Patents by Inventor George V. Ives

George V. Ives has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating a laminated substrate assembly chips-first multichip module
    Patent number: 5564181
    Abstract: A laminated substrate assembly chip first multichip module and a method of making it includes a plurality of electronic components thinned to a predetermined thickness and mounting them on a fiat substrate in a precise position and orientation; a mechanical spacer layer including a cured film and an adhesive bonded to the flat surface of the substrate surrounding the components; the mechanical spacer layer having a thickness approximately equal to the predetermined thickness of the components and a pattern of holes in it corresponding with the precise position and orientation of the components mounted on the substrate; and a cover layer bonded over the mechanical layer and the tops of the components.
    Type: Grant
    Filed: April 18, 1995
    Date of Patent: October 15, 1996
    Assignee: Draper Laboratory, Inc.
    Inventors: Andrew Dineen, George V. Ives