Abstract: In one example, an electronic device includes an electronic component including a component first side, a component second side opposite to the component first side, and a component lateral side connecting the component first side to the component second side, wherein the component lateral side defines a perimeter of the electronic component. A first intermediate terminal is coupled to the electronic component within the perimeter. An intermediate component is coupled to the first intermediate terminal within the perimeter. An encapsulant structure is over the intermediate component, at least a portion of the first intermediate terminal, and at least a portion of the electronic component. Other examples and related methods are also disclosed herein.

Abstract: In one example, an electronic device includes an electronic component including a component first side, a component second side opposite to the component first side, and a component lateral side connecting the component first side to the component second side, wherein the component lateral side defines a perimeter of the electronic component. A first intermediate terminal is coupled to the electronic component within the perimeter. An intermediate component is coupled to the first intermediate terminal within the perimeter. An encapsulant structure is over the intermediate component, at least a portion of the first intermediate terminal, and at least a portion of the electronic component. Other examples and related methods are also disclosed herein.

Abstract: In one example, a semiconductor device comprises a substrate comprising a top side and a bottom side, a dielectric structure, and a conductive structure, wherein the conductive structure comprises a first terminal exposed from the dielectric structure, an electronic component over the top side of the substrate, and an encapsulant over the top side of the substrate and covering a lateral side of the electronic component. The dielectric structure comprises a first pattern base and first pattern wall that extends from the first pattern base and is adjacent to the first terminal, and the first terminal is bounded by the first pattern wall. Other examples and related methods are also disclosed herein.

Abstract: In one example, a semiconductor device comprises a substrate comprising a top side and a bottom side, a dielectric structure, and a conductive structure, wherein the conductive structure comprises a first terminal exposed from the dielectric structure, an electronic component over the top side of the substrate, and an encapsulant over the top side of the substrate and covering a lateral side of the electronic component. The dielectric structure comprises a first pattern base and first pattern wall that extends from the first pattern base and is adjacent to the first terminal, and the first terminal is bounded by the first pattern wall. Other examples and related methods are also disclosed herein.

Abstract: The technology described in this document can be embodied in a method for identifying a user of secured system. The method includes transmitting, using a first transceiver in an array of multiple transceivers, a first electromagnetic signal in the microwave range. An electromagnetic signal representing a first response of a portion of a subject to the first electromagnetic signal is received, by at least one transceiver of the array of multiple transceivers. The subject is identified based at least in part on one or more parameters of the first response.

Abstract: In one example, an electronic device includes an electronic component including a component first side, a component second side opposite to the component first side, and a component lateral side connecting the component first side to the component second side, wherein the component lateral side defines a perimeter of the electronic component. A first intermediate terminal is coupled to the electronic component within the perimeter. An intermediate component is coupled to the first intermediate terminal within the perimeter. An encapsulant structure is over the intermediate component, at least a portion of the first intermediate terminal, and at least a portion of the electronic component. Other examples and related methods are also disclosed herein.

Abstract: A semiconductor device comprises a substrate having a substrate top side, a substrate lateral side, and a substrate bottom side, an electronic device on the substrate top side, and an encapsulant on the substrate top side and contacting a lateral surface of the electronic device. The substrate comprises a conductive structure and a dielectric structure that extends comprising a protrusion in contact with the encapsulant. The conductive structure comprises a lead comprising a lead flank, the lead flank comprising a cavity and a conductive coating on a surface of the lead in the cavity. The conductive structure comprises a pad exposed at the substrate top side, embedded in the dielectric structure, and adjacent to the protrusion, to electrically couple with the electronic device via a first internal interconnect. Other examples and related methods are also disclosed herein.

Abstract: A semiconductor device comprises a substrate having a substrate top side, a substrate lateral side, and a substrate bottom side, an electronic device on the substrate top side, and an encapsulant on the substrate top side and contacting a lateral surface of the electronic device. The substrate comprises a conductive structure and a dielectric structure that extends comprising a protrusion in contact with the encapsulant. The conductive structure comprises a lead comprising a lead flank, the lead flank comprising a cavity and a conductive coating on a surface of the lead in the cavity. The conductive structure comprises a pad exposed at the substrate top side, embedded in the dielectric structure, and adjacent to the protrusion, to electrically couple with the electronic device via a first internal interconnect. Other examples and related methods are also disclosed herein.

Abstract: In one example, a semiconductor device comprises a substrate comprising a top side and a bottom side, a dielectric structure, and a conductive structure, wherein the conductive structure comprises a first terminal exposed from the dielectric structure, an electronic component over the top side of the substrate, and an encapsulant over the top side of the substrate and covering a lateral side of the electronic component. The dielectric structure comprises a first pattern base and first pattern wall that extends from the first pattern base and is adjacent to the first terminal, and the first terminal is bounded by the first pattern wall. Other examples and related methods are also disclosed herein.

