Patents by Inventor George Sotiropoulos

George Sotiropoulos has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit mounting for thermal stress relief useable in a multi-chip module
    Patent number: 7521793
    Abstract: Disclosed is a mounting structure for mounting an IC on a substrate, and particularly useful in a Multi-Chip Module (MCM). The mounting structure intervenes between the IC and the MCM substrate, and promotes heat dissipation from the IC. The mounting structure is insulative, and preferably comprises a direct bond to copper (DBC) board. A heat spreading region to which the IC is affixed is formed on a surface of the mounting structure with bond pad areas are around the heat spreading region. The other side of the mounting structure is mounted to the substrate, which also has bond pads. Bond pads on the IC are connected to the bond pad areas on the mounting structure, and the bond pad areas on the mounting structure are further coupled to the bond pads on the substrate. Each of these connections is preferably made by wirebonding. Thermal vias can be used in the mounting structure and/or in the substrate to further promote heat dissipation.
    Type: Grant
    Filed: September 26, 2005
    Date of Patent: April 21, 2009
    Assignee: Temic Automotive of North America, Inc.
    Inventors: Iyad Alhayek, Gerry Bianco, Juergen Broszeit, Gregory R. Gayowsky, Ilko Schmadlak, George Sotiropoulos
  • Integrated circuit mounting for thermal stress relief useable in a multi-chip module
    Publication number: 20070090522
    Abstract: Disclosed is a mounting structure for mounting an IC on a substrate, and particularly useful in a Multi-Chip Module (MCM). The mounting structure intervenes between the IC and the MCM substrate, and promotes heat dissipation from the IC. The mounting structure is insulative, and preferably comprises a direct bond to copper (DBC) board. A heat spreading region to which the IC is affixed is formed on a surface of the mounting structure with bond pad areas are around the heat spreading region. The other side of the mounting structure is mounted to the substrate, which also has bond pads. Bond pads on the IC are connected to the bond pad areas on the mounting structure, and the bond pad areas on the mounting structure are further coupled to the bond pads on the substrate. Each of these connections is preferably made by wirebonding. Thermal vias can be used in the mounting structure and/or in the substrate to further promote heat dissipation.
    Type: Application
    Filed: September 26, 2005
    Publication date: April 26, 2007
    Inventors: Iyad Alhayek, Gerry Bianco, Juergen Broszeit, Gregory Gayowsky, Ilko Schmadlak, George Sotiropoulos