durante, John R. Kochilla
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Patent number: 6086779Abstract: This invention relates to an aqueous etching composition for etching metallic copper comprising(a) an acid,(b) a copper complexing agent,(c) a metal capable of having a multiplicity of oxidation states which is present in one of its higher positive oxidation states and which metal forms a composition soluble salt, and(d) oxygen wherein the concentration of the higher positive oxidation state metal in the composition is greater than about 4 grams/liter of composition.The invention also relates to a process for etching metallic copper comprising contacting the surface of a copper substrate with the aqueous etching compositions of the invention. A method of regenerating a spent aqueous etching composition of the invention which has been used for etching metallic copper also is described.Type: GrantFiled: March 1, 1999Date of Patent: July 11, 2000Assignee: McGean-Rohco, Inc.Inventors: Craig V. Bishop, John R. Kochilla, Robert J. Durante, George S. Bokisa
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Patent number: 6063172Abstract: It has now been found that one or more metals selected from the group consisting of tin, lead, bismuth, indium, gallium and germanium may be deposited onto a metal surface utilizing an aqueous electroless plating bath which comprises(A) at least one bath-soluble metal salt selected from the group consisting of stannous salts, lead salts, bismuth salts, indium salts, gallium salts, and germanium salts;(B) at least one complexing agent selected from the group consisting of thiourea compounds and imidazole thiones, and(C) at least one amidine.Preferably, the aqueous plating baths also contain at least one acid, and the baths optionally may contain one or more surfactants. The incorporation of the amidine into the plating baths results in a solution exhibiting desirable plating characteristics and increased copper holding power.Type: GrantFiled: October 13, 1998Date of Patent: May 16, 2000Assignee: McGean-Rohco, Inc.Inventors: George S. Bokisa, William J. Willis
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Patent number: 5928790Abstract: This invention relates to a process for improving the adhesion of copper circuitry to a dielectric layer and a method for forming a multilayer printed circuit board wherein the copper circuitry of the board is covered with a layer of an oxide, hydroxide, or combination thereof of a metal selected from the group consisting of tin, bismuth, lead, indium, gallium, germanium, and alloys of said metals. The process and multilayer circuit boards made thereby, have improved laminate adhesion and strength. Further, partial delamination, known as pink ring, is decreased or avoided by the present process. Further, the multilayer structures have decreased bond strength deterioration when exposed to elevated temperatures.Type: GrantFiled: April 23, 1996Date of Patent: July 27, 1999Assignee: McGean-Rohco, Inc.Inventor: George S. Bokisa
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Patent number: 5698087Abstract: It now has been found that a smooth and level deposit of tin, lead or tin-lead alloy can be deposited on a substrate from an aqueous plating bath which comprises (A) at least one bath-soluble metal salt selected from the group consisting of a stannous salt, a lead salt, or a mixture of stannous and lead salts, (B) an acid selected from the group consisting of sulfuric or fluoboric acid; and (C) an effective amount of at least one soluble bismuth salt of an alkane sulfonic acid or an alkanol sulfonic acid. Optionally, the aqueous plating bath may further comprise (D) at least one surfactant.Type: GrantFiled: March 11, 1992Date of Patent: December 16, 1997Assignee: McGean-Rohco, Inc.Inventor: George S. Bokisa
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Patent number: 5554211Abstract: It has now been found that one or more metals selected from the group consisting of tin, lead, bismuth, indium, gallium and germanium may be deposited onto a metal surface utilizing an aqueous electroless plating solution which comprises(A) at least one solution-soluble metal salt selected from the group consisting of a stannous salt, a lead salt, a bismuth salt, an indium salt, a gallium salt and a germanium salt;(B) at least one acid selected from the group consisting of fluoboric acid, alkane sulfonic acids, alkanol sulfonic acids, and mixtures thereof;(C) a complexing agent which is an imidazole-2-thione compound of the Formula III ##STR1## wherein A and B are the same or different --RY groups wherein R is a linear, branched or cyclic hydrocarbylene group containing up to 12 carbon atoms, and Y is a hydrogen, halogen, cyano, vinyl, phenyl, or ether moiety; and(D) water. Optionally, the aqueous plating solutions may contain one or more surfactants.Type: GrantFiled: November 15, 1995Date of Patent: September 10, 1996Assignee: McGean-Rohco, Inc.Inventors: George S. Bokisa, William J. Willis
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Patent number: 5411595Abstract: A novel, environmentally innocuous, post-etch, pre-soldering cleaner and cleaning process is disclosed for removing contaminants from plated surfaces of printed circuit boards manufactured by the pattern plating method. The post-etch, cleaning process of this invention, for removing contaminants from plated surfaces of an etched printed circuit, comprises treating the plated surfaces with a cleaning solution which comprises an aqueous solution of (i) an imidazole-2-thione compound and (ii) an acid. The imidazole-2-thione compound has the formula: ##STR1## wherein A and B are the same or different --R--Y groups, wherein R is a linear, branched or cyclic alkenyl group containing 1 to 12 carbon atoms and Y is a hydrogen, halogen, cyano, vinyl, phenyl or ether moiety. Of this class of compounds, 1-methyl-3-propylimidazole-2-thione is preferred.Type: GrantFiled: July 13, 1993Date of Patent: May 2, 1995Assignee: McGean-Rohco, Inc.Inventors: George S. Bokisa, Sr., Gary W. Loar, Americus C. Vitale
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Patent number: 4885064Abstract: It now has been found that a smooth, level, matte and/or bright deposit of tin, lead or tin-lead alloy can be deposited on a substrate from an aqueous plating bath which comprises(A) at least one bath-soluble metal salt selected from the group consisting of a stannous salt, a lead salt, or a mixture of stannous and lead salts; and(B) at least one alpha-acetylenic alcohol or glycol of the formulaR.sub.1 R.sub.2 C(OH)C.tbd.CR.sub.3 (I)whereinR.sub.1 and R.sub.2 are each independently H, an alkyl group, a cycloalkyl group or R.sub.1 and R.sub.2 together with the carbon atom form a cyclic group, provided that at least one of R.sub.1 and R.sub.2 is an alkyl group containing at least three carbon atoms, andR.sub.3 is H, an alkyl group or --C(OH)R.sub.1 R.sub.2.Preferably the plating baths do not contain fluoride or fluoborate ions, and the baths are also free of strong inorganic acids such as sulfuric acid.Type: GrantFiled: May 22, 1989Date of Patent: December 5, 1989Assignee: McGean-Rohco, Inc.Inventors: George S. Bokisa, Billie J. Page