Abstract: A semiconductor device comprises a substrate having a substrate top side, a substrate lateral side, and a substrate bottom side, an electronic device on the substrate top side, and an encapsulant on the substrate top side and contacting a lateral surface of the electronic device. The substrate comprises a conductive structure and a dielectric structure that extends comprising a protrusion in contact with the encapsulant. The conductive structure comprises a lead comprising a lead flank, the lead flank comprising a cavity and a conductive coating on a surface of the lead in the cavity. The conductive structure comprises a pad exposed at the substrate top side, embedded in the dielectric structure, and adjacent to the protrusion, to electrically couple with the electronic device via a first internal interconnect. Other examples and related methods are also disclosed herein.

Abstract: The technology described in this document can be embodied in a method for identifying a user of secured system. The method includes transmitting, using a first transceiver in an array of multiple transceivers, a first electromagnetic signal in the microwave range. An electromagnetic signal representing a first response of a portion of a subject to the first electromagnetic signal is received, by at least one transceiver of the array of multiple transceivers. The subject is identified based at least in part on one or more parameters of the first response.

Abstract: A semiconductor device comprises a substrate having a substrate top side, a substrate lateral side, and a substrate bottom side, an electronic device on the substrate top side, and an encapsulant on the substrate top side and contacting a lateral surface of the electronic device. The substrate comprises a conductive structure and a dielectric structure that extends comprising a protrusion in contact with the encapsulant. The conductive structure comprises a lead comprising a lead flank, the lead flank comprising a cavity and a conductive coating on a surface of the lead in the cavity. The conductive structure comprises a pad exposed at the substrate top side, embedded in the dielectric structure, and adjacent to the protrusion, to electrically couple with the electronic device via a first internal interconnect. Other examples and related methods are also disclosed herein.

Abstract: A constant mesh gearbox has five parallel rotational axes. The input and output axes are not aligned. Some torque paths are via a sleeve rotatable on a shaft on one of said axes. Up to eight forward speeds are disclosed, with two very low ratios suitable for non-highway travel. The transmission is suitable for two and four wheel drive.

Abstract: A constant mesh gearbox has five parallel rotational axes. The input and output axes are not aligned. Some torque paths are via a sleeve rotatable on a shaft on one of said axes. Up to eight forward speeds are disclosed, with two very low ratios suitable for non-highway travel. The transmission is suitable for two and four wheel drive.

Abstract: A method for dynamic pixel mass spectrometric imaging, or dynamic pixel imaging is disclosed. The method includes striking a sample to be scanned with a laser beam so that the laser beam releases analytes from the sample. The laser beam and the sample are then displaced relative to one another so that the laser beam substantially continuously traces a predefined path on the sample to release analytes from the sample along the predefined path. A mass analysis of the released analytes is performed.

Abstract: A method and apparatus is provided to discover and integrate applications in an application router framework. The discovery operation includes receiving a registration notification for an application on a network, adding information describing the application to a repository into a data structure and publishing the data structure onto an application router. The association operations include querying one or more application routers on an application network for meta-data and other information on applications, exchanging the meta-data and other information between the application routers and associating the applications together automatically using their respective application protocols.

Abstract: A method for dynamic pixel mass spectrometric imaging, or dynamic pixel imaging is disclosed. The method includes striking a sample to be scanned with a laser beam so that the laser beam releases analytes from the sample. The laser beam and the sample are then displaced relative to one another so that the laser beam substantially continuously traces a predefined path on the sample to release analytes from the sample along the predefined path. A mass analysis of the released analytes is performed.

Abstract: A process of producing a filter tube comprises the steps of cutting a paper segment of given length and width from an endless paper supply. Next, a filter segment of cellulose acetate tow, for example, is centrally positioned on the paper segment. Opposed tube forming rollers engage the ends of the filter segment, and as these rollers rotate, the paper segment is formed into a tube shape. Overlapping portions of the paper segment are secured together, and the tube forming rollers are withdrawn from the tube to thereby complete the forming operation.

Abstract: A method and apparatus is provided to assure transformations between applications in an integration project. This assurance of transformations between applications includes mapping one or more related fields from a set of fields between the one or more source applications and the one or more target applications according to a set of integration objectives, checking a type compatibility for each of the one or more related fields mapped between the one or more source applications and the one or more target applications and indicating a mapping status according to the type compatibility between the source applications and the target applications.

Abstract: Process and apparatus for the mass production of compound cigarette filters function to deposit granular filter material into the open ends of vertically oriented filter tubes. Predetermined amounts of diverse granular material are withdrawn by suction from sources of such material, and these amounts are deposited into the tubes. Solid filter segments seal the granular material within the tube. After one half of each filter tube is filled with granular material and sealed, the tube is inverted and the opposite end is filled in substantially the same manner. When cut in half each filter tube produces two cigarette filters.