Patents by Inventor George Sorensen
George Sorensen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11534765Abstract: Embodiments can provide a test tube vacuum retainer system, comprising an outer body comprising a midline plate; one or more side walls, a bottom wall, and a top plate comprising an access hole; a test tube holder comprising a sealant ring; a base; and a vacuum tube comprising an external outlet; wherein the test tube holder is secured within the outer body to the base, which in turn is secured to the midline plate; wherein the vacuum tube is connected to the test tube holder at a first end, and the external outlet is configured to be connected to a vacuum pump configured to apply a vacuum force to the test tube holder when a test tube is inserted into the access hole and placed onto the test tube holder.Type: GrantFiled: September 10, 2018Date of Patent: December 27, 2022Assignee: Siemens Healthcare Diagnostics Inc.Inventor: George Sorensen
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Publication number: 20200276589Abstract: Embodiments can provide a test tube vacuum retainer system, comprising an outer body comprising a midline plate; one or more side walls, a bottom wall, and a top plate comprising an access hole; a test tube holder comprising a sealant ring; a base; and a vacuum tube comprising an external outlet; wherein the test tube holder is secured within the outer body to the base, which in turn is secured to the midline plate; wherein the vacuum tube is connected to the test tube holder at a first end, and the external outlet is configured to be connected to a vacuum pump configured to apply a vacuum force to the test tube holder when a test tube is inserted into the access hole and placed onto the test tube holder.Type: ApplicationFiled: September 10, 2018Publication date: September 3, 2020Applicant: Siemens Healthcare Diagnostics Inc.Inventor: George Sorensen
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Patent number: 8482120Abstract: A Multi-configuration Processor-Memory device for coupling to a PCB (printed circuit board) interface. The device comprises a substrate that supports multiple configurations of memory components and a processor while having a single, common interface with a PCB interface of a printed circuit board. In a first configuration, the substrate supports a processor and a first number of memory components. In a second configuration, the substrate supports a processor and an additional number of memory components. The memory components can be pre-tested, packaged memory components mounted on the substrate. The processor can be a surface mounted processor die. Additionally, the processor can be mounted in a flip chip configuration, side-opposite the memory components. In the first configuration, a heat spreader can be mounted on the memory components and the processor to dissipate heat.Type: GrantFiled: December 28, 2007Date of Patent: July 9, 2013Assignee: Nvidia CorporationInventors: Behdad Jafari, George Sorensen
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Patent number: 8264851Abstract: A Multi-configuration Processor-Memory device for coupling to a PCB (printed circuit board) interface. The device comprises a substrate that supports multiple configurations of memory components and a processor while having a single, common interface with a PCB interface of a printed circuit board. In a first configuration, the substrate supports a processor and a first number of memory components. In a second configuration, the substrate supports a processor and an additional number of memory components. The memory components can be pre-tested, packaged memory components mounted on the substrate. The processor can be a surface mounted processor die. Additionally, the processor can be mounted in a flip chip configuration, side-opposite the memory components. In the first configuration, a heat spreader can be mounted on the memory components and the processor to dissipate heat.Type: GrantFiled: December 28, 2007Date of Patent: September 11, 2012Assignee: Nvidia CorporationInventors: Behdad Jafari, George Sorensen
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Publication number: 20100103605Abstract: A Multi-configuration Processor-Memory device for coupling to a PCB (printed circuit board) interface. The device comprises a substrate that supports multiple configurations of memory components and a processor while having a single, common interface with a PCB interface of a printed circuit board. In a first configuration, the substrate supports a processor and a first number of memory components. In a second configuration, the substrate supports a processor and an additional number of memory components. The memory components can be pre-tested, packaged memory components mounted on the substrate. The processor can be a surface mounted processor die. Additionally, the processor can be mounted in a flip chip configuration, side-opposite the memory components. In the first configuration, a heat spreader can be mounted on the memory components and the processor to dissipate heat.Type: ApplicationFiled: December 31, 2009Publication date: April 29, 2010Applicant: NVIDIA CORPORATIONInventors: Behdad Jafari, George Sorensen
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Publication number: 20100103604Abstract: A Multi-configuration Processor-Memory device for coupling to a PCB (printed circuit board) interface. The device comprises a substrate that supports multiple configurations of memory components and a processor while having a single, common interface with a PCB interface of a printed circuit board. In a first configuration, the substrate supports a processor and a first number of memory components. In a second configuration, the substrate supports a processor and an additional number of memory components. The memory components can be pre-tested, packaged memory components mounted on the substrate. The processor can be a surface mounted processor die. Additionally, the processor can be mounted in a flip chip configuration, side-opposite the memory components. In the first configuration, a heat spreader can be mounted on the memory components and the processor to dissipate heat.Type: ApplicationFiled: December 30, 2009Publication date: April 29, 2010Applicant: NVIDIA CORPORATIONInventors: Behdad Jafari, George Sorensen
