Abstract: The subject invention relates to a method of production of fiberglass reinforced resin plate type semi-conductor diodes, by which the lead wiring of semi-conductor diode is directly included in the production of fiberglass reinforced resin (FRP) foundation plate, to supersede conventional lead frame, to enable the designing of any styles to suit actual needs, and with the design of connecting holes, several layers of different circuits can be connected to comprise 3-dimensional multi-layer circuits.

Abstract: A ceramic chip form semiconductor diode fabrication method including the steps of:i) making a plate-like ceramic body element having a diode die mounting site, then covering a conductive layer on the body element for processing into conductor elements;ii) attaching a diode die to said diode die mounting site, then applying a glass powder paste in the gap between said diode die mounting site and said diode die, and then heat processing said glass powder paste into a glass joint;iii) processing the conductive layer into two conductor elements at two opposite electrode surfaces of the diode die, permitting the conductor elements to be respectively extended to two opposite ends of the body element to form a respective terminal for external connection; and iv) covering an over glaze over the diode die and the conductor elements to finish the package.

Abstract: A method of making a semiconductor diode including the steps of: i) stamping a sheet form metal to form a conductor element having a jumper electrode and a bottom electrode, bending connecting strips between the electrodes into a corrugated configuration so that the tip of the jumper electrode is over the bottom electrode, and placing a diode chip in between the tip and the bottom electrode; ii) soldering two opposite sides of the diode chip to the jumper electrode and the bottom electrode; iii) chemically etching the diode chip by an etchant, oxidizing the diode chip by an oxidizer, and applying the diode chip with a P-N junction protecting material and drying it by heating; iv) filing a sealing resin in the chip cavity of a multi-layer substrate board and applying the substrate board with a bonding agent, and attaching diode chip and conductor element subassembly to the substrate board and bending terminal portions of the conductor element to form terminals; v) applying a layer of bonding agent over a cover