Patents by Inventor George Scott

George Scott has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250071165
    Abstract: A system for managing video content using a channel manifest publisher.
    Type: Application
    Filed: August 22, 2024
    Publication date: February 27, 2025
    Applicant: ARRIS Enterprises LLC
    Inventors: David Alfred ROMRELL, Yixiang ZENG, George Scott PINSON, Li LIU
  • Publication number: 20250022790
    Abstract: In one example, a semiconductor device comprises a substrate comprising a top side and a bottom side, a dielectric structure, and a conductive structure, wherein the conductive structure comprises a first terminal exposed from the dielectric structure, an electronic component over the top side of the substrate, and an encapsulant over the top side of the substrate and covering a lateral side of the electronic component. The dielectric structure comprises a first pattern base and first pattern wall that extends from the first pattern base and is adjacent to the first terminal, and the first terminal is bounded by the first pattern wall. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: September 27, 2024
    Publication date: January 16, 2025
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: George Scott, Ki Yeul Yang, Jae Hun Bae
  • Patent number: 12178851
    Abstract: The present invention relates to methods of treating disease states, including cancer, in a human comprising systemically administering a STING agonist, or a pharmaceutically acceptable salt thereof, to said human.
    Type: Grant
    Filed: October 4, 2018
    Date of Patent: December 31, 2024
    Assignee: GlaxoSmithKline Intellectual Property Development Limited
    Inventors: George Scott Pesiridis, Jean-Luc Tran, Jingsong Yang, Joshi M Ramanjulu
  • Patent number: 12107037
    Abstract: In one example, a semiconductor device comprises a substrate comprising a top side and a bottom side, a dielectric structure, and a conductive structure, wherein the conductive structure comprises a first terminal exposed from the dielectric structure, an electronic component over the top side of the substrate, and an encapsulant over the top side of the substrate and covering a lateral side of the electronic component. The dielectric structure comprises a first pattern base and first pattern wall that extends from the first pattern base and is adjacent to the first terminal, and the first terminal is bounded by the first pattern wall. Other examples and related methods are also disclosed herein.
    Type: Grant
    Filed: November 3, 2021
    Date of Patent: October 1, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: George Scott, Ki Yeul Yang, Jae Hun Bae
  • Patent number: 12061284
    Abstract: The technology described in this document can be embodied in a method for identifying a user of secured system. The method includes transmitting, using a first transceiver in an array of multiple transceivers, a first electromagnetic signal in the microwave range. An electromagnetic signal representing a first response of a portion of a subject to the first electromagnetic signal is received, by at least one transceiver of the array of multiple transceivers. The subject is identified based at least in part on one or more parameters of the first response.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: August 13, 2024
    Assignee: Jumio Corporation
    Inventors: Ahmed M. Hassan, Reza R. Derakhshani, Waleed K. Al-Shaikhli, Blake Willig, Kyle Hejtmanek, Clayton Kettlewell, Ala-Addin Nabulsi, George Scott
  • Patent number: 12006185
    Abstract: A monitoring system includes one or more detection devices, a communication device, and an analytics system. The one or more detection devices generate, at a conveyance system, one or more data streams describing the ride of the conveyance system, where the data streams include at least one of vibration data and audio data. The communication device transmits sensor data based on the one or more data streams. The analytics system receives the sensor data from the communication device and, based on the sensor data, determines a ride quality of the conveyance system.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: June 11, 2024
    Assignee: OTIS ELEVATOR COMPANY
    Inventors: Soumalya Sarkar, Teems E. Lovett, Paul R. Braunwart, Sudarshan N. Koushik, Nikola Trcka, George Scott Copeland, George S. Ekladious, Peter Liaskas, Sandeep Sudi
  • Publication number: 20240113090
    Abstract: In one example, an electronic device includes an electronic component including a component first side, a component second side opposite to the component first side, and a component lateral side connecting the component first side to the component second side, wherein the component lateral side defines a perimeter of the electronic component. A first intermediate terminal is coupled to the electronic component within the perimeter. An intermediate component is coupled to the first intermediate terminal within the perimeter. An encapsulant structure is over the intermediate component, at least a portion of the first intermediate terminal, and at least a portion of the electronic component. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: September 30, 2022
    Publication date: April 4, 2024
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Won Myoung KI, In Su MOK, Soo Hyun KIM, Tae Kyeong HWANG, Shaun BOWERS, George SCOTT
  • Patent number: 11905142
    Abstract: An illustrative example method of controlling an elevator situated in a hoistway of a building includes detecting sway of the building, determining characteristics of the detected sway including a plurality of frequencies and associated periods of the sway, determining an expected sway of an elongated member of the elevator system based on the determined characteristics, and controlling at least one of position and movement of an elevator car in the hoistway based on the expected sway.
