Abstract: An aluminum layered heat shield assembly (30) includes a pair of spaced metallic facing sheets (32) fabricated from an aluminum composition. In the interstitial space between the facing sheets (32), a perforated steel core (34) is formed in the general shape of a zigzag baffle with segments that adjoin and maintain a generally consistent spacing. The perforated steel core (34) is fabricated with non-perforated flanges (42) which project outwardly from between the aluminum facing sheets (32) to establish extensions for attachment to a supporting structure.

Abstract: A gasket assembly and method of manufacture thereof provides a plurality of discrete, interconnected capsule beads spaced from one another. A sealant material is disposed in the capsule beads, such that when the capsule beads are ruptured under an applied clamping force, the gasket material is released from the capsule beads.

Abstract: A gasket assembly and method of manufacture thereof provides a plurality of discrete, interconnected capsule beads spaced from one another. A sealant material is disposed in the capsule beads, such that when the capsule beads are ruptured under an applied clamping force, the gasket material is released from the capsule beads.

Abstract: An aluminum layered heat shield assembly (30) includes a pair of spaced metallic facing sheets (32) fabricated from an aluminum composition. In the interstitial space between the facing sheets (32), a perforated steel core (34) is formed in the general shape of a zigzag baffle with segments that adjoin and maintain a generally consistent spacing. The perforated steel core (34) is fabricated with non-perforated flanges (42) which project outwardly from between the aluminum facing sheets (32) to establish extensions for attachment to a supporting structure.

Abstract: A multi-use gasket assembly includes at least two lobes each having a fluid-conveying opening with an associated axis. Four mounting holes are formed in each of the lobes about the openings. The gasket has symmetry across a plane of symmetry containing the axes of the openings.

Abstract: A system for integrating multiple software modules configured to produce output according to established business rules is provided. The system in one embodiment coordinates the printing of a variety of labels and reports according to a set of complex business rules. Complex output tasks may be distributed to remote computers in a network for optimum efficiency. The system may be configured to comply with one or more standard database connectivity standards in order to provide a generic interface with foreign systems. The method in one embodiment includes acquiring an input, sending a query to a database, retrieving business rules and associated tasks, and building scripts or commands for each task. This Abstract is provided to comply with the rules, which require an abstract to quickly inform a searcher or other reader about the subject matter of the application. This Abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

Abstract: A multi-use gasket assembly includes at least two lobes each having a fluid-conveying opening with an associated axis. Four mounting holes are formed in each of the lobes about the openings. The gasket has symmetry across a plane of symmetry containing the axes of the openings.

Abstract: A lead frame having a plurality of metallic conductors with each conductor having a coined or stamped region near its proximal end but spaced therefrom to provide pressure points to assure substantial even joining of the conductor to semiconductor chip via an insulative adhesive medium. The lead frame, when mounted on the active face of a semiconductor chip, has wires connecting terminals on the major active surface of the semiconductor chip to the bands on selected lead frame conductors. The lead frame on the semiconductor chip and the wires which connect the semiconductor chip terminals to the bands of selected lead frame conductors are then encapsulated with a suitable insulative material to form a semiconductor module or package.

Abstract: A process of Pb/Sn evaporation eliminates haloes in the manufacture of solder bump interconnects. This robust process of forms solder bump interconnects and reduces critical molebdnum mask sensitivity. Vacuum evaporation through which Pb/Sn C4 pads are deposited is performed by maintaining parallel temperature gradients between the molybdenum mask and silicon wafer, thus resulting in elimination of connecting haloes and yield losses.