Abstract: A system and method are disclosed for coating surfaces of expandable medical devices with composite coatings. Coatings are composed of various materials including, e.g., polymers and drugs. Transfer of the coatings within a patient or other host forms a drug-eluting coating that delivers time-released drugs over time for treatment of a medical condition.

Abstract: This disclosure describes the application of a supplemental corona source to provide surface charge on submicrometer particles to enhance collection efficiency and micro-structural density during electrostatic collection.

Abstract: This disclosure describes the application of a supplemental corona source to provide surface charge on submicrometer particles to enhance collection efficiency and micro-structural density during electrostatic collection.

Abstract: A system and method are disclosed for coating surfaces of expandable medical devices with composite coatings. Coatings are composed of various materials including, e.g., polymers and drugs. Transfer of the coatings within a patient or other host forms a drug-eluting coating that delivers time-released drugs over time for treatment of a medical condition.

Abstract: This disclosure describes the application of a supplemental corona source to provide surface charge on submicrometer particles to enhance collection efficiency and micro-structural density during electrostatic collection.

Abstract: This disclosure describes the application of a supplemental corona source to provide surface charge on submicrometer particles to enhance collection efficiency and micro-structural density during electrostatic collection.

Abstract: A system is described for selectively depositing materials to surfaces at preselected locations and at controlled thicknesses. Materials can be further selectively deposited to sub-surfaces of composite or structured silicon wafers, e.g., for the deposition of barrier films on silicon wafer surfaces, e.g., to fill substrate feature patterns (vias). The invention finds application in such commercial processes as semiconductor chip manufacturing. The system is envisioned to provide alternatives to, or decreased need for, chemical mechanical planarization in semiconductor chip manufacturing.

Abstract: Methods are disclosed for depositing materials selectively and controllably from liquid, near-critical, and/or supercritical fluids to a substrate or surface controlling the location and/or thickness of material(s) deposited to the surface or substrate. In one exemplary process, metals are deposited selectively filling feature patterns (e.g., vias) of substrates. The process can be further used to control deposition of materials on sub-surfaces of composite or structured silicon wafers, e.g., for the deposition of barrier films on silicon wafer surfaces. Materials include, but are not limited to, overburden materials, metals, non-metals, layered materials, organics, polymers, and semiconductor materials. The instant invention finds application in such commercial processes as semiconductor chip manufacturing.