    Type: Grant
    Filed: March 1, 2022
    Date of Patent: February 20, 2024
    Assignee: OTIS ELEVATOR COMPANY
    Inventors: Randy Roberts, George Scott Copeland, Luis C. Encinas Carreno, Patricia Derwinski, Cuauhtemoc Castro
  • Patent number: 11873191
    Abstract: An illustrative example embodiment of an elevator propulsion device includes at least one drive member configured to engage and climb along a vertical structure, a motor module including at least one motor configured to cause movement of the drive member and corresponding movement of an elevator cab, and a power supply including at least one energy source that is configured to provide power to the motor. The power supply is situated adjacent the motor module such that a mass of the at least one energy source provides a noise barrier to reduce transmission of noise from the motor into the elevator cab.
    Type: Grant
    Filed: August 31, 2020
    Date of Patent: January 16, 2024
    Assignee: OTIS ELEVATOR COMPANY
    Inventor: George Scott Copeland
  • Publication number: 20230352370
    Abstract: A semiconductor device comprises a substrate having a substrate top side, a substrate lateral side, and a substrate bottom side, an electronic device on the substrate top side, and an encapsulant on the substrate top side and contacting a lateral surface of the electronic device. The substrate comprises a conductive structure and a dielectric structure that extends comprising a protrusion in contact with the encapsulant. The conductive structure comprises a lead comprising a lead flank, the lead flank comprising a cavity and a conductive coating on a surface of the lead in the cavity. The conductive structure comprises a pad exposed at the substrate top side, embedded in the dielectric structure, and adjacent to the protrusion, to electrically couple with the electronic device via a first internal interconnect. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: May 5, 2023
    Publication date: November 2, 2023
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Won Bae Bang, Kwang Seok Oh, George Scott
  • Patent number: 11780704
    Abstract: A component monitoring system for monitoring a component of a conveyance system including a conveyance apparatus including: a camera configured to capture a sequence images of the component, the sequence of images being motion data; and a processor configured to determine an evaluation summary of the component in response to at least the motion data.
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: October 10, 2023
    Assignee: OTIS ELEVATOR COMPANY
    Inventors: George Scott Copeland, Pradeep Miriyala, Rachit Sahgal, Jinho Song
  • Publication number: 20230234810
    Abstract: An illustrative example embodiment of system includes at least one detector that detects a horizontal position of elevator roping at a selected vertical location. The detector provides an indication of the horizontal position at the selected vertical location in two dimensions. A processor determines at least an amplitude and a frequency of sway of the elevator roping in each of the two dimensions at the selected vertical location based on the indication from the detector.
    Type: Application
    Filed: January 27, 2022
    Publication date: July 27, 2023
    Inventors: Randy ROBERTS, George Scott COPELAND, Patricia DERWINSKI
  • Publication number: 20230203771
    Abstract: Systems and methods of restoring a lake including dredging, island creation, water treatment, real estate development, computer modeling of environmental conditions, wave height reduction, sediment removal and encapsulation, bathymetry contouring, littoral zone restoration, plant restoration, and/or fish restoration.
    Type: Application
    Filed: March 3, 2023
    Publication date: June 29, 2023
    Inventors: Ryan Benson, Robert George Scott, Jonathan B. Benson
  • Patent number: 11646248
    Abstract: A semiconductor device comprises a substrate having a substrate top side, a substrate lateral side, and a substrate bottom side, an electronic device on the substrate top side, and an encapsulant on the substrate top side and contacting a lateral surface of the electronic device. The substrate comprises a conductive structure and a dielectric structure that extends comprising a protrusion in contact with the encapsulant. The conductive structure comprises a lead comprising a lead flank, the lead flank comprising a cavity and a conductive coating on a surface of the lead in the cavity. The conductive structure comprises a pad exposed at the substrate top side, embedded in the dielectric structure, and adjacent to the protrusion, to electrically couple with the electronic device via a first internal interconnect. Other examples and related methods are also disclosed herein.