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Publication number: 20080106860Abstract: A Multi-configuration Processor-Memory device for coupling to a PCB (printed circuit board) interface. The device comprises a substrate that supports multiple configurations of memory components and a processor while having a single, common interface with a PCB interface of a printed circuit board. In a first configuration, the substrate supports a processor and a first number of memory components. In a second configuration, the substrate supports a processor and an additional number of memory components. The memory components can be pre-tested, packaged memory components mounted on the substrate. The processor can be a surface mounted processor die. Additionally, the processor can be mounted in a flip chip configuration, side-opposite the memory components. In the first configuration, a heat spreader can be mounted on the memory components and the processor to dissipate heat.Type: ApplicationFiled: December 28, 2007Publication date: May 8, 2008Inventors: Behdad Jafari, George Sorensen
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Publication number: 20080106861Abstract: A Multi-configuration Processor-Memory device for coupling to a PCB (printed circuit board) interface. The device comprises a substrate that supports multiple configurations of memory components and a processor while having a single, common interface with a PCB interface of a printed circuit board. In a first configuration, the substrate supports a processor and a first number of memory components. In a second configuration, the substrate supports a processor and an additional number of memory components. The memory components can be pre-tested, packaged memory components mounted on the substrate. The processor can be a surface mounted processor die. Additionally, the processor can be mounted in a flip chip configuration, side-opposite the memory components. In the first configuration, a heat spreader can be mounted on the memory components and the processor to dissipate heat.Type: ApplicationFiled: December 28, 2007Publication date: May 8, 2008Inventors: Behdad Jafari, George Sorensen
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Patent number: 7341490Abstract: Embodiments of methods and apparatus for plating a PCI Express edge connector are described. In one embodiment, a printed circuit board having connectors is employed for electroplating one or more of the connectors formed thereon. The printed circuit board comprises a substrate having one or more layers, and a plurality of connectors formed on one or more of the layers, wherein at least one connector includes at least one short pin and at least one extra pin. The at least one extra pin extends beyond an outer shape of the printed circuit board after fabrication. The printed circuit board also includes connection circuitry formed on one or more of the layers, wherein the connection circuitry is configured to electrically connect the short pin with the extra pin at least during electroplating of said short pin.Type: GrantFiled: February 6, 2007Date of Patent: March 11, 2008Inventors: Bruce Michaud, Peter Ammann, George Sorensen
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Publication number: 20070128911Abstract: Embodiments of methods and apparatus for plating a PCI Express edge connector are described. In one embodiment, a printed circuit board having connectors is employed for electroplating one or more of the connectors formed thereon. The printed circuit board comprises a substrate having one or more layers, and a plurality of connectors formed on one or more of the layers, wherein at least one connector includes at least one short pin and at least one extra pin. The at least one extra pin extends beyond an outer shape of the printed circuit board after fabrication. The printed circuit board also includes connection circuitry formed on one or more of the layers, wherein the connection circuitry is configured to electrically connect the short pin with the extra pin at least during electroplating of said short pin.Type: ApplicationFiled: February 6, 2007Publication date: June 7, 2007Inventors: Bruce Michaud, Peter Ammann, George Sorensen
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Patent number: 7192312Abstract: Embodiments of methods and apparatus for plating a PCI Express edge connector are described. In one embodiment a printed circuit board having connectors is employed for electroplating one or more of the connectors formed thereon. The printed circuit board comprises a substrate having one or more layers, and a plurality of connectors formed on one or more of the layers, wherein at least one connector includes at least one short pin and at least one extra pin. The at least one extra pin extends beyond an outer shape of the printed circuit board after fabrication. The printed circuit board also includes connection circuitry formed on one or more of the layers, wherein the connection circuitry is configured to electrically connect the short pin with the extra pin at least during electroplating of said short pin.Type: GrantFiled: April 30, 2004Date of Patent: March 20, 2007Inventors: Bruce Michaud, Peter Ammann, George Sorensen
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Patent number: 7126826Abstract: The present invention represents a significant advancement in the field of thermal solutions for computer hardware. In one embodiment, a quick-connect system for cooling a heat-generating electronic device is provided. The electronic device is mounted to a first side of a circuit board. The system includes a first plate having an opening and configured to be coupled to the first side of the circuit board. The system further includes a second plate disposed within the opening and coupled to the first plate with a first suspension system, wherein the first suspension system is configured to enable the second plate to be disposed substantially flat against the electronic device when the first plate is coupled to the first side of the circuit board. The system further includes a cooling module thermally coupled to the second plate and configured to dissipate heat transferred from the electronic device to the second plate.Type: GrantFiled: October 6, 2004Date of Patent: October 24, 2006Assignee: NVIDIA CorporationInventors: George A. Sorensen, Bruce R. Michaud
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Patent number: 7077679Abstract: This clip is used to secure a connection bridge onto the top edge of two graphics adaptor cards. It works by securing with a screw through the graphics adaptor card bracket that when tightened, applied downward pressure onto the bridge. The pressure is created by the bump above the screw boss; when the screw is tightened the bump acts as a pivot point and applied downward force on the other side of the pivot point to the bridge.Type: GrantFiled: December 8, 2004Date of Patent: July 18, 2006Assignee: NVIDIA CorporationInventors: Scott A. Szuba, George A. Sorensen
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Publication number: 20050241848Abstract: Embodiments of methods of plating a PCI Express edge connector are described.Type: ApplicationFiled: April 30, 2004Publication date: November 3, 2005Inventors: Bruce Michaud, Peter Ammann, George Sorensen