    Type: Grant
    Filed: March 22, 2022
    Date of Patent: May 9, 2023
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Won Bae Bang, Kwang Seok Oh, George Scott
  • Publication number: 20230137998
    Abstract: In one example, a semiconductor device comprises a substrate comprising a top side and a bottom side, a dielectric structure, and a conductive structure, wherein the conductive structure comprises a first terminal exposed from the dielectric structure, an electronic component over the top side of the substrate, and an encapsulant over the top side of the substrate and covering a lateral side of the electronic component. The dielectric structure comprises a first pattern base and first pattern wall that extends from the first pattern base and is adjacent to the first terminal, and the first terminal is bounded by the first pattern wall. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: November 3, 2021
    Publication date: May 4, 2023
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: George Scott, Ki Yeul Yang, Jae Hun Bae
  • Patent number: 11596216
    Abstract: A hair treatment kit comprises a hair treatment composition selected from the group of semi-permanent oxidative and/or direct dye hair colorant compositions, hair bleaching compositions, highlighting compositions, and combinations thereof, a reservoir for holding the temporary hair treatment composition, and an applicator fluidly connected to the reservoir for selectively applying the hair treatment composition to a targeted area of hair. Methods of applying the hair treatment composition comprise selectively engaging the applicator with a targeted area of hair, leaving the hair treatment composition in the targeted area for a time period, washing the hair treatment composition out of the targeted area, closing the reservoir to preserve remaining hair treatment composition for later use, and reapplying the hair treatment composition to the targeted area.
    Type: Grant
    Filed: April 9, 2019
    Date of Patent: March 7, 2023
    Assignee: WELLA INTERNATIONAL OPERATIONS SWITZERLAND SARL
    Inventors: Dena Muniz, Leobaldo Antonio Perdomo, George Scott Kerr, Aideen Noelle Ripley, Chad Lafeldt, Jeffrey Miller, Christina Bishop, Carin Freidag, William Demarest
  • Publication number: 20220267118
    Abstract: An illustrative example method of controlling an elevator situated in a hoistway of a building includes detecting sway of the building, determining characteristics of the detected sway including a plurality of frequencies and associated periods of the sway, determining an expected sway of an elongated member of the elevator system based on the determined characteristics, and controlling at least one of position and movement of an elevator car in the hoistway based on the expected sway.
    Type: Application
    Filed: March 1, 2022
    Publication date: August 25, 2022
    Inventors: Randy Roberts, George Scott Copeland, Luis C. Encinas Carreno, Patricia Derwinski, Cuauhtemoc Castro
  • Publication number: 20220216132
    Abstract: A semiconductor device comprises a substrate having a substrate top side, a substrate lateral side, and a substrate bottom side, an electronic device on the substrate top side, and an encapsulant on the substrate top side and contacting a lateral surface of the electronic device. The substrate comprises a conductive structure and a dielectric structure that extends comprising a protrusion in contact with the encapsulant. The conductive structure comprises a lead comprising a lead flank, the lead flank comprising a cavity and a conductive coating on a surface of the lead in the cavity. The conductive structure comprises a pad exposed at the substrate top side, embedded in the dielectric structure, and adjacent to the protrusion, to electrically couple with the electronic device via a first internal interconnect. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: March 22, 2022
    Publication date: July 7, 2022
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Won Bae Bang, Kwang Seok Oh, George Scott
  • Patent number: D1018848
    Type: Grant
    Filed: November 4, 2019
    Date of Patent: March 19, 2024
    Assignee: Cilag GmbH International
    Inventor: Gregory George Scott
  • Patent number: D1026464
    Type: Grant
    Filed: December 31, 2021
    Date of Patent: May 14, 2024
    Inventor: George Scott Grafer